Product Overview
The General Purpose Series Multilayer Ceramic Capacitors (MLCC) from Suining Hongming Huaci Technology Co., Ltd. are designed for high-density, high-efficiency SMT applications. These capacitors are manufactured using NP0 (C0G/C0H), X7R, X5R, X7S, and X6S dielectric materials, offering superior electrical performance and high reliability. Available in a wide range of sizes from 0201 to 1210, they provide high capacitance in compact dimensions, making them suitable for general digital circuits, power supply bypass, consumer electronics, and telecommunication industries.
Product Attributes
- Brand: HGC
- Supplier: Suining Hongming Huaci Technology Co., Ltd.
- Series: General Purpose Series (4V~63V)
- Dielectric Materials: NP0 (C0G/C0H), X7R, X5R, X7S, X6S
Technical Specifications
| Category | Specification | Details |
|---|---|---|
| Series | HGC | General Purpose Series (4V~63V) |
| Size (Inch/mm) | 0201 (0603) to 1210 (3225) | |
| Dielectric | C0G (NP0) | Temperature Coefficient: 0 30 ppm/; Operating Temperature: -55125 |
| Dielectric | C0H | Temperature Coefficient: 0 60 ppm/; Operating Temperature: -55125 |
| Dielectric | X7R | Temperature Coefficient: 15%; Operating Temperature: -55125 |
| Dielectric | X5R | Temperature Coefficient: 15%; Operating Temperature: -5585 |
| Dielectric | X7S | Temperature Coefficient: 22%; Operating Temperature: -55125 |
| Dielectric | X6S | Temperature Coefficient: 22%; Operating Temperature: -55105 |
| Rated Voltage | 4Vdc to 630Vdc (and higher) | See section 8 for detailed breakdown |
| Capacitance Range | 0.3pF to 220F | See section 8 for detailed breakdown |
| Dimensions (L x W x T) | 0201: 0.600.03 x 0.300.03 x 0.300.03 mm | Other sizes available (see section 6-1) |
| Termination | Cu/Ni/Sn (N) | |
| Packaging | Paper Taping (T), Bulk (B), Embossed Taping (S) | Reel sizes: 7 Inch, 13 Inch |
| Soldering Method | Reflow Soldering (R), Wave Soldering (W) | |
| Reliability Test Items | Appearance, Dimensions, Capacitance, DF, IR, DWV, Solderability, Termination Adhesion, Resistance to Soldering Heat, Resistance to Flexure, Moisture Resistance, Temperature Cycle, Durability | See section 9 for detailed requirements and test methods |
| Storage Conditions | Temperature: 5~40, Relative Humidity: 20%~70% | Guaranteed solderability period: 6 months |
2410121645_Chinocera-HGC0805G0560J500NTGJ_C5186758.pdf
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