Product Overview
The Suining Hongming Huaci Technology Co., Ltd. offers a series of General Purpose Multilayer Ceramic Capacitors (MLCCs) designed for high-density, high-efficiency SMT applications. These capacitors are manufactured using NP0 (C0G/C0H), X7R, X5R, X7S, and X6S dielectric materials, providing excellent electrical performance and high reliability. Available in a wide range of sizes from 0201 to 1210, these capacitors offer high capacitance in compact dimensions, making them suitable for general digital circuits, power supply bypass, consumer electronics, and telecommunication industries.
Product Attributes
- Brand: HGC
- Supplier: Suining Hongming Huaci Technology Co., Ltd.
- Series: General Purpose Series (4V~63V)
- Dielectric Materials: NP0 (C0G/C0H), X7R, X5R, X7S, X6S
Technical Specifications
| Specification | Details |
|---|---|
| Part Name | Multilayer Ceramic Capacitors |
| Series | General Purpose Series (4V~63V) |
| Specification (Size) | 0201 ~ 1210 |
| Supplier | Suining Hongming Huaci Technology Co., Ltd. |
| Issue Date | 20201116 |
| Model Designation | HGC [Size] [Dielectric] [Capacitance] [Tolerance] [Rated Voltage] [Termination] [Packaging] [Thickness Code] [Reel Size] |
| Available Sizes (inch/mm) | 0201 (0603), 0402 (1005), 0603 (1608), 0805 (2012), 1206 (3216), 1210 (3225) |
| Dielectric Characteristics |
|
| Rated Voltages (VDC) | 4V, 6.3V, 10V, 16V, 25V, 50V, 100V, 200V, 250V, 500V, 630V, 1kV, 1.5kV, 2kV, 2.5kV, 3kV, 4kV, 5kV, 6kV |
| Capacitance Range | 0.3pF to 220F (varies by dielectric and size) |
| Termination Types | Cu/Ni/Sn, Cu/Resin/Ni/Sn |
| Packaging Options | Paper Taping, Bulk Packaging, Embossed Taping |
| Reel Sizes | 7 Inch, 13 Inch |
| Thickness Codes (mm) | 0.1mm (A), 0.2mm (B), 0.3mm (C), 0.4mm (D), 0.5mm (E), 0.6mm (F), 0.7mm (G), 0.8mm (H), 1.0mm (J), 1.25mm (L), 1.6mm (P), 1.8mm (S), 2.0mm (U), 2.5mm (V), 3.0mm (W) |
| External Dimensions (Example: 0201) | L: 0.600.03mm, W: 0.300.03mm, T: 0.300.03mm |
| Soldering Methods | Reflow Soldering (R), Wave Soldering (W) |
| Reliability Tests | Appearance, Size, Capacitance, Dissipation Factor (DF), Insulation Resistance (IR), Dielectric Withstanding Voltage (DWV), Solderability, Termination Adhesion, Resistance to Soldering Heat, Resistance to Flexure of Substrate, Moisture Resistance (Steady State), Temperature Cycle, Durability. |
| Storage Conditions | Temperature: 5~40, Relative Humidity: 20%~70% (Guaranteed solderability for 6 months) |
2410121645_Chinocera-HGC0805R7121K500NTHJ_C5186773.pdf
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