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Specifications
Voltage Rating:
200V
Capacitance:
330pF
Temperature Coefficient:
X7R
Tolerance:
±10%
Mfr. Part #:
HHV0603R7331K201NTHJ
Package:
0603
Key Attributes
Model Number:
HHV0603R7331K201NTHJ
Product Description
Product Overview
The Multi-Layer Ceramic Capacitors (MLCC) from are designed for high-density, high-efficiency surface-mount applications. These capacitors are manufactured using NP0 (C0G, C0H) and X7R dielectric materials, offering superior electrical performance and high reliability. They are characterized by high voltage in a given case size and high stability. Key applications include analog and digital modems, LAN/WAN interface circuits, voltage multipliers, DC-DC converters, and back-lighting inverter circuits.
Product Attributes
- Brand: HHV
- Manufacturer:
- Origin: China
- Dielectric Materials: NP0 (C0G/C0H), X7R, X7S, X7T, X8R, X5R, X6R, X6S
- Termination Types: Cu/Ni/Sn
- Packaging Options: Paper Taping, Bulk, Embossed Taping
Technical Specifications
| Series | Series Name | Size (Inch/mm) | Rated Voltage (Vdc) | Capacitance Range | Tolerance | Dielectric Characteristics |
|---|---|---|---|---|---|---|
| HHV | Mid-High Volts Series (100V~3000V) | 0402 (1005) to 1812 (4532) | 100V to 3000V | 0.5pF to 4.7F (Varies by dielectric and size) | 0.05pF to 50% (S) |
|
Product Features
- High voltage in a given case size.
- High stability and reliability.
External Dimensions (Example: 0402)
| Size (Inch/mm) | Length L (mm) | Width W (mm) | Thickness T (mm)/Symbol | Soldering Method |
|---|---|---|---|---|
| 0402 (1005) | 1.000.05 | 0.500.05 | 0.500.05 / E | Reflow Soldering (R) |
| 0603 (1608) | 1.600.20 | 0.800.20 | 0.800.20 / H | Reflow Soldering (R) / Wave Soldering (W) |
Packaging Standard Quantity
| Size (Inch/mm) | Thickness (mm)/Symbol | Paper Tape (7" reel) | Plastic Tape (7" reel) |
|---|---|---|---|
| 0402 (1005) | 0.500.05 / E | 10,000 | - |
| 0603 (1608) | 0.800.20 / H | 4000 | - |
Reliability Test Summary
| No. | Item | Technical Requirements |
|---|---|---|
| 6 | Dielectric Withstanding Voltage (DWV) | No breakdown or damage. Applied voltage varies based on rated voltage (e.g., 200% for 100VVr500V for 5s). |
| 7 | Solderability | At least 95% of the terminal electrode is covered by new solder. No visible damage. |
| 8 | Termination Adhesion | No visible damage. Applied force: 5N (0402-0805), 10N (1206). |
| 9 | Resistance to Soldering Heat | Electrical performance and appearance requirements met. C/C: 0.5% (NPO), -5%~+10% (X7R). |
| 10 | Resistance to Flexure of Substrate (Bending Strength) | C/C: 10%. Appearance: No visible damage. |
| 11 | Moisture Resistance (Steady State) | C/C: 2% or 1pF (Class I), 10% (X7R). IR: Varies by class and capacitance. |
| 12 | Temperature Cycle | C/C: 1% or 1pF (Class I), 10% (X7R). Tested over 5 cycles (-55C to +125C). |
| 13 | Durability | C/C: 2% or 1pF (Class I), 20% (X7R). Tested at 125C for 1000 hours with applied voltage. |
Storage & Handling
- Storage Period: 6 months (guaranteed solderability under delivered package conditions).
- Storage Conditions: Temperature: 5C~40C, Relative Humidity: 20%~70%.
- Precautions for Use: MLCCs can fail in short or open circuits. Avoid operating beyond specified conditions to prevent potential hazards like fire or explosion. Follow safety precautions and consult technical support for any uncertainties.
- Soldering Conditions: Adhere to recommended temperature profiles (reflow, wave, manual) to prevent chip cracking or damage due to thermal shock. Use appropriate solder amounts and avoid direct contact of soldering iron with the ceramic body.
2410121646_Chinocera-HHV0603R7331K201NTHJ_C5186708.pdf
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