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quality Multilayer ceramic capacitors Chinocera HHV1206R7102K102NSLJ designed for high density and high voltage SMT applications factory
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quality Multilayer ceramic capacitors Chinocera HHV1206R7102K102NSLJ designed for high density and high voltage SMT applications factory
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Specifications
Voltage Rating:
1kV
Capacitance:
1nF
Temperature Coefficient:
X7R
Tolerance:
±10%
Mfr. Part #:
HHV1206R7102K102NSLJ
Package:
1206
Key Attributes
Model Number: HHV1206R7102K102NSLJ
Product Description

Product Overview

The Suining Hongming Huaci Technology Co., Ltd. offers a series of Mid-High Voltage Multilayer Ceramic Capacitors (MLCCs) designed for high-density, high-efficiency surface mount applications. These capacitors are constructed with NP0 (C0G/C0H) and X7R dielectrics, providing superior electrical performance and high reliability. They are suitable for a wide range of applications including analog and digital modems, LAN/WAN interfaces, voltage multipliers, DC-DC converters, and back-lighting inverter circuits. Key features include high voltage capability in a given case size and high stability.

Product Attributes

  • Brand: Suining Hongming Huaci Technology Co., Ltd.
  • Series: Mid-High Volts Series (100V~3000V)
  • Materials: NP0 (C0G/C0H), X7R

Technical Specifications

Specification Details
Product Name Multilayer Ceramic Capacitors
Series Mid-High Volts Series (100V~3000V)
Specification (Size) 0402 ~ 1812
Description High voltage ceramic capacitors for high density and high efficiency SMT application. Available in NP0(C0G/C0H)/X7R dielectrics with high reliability and excellent electrical performance.
Features High voltage in a given case size; High stability and reliability.
Applications Analog & Digital Modems, LAN/WAN Interface, Voltage Multipliers, DC-DC Converters, Back-lighting Inverters.
How to Order (Example: HHV1206R7102K202NSL)
  • Series: HHV (High Voltage)
  • Size: 0402 (1005) to 1812 (4532)
  • Dielectric: R7 (X7R), G0 (C0G), H0 (C0H), etc.
  • Capacitance: 102 (1000pF), 103 (10nF), 104 (100nF), etc.
  • Tolerance: K (10%), J (5%), M (20%), etc.
  • Rated Voltage: 202 (2000 Vdc), 101 (100 Vdc), 302 (3000 Vdc), etc.
  • Termination: N (Cu/Ni/Sn)
  • Packaging: T (Paper taping), B (Bulk), S (Embossed taping)
  • Thickness Symbol: E (0.5mm), H (0.8mm), L (1.25mm), P (1.6mm), U (2.0mm), V (2.5mm)
  • Reel Size: J (7Inch), D (13Inch)
Temperature Coefficient / Characteristics
  • C0G: 30 ppm/, -55125
  • C0H: 60 ppm/, -55125
  • X7R: 15%, -55125
  • X7S: 22%, -55125
External Dimensions (Example: 0402)
Size (Inch/mm)Length L (mm)Width W (mm)Thickness T (mm)/SymbolSoldering MethodMB (mm)
0402 (1005)1.000.050.500.050.500.05 ER0.250.10
0603 (1608)1.600.200.800.200.800.20 HR / W0.400.15
0805 (2012)2.000.201.250.200.700.10 G / 0.800.20 H / 1.250.20 LR / W0.500.20
1206 (3216)3.200.201.600.200.800.20 H / 1.000.10 J / 1.250.20 L / 1.600.20 PR / W0.600.20
1210 (3225)3.200.302.500.201.250.20 L / 1.600.20 P / 2.000.20 U / 2.500.20 VR0.750.25
1808 (4520)4.50.402.00.251.250.20 L / 1.600.20 P / 2.000.20 UR0.750.25
1812 (4532)4.50.403.20.301.250.20 L / 1.600.20 P / 2.000.20 U / 2.500.30 VR0.750.25
Note: R=Reflow Soldering, W=Wave Soldering
Packaging Standard Quantity (Example: 0402, 0.500.05mm Thickness E) Paper tape: 10,000 pcs
Capacitance Range and Rated Voltage (Example: C0G/C0H Dielectric, 0805 Size) See detailed tables in the original document for specific combinations of dielectric, size, rated voltage, and capacitance.
Reliability Test - Appearance and Electrical Performance
  • Appearance: No remarkable defects or abnormalities.
  • Size: Within specified range.
  • Capacitance: Within specified tolerance. (Test conditions vary by dielectric type and capacitance value).
  • Dissipation Factor (DF): Specified limits for Class I and Class II.
  • Insulation Resistance (IR): Specified limits for Class I and Class II.
Reliability Test - General
  • Dielectric Withstanding Voltage (DWV): No breakdown or damage under specified voltage and duration.
  • Solderability: At least 95% terminal electrode covered by new solder; no visible damage.
  • Termination Adhesion: No visible damage under applied force.
  • Resistance to Soldering Heat: Electrical performance within limits, appearance no visible damage, solderability 95%.
  • Resistance to Flexure of Substrate: C/C 10%, no visible damage.
  • Moisture Resistance (Steady State): C/C within specified limits, DF 2x initial, IR within specified limits, no visible damage.
  • Temperature Cycle: C/C within specified limits.
  • Durability: C/C within specified limits, DF 2x initial, IR within specified limits, no visible damage.
Storage Method
  • Guaranteed Period for Solderability: 6 months (under delivered package condition).
  • Storage Conditions: Temperature 5~40, Relative Humidity 20%~70%.
Precautions For Use
  • MLCCs may fail in short or open circuit. Extreme conditions can lead to burn out, flaming, or explosion. Adhere to specifications and contact technical department for clarification.
  • Soldering Conditions: Follow temperature profile charts to avoid chip cracking or local explosion due to sudden temperature changes.
  • Manual Soldering: Handle with care to avoid thermal cracks. Avoid direct contact of soldering iron tip with ceramic body.
  • Solder Amount: Use optimum solder amount to avoid chip damage or poor connection.
  • Soldering Temperature Profile: Recommended profiles for Reflow Soldering (SnPb and Lead-free) and Wave Soldering are provided. Temperature differential (T) limits are specified for different series.
  • Hand Soldering Conditions: Preheating, soldering iron temperature, power, tip diameter, and soldering time are specified. Avoid direct contact between soldering iron head and ceramic components.

2410121646_Chinocera-HHV1206R7102K102NSLJ_C571055.pdf

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