Product Overview
The HGC General Purpose Series Multilayer Ceramic Capacitors (MLCCs) are designed for high-density, high-efficiency surface-mount applications. Available in sizes from 0201 to 1210, these capacitors are manufactured using NP0 (C0G/C0H), X7R, X5R, X7S, and X6S dielectrics, offering excellent electrical performance and high reliability. They are suitable for general digital circuits, power supply bypass, consumer electronics, and telecommunication industries.
Product Attributes
- Brand: HGC
- Supplier: Suining Hongming Huaci Technology Co., Ltd.
- Series: General Purpose Series (4V~63V)
- Dielectric Materials: NP0 (C0G/C0H), X7R, X5R, X7S, X6S
Technical Specifications
| Category | Details | ||||||||||||||||||||||||||||
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
| Part Name | MULTILAYER CERAMIC CAPACITORS | ||||||||||||||||||||||||||||
| Series | General Purpose Series (4V~63V) | ||||||||||||||||||||||||||||
| Specification / Size | 0201 ~ 1210 | ||||||||||||||||||||||||||||
| Supplier | Suining Hongming Huaci Technology Co., Ltd. | ||||||||||||||||||||||||||||
| Issue Date | 20201116 | ||||||||||||||||||||||||||||
| Model Designation | HGC [Size] [Dielectric] [Capacitance] [Tolerance] [Rated Voltage] [Termination] [Packaging] [Thickness Code] [Reel Size] | ||||||||||||||||||||||||||||
| Available Sizes (inch/mm) | 0201 (0603), 0402 (1005), 0603 (1608), 0805 (2012), 1206 (3216), 1210 (3225) | ||||||||||||||||||||||||||||
| Dielectric Types & Characteristics |
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| Rated Voltages (VDC) | 4, 6.3, 10, 16, 25, 50, 100, 200, 250, 500, 630, 1k, 1.5k, 2k, 2.5k, 3k, 4k, 5k, 6k | ||||||||||||||||||||||||||||
| Capacitance Range (Examples) | 0.3pF to 220F (varies by dielectric and size) | ||||||||||||||||||||||||||||
| Dimensions (mm) |
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| Packaging Options | Paper taping (T), Bulk packaging (B), Embossed taping (S) | ||||||||||||||||||||||||||||
| Reel Sizes | 7 Inch (J, K), 13 Inch (D) | ||||||||||||||||||||||||||||
| Soldering Methods | Reflow Soldering (R), Wave Soldering (W) | ||||||||||||||||||||||||||||
| Reliability Tests | Appearance, Dimensions, Capacitance, Dissipation Factor, Insulation Resistance, Dielectric Withstanding Voltage, Solderability, Termination Adhesion, Resistance to Soldering Heat, Resistance to Flexure, Moisture Resistance, Temperature Cycle, Durability. | ||||||||||||||||||||||||||||
| Storage Conditions | Temperature: 5~40, Relative Humidity: 20%~70% |
2410121645_Chinocera-HGC0402G0270J500NTEJ_C5186873.pdf
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