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quality General Purpose Multilayer Ceramic Capacitors Chinocera HGC0402G0100J500NTEJ for Consumer Electronics factory
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quality General Purpose Multilayer Ceramic Capacitors Chinocera HGC0402G0100J500NTEJ for Consumer Electronics factory
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Specifications
Voltage Rating:
50V
Capacitance:
10pF
Temperature Coefficient:
C0G
Tolerance:
±5%
Mfr. Part #:
HGC0402G0100J500NTEJ
Package:
0402
Key Attributes
Model Number: HGC0402G0100J500NTEJ
Product Description

Product Overview

The Hongming Huaci Technology Multilayer Ceramic Capacitors (MLCC) are designed for high-density, high-efficiency surface-mount applications. These general-purpose series capacitors are available in a wide range of sizes from 0201 to 1210 and offer excellent electrical performance and high reliability. They are constructed with NP0 (C0G, C0H), X7R, X5R, X7S, and X6S dielectric materials. Ideal for general digital circuits, power supply bypass, consumer electronics, and telecommunication industries, these capacitors provide high capacity in small sizes.

Product Attributes

  • Brand: Hongming Huaci Technology
  • Series: General Purpose Series (4V~63V)
  • Origin: Suining Hongming Huaci Technology Co., Ltd.
  • Dielectric Materials: NP0 (C0G/C0H), X7R, X5R, X7S, X6S

Technical Specifications

Section Details
General Information
  • Supplier: Suining Hongming Huaci Technology Co., Ltd.
  • Issue Date: 20201116
  • Product Name: Multilayer Ceramic Capacitors
  • Series: General Purpose Series (4V~63V)
  • Specification: 0201 ~ 1210 Size
Product Features
  • Wide selection of sizes: 0201 to 1210 available.
  • High capacity achievable in small sizes.
Applications
  • General digital circuits
  • Power supply bypass capacitors
  • Consumer electronics
  • Telecommunication industry
How to Order (Part Number Structure) HGC (Series) + Size + Dielectric + Capacitance + Tolerance + Rated Voltage + Termination + Packaging + Thickness Code + Reel Size
Temperature Coefficient / Characteristics
Dielectric Reference Temp. Temp. Coefficient Operating Temp. Range
C0G 20C 30 ppm/ -55C125C
C0H 20C 60 ppm/ -55C125C
X7R 20C 15% -55C125C
X5R 20C 15% -55C85C
X7S 20C 22% -55C125C
X6S 20C 22% -55C105C
External Dimensions (Sample)
Size (Inch/mm) Length L (mm) Width W (mm) Thickness T (mm)
0201 (0603) 0.600.03 0.300.03 0.300.03
0402 (1005) 1.000.05 0.500.05 0.500.05
0603 (1608) 1.600.20 0.800.20 0.800.20
0805 (2012) 2.000.20 1.250.20 0.700.10
1206 (3216) 3.200.20 1.600.20 0.700.10
1210 (3225) 3.200.30 2.500.30 1.250.20
Packaging Standard Quantity
Size Thickness (mm) Paper Tape (7" reel) Plastic Tape (7" reel)
0201 (0603) 0.300.03 15,000 -
0402 (1005) 0.500.05 10,000 -
0603 (1608) 0.800.20 4000 -
0805 (2012) 0.700.10 4000 -
0805 (2012) 0.800.20 4000 -
0805 (2012) 1.250.20 - 2000/3000
1206 (3216) 0.700.10 4000 -
1206 (3216) 0.800.20 4000 -
1206 (3216) 1.000.10 - 3000
1206 (3216) 1.250.20 - 3000
1206 (3216) 1.600.20 - 2000
1210 (3225) 1.250.20 - 2000
1210 (3225) 1.600.20 - 2000
1210 (3225) 2.000.20 - 2000
1210 (3225) 2.500.30 - 1000
Capacitance Range and Rated Voltage (Sample)
Dielectric Size Rated Voltage (VDC) Capacitance
C0G/C0H 0201 16, 25, 50 0.3pF to 0.10F
0402 25, 50 0.3pF to 0.12F
0603 25, 50 0.3pF to 0.12F
0805 25, 50 0.3pF to 0.12F
X7R 0201 6.3, 10, 16, 25, 50 100pF to 0.10F
0402 6.3, 10, 16, 25, 50 100pF to 0.12F
0603 6.3, 10, 16, 25, 50 100pF to 0.15F
0805 6.3, 10, 16, 25, 50 100pF to 1.0F
X7S 0402 6.3, 10, 16, 25 1.0F to 22F
X5R 0201 6.3, 10, 16, 25, 50 100pF to 0.10F
X5R 0402 6.3, 10, 16, 25, 50 100pF to 0.15F
X5R 0603 6.3, 10, 16, 25, 35, 50 100pF to 0.22F
X5R 0805 6.3, 10, 16, 25, 35, 50 100pF to 0.47F
X5R 1206 6.3, 10, 16, 25, 35, 50 100pF to 1.0F
X5R 1210 4, 6.3, 10, 16, 25, 35, 50 100pF to 220F
X6S 0402 6.3, 10, 16, 25 0.10F to 0.47F
X6S 0603 4, 6.3, 10, 16, 25 0.10F to 0.68F
X6S 0805 4, 6.3, 10, 16, 25, 50 0.10F to 1.0F
X6S 1206 4, 6.3, 10, 16, 25, 50 0.10F to 10F
X6S 1210 4, 6.3, 10, 16, 25, 50 0.10F to 220F
Reliability Test (Sample)
No. Item Technical Requirements Test Method
1 Appearance No remarkable defects or abnormalities. Through microscope (10)
2 Size Within the specified size range. Using a vernier caliper
3 Capacitance Should be within the specified tolerance. Test Temp: 253C; Conditions vary by dielectric and capacitance.
4 Dissipation Factor (DF, tan) Refer to specifications for Class I and Class II. Test Temp: 253C; Conditions vary by dielectric and capacitance.
5 Insulation Resistance (IR) Refer to specifications for Class I and Class II. Test Temp: 253C; Humidity: 75%
6 Dielectric Withstanding Voltage (DWV) No breakdown or damage. Class I: 300% Rated voltage; Class II: 250% Rated voltage. Duration: 1~5s.
7 Solderability At least 95% of the terminal electrode is covered by new solder. No visible damage. Lead-free: 2455C, 20.5s; Leaded: 2355C, 20.5s.
8 Termination Adhesion No visible damage. Force applied varies by size (2N to 10N). Time: 101s.
9 Resistance to Soldering Heat Electrical performance and appearance requirements met. Preheating, Solder Temp: 2655C, Duration: 101s. Recovery: 242h.
10 Resistance to Flexure of Substrate C/C: 10%; Appearance: No visible damage. PCB Thickness: 1.60.2mm, Flexure: 1mm.
11 Moisture Resistance (Steady State) C/C: Class I: 2% or 1pF; Class II: 10%. DF, IR, Appearance requirements met. Temp: 402C, Humidity: 90%~95%RH, Duration: 500h. Recovery: 242h.
12 Temperature Cycle C/C: Class I: 1% or 1pF; Class II: 10%. 5 cycles. Temp range: -55C to +125C (varies by dielectric).
13 Durability C/C: Class I: 2% or 1pF; Class II: 20%. DF, IR, Appearance requirements met. Applied Voltage: 1.5x Rated Voltage. Duration: 1000h. Temp: 85C to 125C (varies by dielectric).
Packaging Details
Section Details
Paper Taping Dimensions Dimensions provided for 0201, 0402, 0603, 0805, 1206 types.
Embossed Taping Dimensions Dimensions provided for 0805~1812 types.
Reel Dimensions Available for 7" and 13" reels (8mm, 12mm width tape).
Taping Specification Top tape peeling strength: 0.1N < peeling strength < 0.7N.
Storage Methods
  • Guaranteed solderability period: 6 months (under delivered package condition).
  • Storage Temperature: 5C~40C
  • Storage Relative Humidity: 20%~70%
Precautions For Use
  • MLCCs may fail in short or open circuits. Severe conditions can lead to burn out, flaming, or explosion.
  • Adhere to specifications and contact technical support for clarification.
  • Soldering conditions and temperature profiles must be followed to prevent cracking or explosion.
  • Manual soldering requires careful operation, tip selection, and temperature control to avoid thermal shock.
  • Use optimum solder amounts for reflow and wave soldering to ensure proper connection and prevent damage.
Recommended Soldering Temperature Profile
  • Reflow Soldering: Profiles provided for SnPb and Lead-free. Temperature differential (T) should be minimized (150C for most sizes, 130C for HGC1210).
  • Wave Soldering: Profile provided. Temperature differential (T) should be minimized (150C for HGC0603/0805/1206).
  • Hand Soldering: Conditions specified: Preheating 130C, Max Temp: 350C, Power: 20W, Tip Diameter: 1mm recommended, Duration: Max 3s. Avoid direct contact with ceramic components.
Typical Characteristic Data Graph
  • |Z|-Frequency Characteristics Curve
  • Temperature Characteristics
  • DC Bias Characteristics

Note: The above product characteristics are for reference only.

2410121645_Chinocera-HGC0402G0100J500NTEJ_C482482.pdf

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