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Specifications
Voltage Rating:
50V
Capacitance:
36pF
Temperature Coefficient:
X7R
Tolerance:
±5%
Mfr. Part #:
HGC0805G0360J500NTGJ
Package:
0805
Key Attributes
Model Number:
HGC0805G0360J500NTGJ
Product Description
Product Overview
The Hongming Huaci Technology Multilayer Ceramic Capacitors (MLCC) are designed for high-density, high-efficiency SMT applications. These general-purpose series capacitors are manufactured using NP0 (C0G/C0H), X7R, X5R, X7S, and X6S dielectrics, offering superior electrical performance and high reliability. They are available in a wide range of sizes from 0201 to 1210, providing high capacitance in small packages. Key applications include general digital circuits, power supply bypass, consumer electronics, and the telecommunication industry.
Product Attributes
- Brand: Hongming Huaci Technology ()
- Series: General Purpose Series (4V~63V)
- Origin: Suining, China
- Material: NP0 (C0G/C0H), X7R, X5R, X7S, X6S dielectrics
Technical Specifications
| Category | Details |
|---|---|
| Part Name | Multilayer Ceramic Capacitors |
| Series | General Purpose Series (4V~63V) |
| Specification (Size) | 0201 ~ 1210 |
| Supplier | Suining Hongming Huaci Technology Co., Ltd. |
| Issue Date | 20201116 |
| Model Designation | HGC [Series] [Size] [Dielectric] [Capacitance] [Tolerance] [Rated Voltage] [Termination] [Packaging] [Thickness Code] [Reel Size] |
| Available Sizes (Inch/mm) | 0201 (0603), 0402 (1005), 0603 (1608), 0805 (2012), 1206 (3216), 1210 (3225) |
| Dielectric Materials | NP0 (C0G/C0H), X7R, X5R, X7S, X6S |
| Temperature Characteristics |
|
| Applications | General digital circuits, Power supply bypass, Consumer electronics, Telecommunication industry |
| Termination Types | Cu/Ni/Sn |
| Packaging Options | Paper taping, Bulk packaging, Embossed taping |
| Reel Sizes | 7 Inch, 13 Inch |
| Reliability Test Standards | Appearance, Dimensions, Capacitance, Dissipation Factor (DF), Insulation Resistance (IR), Dielectric Withstanding Voltage (DWV), Solderability, Termination Adhesion, Resistance to Soldering Heat, Resistance to Flexure of Substrate, Moisture Resistance, Temperature Cycle, Durability. |
| Storage Conditions | Temperature: 5~40, Relative Humidity: 20%~70% (Guaranteed solderability period: 6 months) |
2410121645_Chinocera-HGC0805G0360J500NTGJ_C5186911.pdf
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