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quality High reliability multilayer ceramic capacitors Chinocera HGC0603G06R4C500NTHJ general purpose series 4V 63V factory
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quality High reliability multilayer ceramic capacitors Chinocera HGC0603G06R4C500NTHJ general purpose series 4V 63V factory
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Specifications
Voltage Rating:
50V
Capacitance:
6.4pF
Temperature Coefficient:
C0G
Mfr. Part #:
HGC0603G06R4C500NTHJ
Package:
0603
Key Attributes
Model Number: HGC0603G06R4C500NTHJ
Product Description

Multilayer Ceramic Capacitors (MLCC) - General Purpose Series (4V~63V)

Product Overview
These multilayer ceramic capacitors are designed for high-density and high-efficiency SMT applications. Manufactured with NP0 (C0G/C0H), X7R, X5R, X7S, and X6S dielectric materials, they offer excellent electrical performance and high reliability. Available in a wide range of sizes from 0201 to 1210, these capacitors provide high capacitance in compact dimensions, making them suitable for general digital circuits, power supply bypass, consumer electronics, and telecommunication applications.

Product Attributes

  • Brand: HGC
  • Supplier: Suining Hongming Huaci Technology Co., Ltd.
  • Series: General Purpose Series (4V~63V)
  • Dielectric Materials: NP0 (C0G/C0H), X7R, X5R, X7S, X6S

Technical Specifications

Specification Details
Part Name Multilayer Ceramic Capacitors
Series General Purpose Series (4V~63V)
Specification (Size) 0201 ~ 1210
Supplier Suining Hongming Huaci Technology Co., Ltd.
Issue Date 20201116
Model Designation HGC [Size] [Dielectric] [Capacitance] [Tolerance] [Rated Voltage] [Termination] [Packaging] [Thickness Code] [Reel Size]
Available Sizes (Inch/mm) 0201 (0603), 0402 (1005), 0603 (1608), 0805 (2012), 1206 (3216), 1210 (3225)
Dielectric Characteristics
  • C0G (NP0): Temp. Coeff: 0 30 ppm/; Temp. Range: -55125
  • C0H (NP0): Temp. Coeff: 0 60 ppm/; Temp. Range: -55125
  • X7R: Temp. Coeff: 15%; Temp. Range: -55125
  • X5R: Temp. Coeff: 15%; Temp. Range: -5585
  • X7S: Temp. Coeff: 22%; Temp. Range: -55125
  • X6S: Temp. Coeff: 22%; Temp. Range: -55105
Applications General digital circuits, Power supply bypass, Consumer electronics, Telecommunication
Termination Types Cu/Ni/Sn (N)
Packaging Options Paper taping (T), Bulk packaging (B), Embossed taping (S)
Reel Sizes 7 Inch (J/K), 13 Inch (D)
External Dimensions (Example: 0201) L: 0.600.03mm, W: 0.300.03mm, T: 0.300.03mm
Soldering Methods Reflow Soldering (R), Wave Soldering (W)
Reliability Test Items Appearance, Size, Capacitance, Dissipation Factor (DF), Insulation Resistance (IR), Dielectric Withstanding Voltage (DWV), Solderability, Termination Adhesion, Resistance to Soldering Heat, Resistance to Flexure of Substrate, Moisture Resistance (Steady State), Temperature Cycle, Durability
Storage Conditions Temperature: 5~40, Relative Humidity: 20%~70% (Guaranteed solderability period: 6 months)

Capacitance Range and Rated Voltage (Examples)

Note: Full capacitance range and voltage data are extensive and detailed in the original document. Below are illustrative examples.

C0G/C0H Dielectric (Partial Data)

Size Rated Voltage (VDC) Capacitance
0201 16, 25, 50 0.3pF (0R3) to 0.10F (104)
0805 10, 16, 25, 50 0.5pF (0R5) to 4.7F (473)
1210 10, 16, 25, 50 1.2pF (1R2) to 0.10F (104)

X7R Dielectric (Partial Data)

Size Rated Voltage (VDC) Capacitance
0201 6.3, 10, 16, 25, 50 100pF (101) to 0.10F (104)
0805 6.3, 10, 16, 25, 50 100pF (101) to 1.0F (105)
1210 10, 16, 25, 50 100pF (101) to 47F (476)

X5R Dielectric (Partial Data)

Size Rated Voltage (VDC) Capacitance
0201 6.3, 10, 16, 25, 50 100pF (101) to 0.10F (104)
0805 6.3, 10, 16, 25, 35, 50 100pF (101) to 1.0F (105)
1210 4, 6.3, 10, 16, 25, 35, 50 100pF (101) to 220F (227)

Precautions for Use

MLCCs may fail in short or open circuit. Under severe operating conditions or external mechanical stress beyond specified ratings, the capacitor chip may ignite, burn, or explode. Always follow the precautions and application notes. Contact the technical department for any unclear points. Soldering profiles should be followed to prevent chip cracking or local explosion due to sudden temperature changes. Manual soldering requires careful operation, tip selection, and temperature control to avoid thermal shock. Ensure optimal solder amount for reflow and wave soldering to prevent chip damage or poor connection.


2410121645_Chinocera-HGC0603G06R4C500NTHJ_C5186905.pdf
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