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quality High Density SMT Multilayer Ceramic Capacitors Chinocera HGC0603G0330J500NTHJ General Purpose Series factory
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quality High Density SMT Multilayer Ceramic Capacitors Chinocera HGC0603G0330J500NTHJ General Purpose Series factory
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Specifications
Voltage Rating:
50V
Capacitance:
33pF
Temperature Coefficient:
C0G
Tolerance:
±5%
Mfr. Part #:
HGC0603G0330J500NTHJ
Package:
0603
Key Attributes
Model Number: HGC0603G0330J500NTHJ
Product Description

Product Overview

The Hongming Huaci Multilayer Ceramic Capacitors (MLCC) General Purpose Series (4V~63V) are designed for high-density and high-efficiency SMT applications. These capacitors are manufactured using NP0 (C0G, C0H), X7R, X5R, X7S, and X6S dielectric materials, offering excellent electrical performance and high reliability. They are available in a wide range of sizes from 0201 to 1210, providing high capacitance in compact dimensions. Key applications include general digital circuits, power supply bypass, consumer electronics, and the telecommunication industry.

Product Attributes

  • Brand: Hongming Huaci
  • Manufacturer: Suining Hongming Huaci Ceramic Technology Co., Ltd.
  • Series: General Purpose Series (4V~63V)
  • Dielectric Materials: NP0 (C0G/C0H), X7R, X5R, X7S, X6S

Technical Specifications

Category Specification Details
Part Name Multilayer Ceramic Capacitors
Series General Purpose Series (4V~63V)
Specification 0201 ~ 1210 Size
General Info Suitable for high density and high efficiency SMT application.
Features Wide size selection (0201 to 1210), High capacity in small size.
Applications General digital circuit, Power supply bypass, Consumer electronics, Telecommunication.
Model Designation HGC [Size] [Dielectric] [Capacitance] [Tolerance] [Rated Voltage] [Termination] [Packaging] [Thickness Code] [Reel Size] Refer to detailed breakdown in document.
Temperature Coefficient / Characteristics
  • C0G: 0 30 ppm/ (-55125)
  • C0H: 0 60 ppm/ (-55125)
  • X7R: 15% (-55125)
  • X5R: 15% (-5585)
  • X7S: 22% (-55125)
  • X6S: 22% (-55105)
External Dimensions (mm)
Size (Inch/mm)Length LWidth WThickness T
0201 (0603)0.600.030.300.030.300.03
0402 (1005)1.000.050.500.050.500.05
0603 (1608)1.600.200.800.200.800.20
0805 (2012)2.000.201.250.200.700.10
1206 (3216)3.200.201.600.200.700.10
1210 (3225)3.200.302.500.301.250.20
Soldering Method: R=Reflow, W=Wave
Packaging Standard Quantity See detailed table in document for Paper tape and Plastic tape quantities per reel size.
Capacitance Range and Rated Voltage Detailed tables provided for C0G/C0H, X7R, X7S, X5R, X6S dielectrics across various sizes and voltages.
Reliability Test Includes tests for Appearance, Size, Capacitance, Dissipation Factor, Insulation Resistance, Dielectric Withstanding Voltage, Solderability, Termination Adhesion, Resistance to Soldering Heat, Resistance to Flexure, Moisture Resistance, Temperature Cycle, and Durability. Refer to detailed requirements and test methods in document.
Storage Methods Guaranteed solderability period of 6 months. Storage Conditions: Temperature 5~40, Relative Humidity 20%~70%.
Precautions for Use MLCCs may fail in short or open circuit. Risk of fire, burning, or explosion under severe conditions. Follow specifications and contact technical department for clarification.
Soldering Conditions Recommended temperature profiles for Reflow Soldering (Lead/Lead-free), Wave Soldering, and Hand Soldering. Optimal solder amounts and temperature differentials (T) specified. Refer to detailed graphs and tables in document.
Typical Characteristic Data Includes |Z|-Frequency Characteristics, Temperature Characteristics, DC Bias Characteristics. Note: Characteristics are for reference only.

2410121645_Chinocera-HGC0603G0330J500NTHJ_C465159.pdf

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