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Specifications
Voltage Rating:
50V
Capacitance:
2pF
Temperature Coefficient:
C0G
Mfr. Part #:
HGC0805G02R0C500NTGJ
Package:
0805
Key Attributes
Model Number:
HGC0805G02R0C500NTGJ
Product Description
Product Overview
The HGC General Purpose Series Multilayer Ceramic Capacitors (MLCCs) are designed for high-density and high-efficiency surface mount technology (SMT) applications. Manufactured with NP0 (C0G/C0H), X7R, X5R, X7S, and X6S dielectrics, these capacitors offer excellent electrical performance and high reliability. They are available in a wide range of sizes from 0201 to 1210, providing high capacitance in compact dimensions. Key applications include general digital circuits, power supply bypass, consumer electronics, and the telecommunication industry.
Product Attributes
- Brand: HGC
- Supplier: Suining Hongming Huaci Technology Co., Ltd.
- Series: General Purpose Series (4V~63V)
- Dielectric Materials: NP0 (C0G/C0H), X7R, X5R, X7S, X6S
Technical Specifications
| Category | Specification | Details |
|---|---|---|
| Product Name | Multilayer Ceramic Capacitors | HGC Series |
| Size Specification | 0201 ~ 1210 Size | |
| Rated Voltage Range | 4V to 63V | (Also includes 100V, 200V, 250V, 500V, 630V, 1k Vdc, etc. as per ordering code) |
| Dielectric Characteristics | C0G (030 ppm/, -55125) | C0H (060 ppm/, -55125) |
| X7R (15%, -55125) | ||
| X5R (15%, -5585) | ||
| X7S (22%, -55125) | ||
| X6S (22%, -55105) | ||
| External Dimensions (Example: 0201) | Length (L) | 0.600.03 mm |
| Width (W) | 0.300.03 mm | |
| Thickness (T) / Symbol | 0.300.03 mm / C | |
| Soldering Method | Reflow Soldering (R), Wave Soldering (W) | |
| Packaging Options | Paper Taping, Embossed Taping, Bulk | Reel Sizes: 7 Inch, 13 Inch |
| Capacitance Range & Voltage | Extensive range available across different dielectrics and sizes (detailed in tables 8-1 to 8-5) | |
| Reliability Testing | Appearance, Size, Capacitance, Dissipation Factor, Insulation Resistance, Dielectric Withstanding Voltage, Solderability, Termination Adhesion, Resistance to Soldering Heat, Moisture Resistance, Temperature Cycle, Durability | Specific requirements and test methods detailed in section 9. |
| Storage Method | Temperature: 5~40, Relative Humidity: 20%~70% | Guaranteed solderability period: 6 months. |
2410121645_Chinocera-HGC0805G02R0C500NTGJ_C5186742.pdf
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