Product Overview
The Multi-layer Ceramic Capacitors (MLCC) from Suining Hongming Huaci Technology Co., Ltd. are designed for high-density, high-efficiency surface-mount applications. These capacitors are manufactured using NP0 (C0G, C0H) and X7R materials, offering superior electrical performance and high reliability. They are suitable for mid-to-high voltage series, ranging from 100V to 3000V, with case sizes from 0402 to 1812. Key features include high voltage in a given case size, high stability, and reliability. Applications span analog and digital modems, LAN/WAN interfaces, voltage multipliers, DC-DC converters, and back-lighting inverter circuits.
Product Attributes
- Brand: HHV
- Manufacturer: Suining Hongming Huaci Technology Co., Ltd.
- Series: Mid-High Volts Series (100V~3000V)
- Dielectric Materials: NP0 (C0G/C0H), X7R, X5R, X6R, X6S, X7S, X7T, X8R
- Termination Types: Cu/Ni/Sn
- Packaging Options: Paper taping, Bulk, Embossed taping
Technical Specifications
| Specification | Details |
|---|---|
| Series | HHV (Mid-High Volts Series) |
| Voltage Range | 100V to 3000V DC |
| Case Sizes (Inch/mm) | 0402 (1005), 0603 (1608), 0805 (2012), 1206 (3216), 1210 (3225), 1808 (4520), 1812 (4532) |
| Dielectric Types & Temperature Coefficients |
|
| Capacitance Range | 0.5pF to 100F (varies by dielectric and size) |
| Tolerance Levels | 0.05pF, 0.1pF, 0.25pF, 0.5pF, 1%, 2%, 5%, 10%, 15%, 20%, -20%~+50% |
| Rated Voltages (Vdc) | 100, 200, 250, 500, 630, 1000, 1500, 2000, 2500, 3000 |
| Termination Types | Cu/Ni/Sn (N) |
| Packaging | Paper taping (T), Bulk (B), Embossed taping (S) |
| Reel Sizes | 7 Inch (J, K), 13 Inch (D) |
| Thickness Symbols & Dimensions (mm) | A=0.1, B=0.2, C=0.3, D=0.4, E=0.5, F=0.6, G=0.7, H=0.8, J=1.0, L=1.25, P=1.6, U=2.0, V=2.5, W=3.0 |
| Soldering Methods | Reflow Soldering (R), Wave Soldering (W) |
| Reliability Tests | Appearance, Dimensions, Capacitance, Dissipation Factor (DF), Insulation Resistance (IR), Dielectric Withstanding Voltage (DWV), Solderability, Termination Adhesion, Resistance to Soldering Heat, Resistance to Flexure, Moisture Resistance, Temperature Cycle, Durability. |
| Storage Conditions | Temperature: 5~40, Relative Humidity: 20%~70% |
| Guaranteed Solderability Period | 6 months (under delivered package condition) |
2410121646_Chinocera-HHV0603R7103K101NTHJ_C5186688.pdf
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