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Specifications
Voltage Rating:
250V
Capacitance:
47pF
Temperature Coefficient:
C0G
Tolerance:
±5%
Mfr. Part #:
HHV0805G0470J251NTGJ
Package:
0805
Key Attributes
Model Number:
HHV0805G0470J251NTGJ
Product Description
Product Overview
The Multi-Layer Ceramic Capacitors (MLCC) from Suining Hongming Huaci Technology Co., Ltd. are designed for high-density, high-efficiency surface-mount applications. These capacitors are manufactured using NP0 (C0G, C0H) and X7R dielectric materials, offering superior electrical performance and high reliability. They are suitable for a wide range of applications including analog and digital modems, LAN/WAN interfaces, voltage multipliers, DC-DC converters, and back-lighting inverter circuits. Key features include high voltage capability in a given case size, high stability, and reliability.
Product Attributes
- Brand: HHV
- Manufacturer: Suining Hongming Huaci Technology Co., Ltd.
- Series: Mid-High Volts Series (100V~3000V)
- Dielectric Materials: NP0 (C0G/C0H), X7R, X5R, X6R, X6S, X7S, X7T, X8R
- Termination Types: Cu/Ni/Sn
Technical Specifications
| Specification | Details |
|---|---|
| Series | Mid-High Volts Series (100V~3000V) |
| Case Sizes (Inch/mm) | 0402 (1005), 0603 (1608), 0805 (2012), 1206 (3216), 1210 (3225), 1808 (4520), 1812 (4532) |
| Rated Voltages (Vdc) | 100, 200, 250, 500, 630, 1000, 1500, 2000, 2500, 3000 |
| Capacitance Range (Example) | 0.5pF (0R5) to 1.0F (105) (Specific ranges vary by dielectric and size) |
| Tolerance | 0.05pF, 0.1pF, 0.25pF, 0.5pF, 1%, 2%, 5%, 10%, 15%, 20%, -20%~+50% |
| Temperature Coefficients | C0G: 030 ppm/ (-55125) C0H: 060 ppm/ (-55125) X7R: 15% (-55125) |
| Operating Temperature Range | -55 to 125 |
| Packaging Options | Paper taping, Embossed taping, Bulk |
| Reel Sizes | 7 Inch, 13 Inch |
| Dimensions (Example for 0402) | Length: 1.000.05mm, Width: 0.500.05mm, Thickness: 0.500.05mm |
| Soldering Methods | Reflow Soldering, Wave Soldering |
| Reliability Tests | Dielectric Withstanding Voltage, Solderability, Termination Adhesion, Resistance to Soldering Heat, Resistance to Flexure, Moisture Resistance, Temperature Cycle, Durability |
| Storage Conditions | Temperature: 5~40, Relative Humidity: 20%~70% |
| Guaranteed Solderability Period | 6 months (under delivered package condition) |
2410121646_Chinocera-HHV0805G0470J251NTGJ_C5186755.pdf
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