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Specifications
Voltage Rating:
200V
Capacitance:
100pF
Temperature Coefficient:
X7R
Tolerance:
±10%
Mfr. Part #:
HHV0805R7101K201NTHJ
Package:
0805
Key Attributes
Model Number:
HHV0805R7101K201NTHJ
Product Description
Product Overview
The Multi-layer Ceramic Capacitors (MLCC) from Suining Hongming Huaci Technology Co., Ltd. are designed for high-density, high-efficiency surface-mount applications. Featuring superior electrical performance and high reliability, these capacitors are manufactured using NP0 (C0G/C0H) and X7R dielectric materials. They offer high voltage in a given case size and high stability, making them suitable for a wide range of electronic circuits including analog and digital modems, LAN/WAN interfaces, voltage multipliers, DC-DC converters, and back-lighting inverter circuits.
Product Attributes
- Brand: HHV
- Manufacturer: Suining Hongming Huaci Technology Co., Ltd.
- Origin: China
- Dielectric Materials: NP0 (C0G/C0H), X7R, X5R, X6R, X6S, X7S, X7T, X8R
- Series: Mid-High Volts Series (100V~3000V)
Technical Specifications
| Specification | Details |
|---|---|
| Product Name | Multilayer Ceramic Capacitors |
| Series | Mid-High Volts Series (100V~3000V) |
| Specifications (Size) | 0402 ~ 1812 |
| Description | High voltage ceramic capacitors for high density and high efficiency SMT application. Available in NP0(C0G/C0H)/X7R with high reliability and excellent electrical performance. |
| Features | High voltage in a given case size; High stability and reliability. |
| Applications | Analog & Digital Modems, LAN/WAN Interface, Voltage Multipliers, DC-DC Converters, Back-lighting Inverters. |
| Temperature Coefficient/Characteristics | C0G: 0 30 ppm/ (-55125) C0H: 0 60 ppm/ (-55125) X7R: 15% (-55125) X7S: 22% (-55125) |
| External Dimensions (Example: 0402) | Length: 1.000.05mm, Width: 0.500.05mm, Thickness: 0.500.05mm |
| Soldering Method | Reflow Soldering (R), Wave Soldering (W) |
| Packaging Standard Quantity (Example: 0402, E thickness) | Paper tape: 10,000 pcs |
| Capacitance Range (Example: C0G/C0H, 0402 size) | 0.5pF to 1000pF (with various rated voltages) |
| Capacitance Range (Example: X7R, 0603 size) | 100pF to 820pF (with various rated voltages) |
| Dielectric Withstanding Voltage (DWV) | Varies by rated voltage (e.g., 200% for Vr < 500V, 150% for 500V Vr 1000V) |
| Insulation Resistance (IR) | Class I (C0G,C0H): 50000M (C10 nF) or RiCR500S (C>10 nF) Class II (X7R): 10000M (C25 nF) or RiCR100S (C>25 nF) |
| Solderability | 95% tinning rate, no visible damage. |
| Termination Adhesion | No visible damage. Force: 5N (0402-0805), 10N (1206). |
| Resistance to Soldering Heat | Electrical performance and appearance requirements met after soldering. |
| Resistance to Flexure of Substrate | C/C 10%; No visible damage. |
| Moisture Resistance (Steady State) | C/C: Class I 2% or 1pF, Class II 10%. DF 2x initial. IR varies by class. |
| Temperature Cycle | C/C: Class I 1% or 1pF, Class II 10%. |
| Durability | C/C: Class I 2% or 1pF, Class II 20%. Voltage applied varies by rated voltage. Duration: 1000h at 125. |
| Storage Method | Guaranteed solderability for 6 months. Storage Conditions: 5~40, 20%~70% RH. |
| Soldering Profile | Recommended temperature profiles for Reflow Soldering (Lead/Lead-free) and Wave Soldering. Manual soldering precautions provided. |
2410121646_Chinocera-HHV0805R7101K201NTHJ_C5186765.pdf
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