Product Overview
The HGC General Purpose Series Multilayer Ceramic Capacitors (MLCCs) are designed for high-density and high-efficiency Surface Mount Technology (SMT) applications. These capacitors are constructed with NP0 (C0G, C0H), X7R, X5R, X7S, and X6S dielectric materials, offering superior electrical performance and high reliability. Available in a wide range of sizes from 0201 to 1210, they provide high capacitance in small packages. Ideal for general digital circuits, power supply bypass, consumer electronics, and telecommunication industries.
Product Attributes
- Brand: HGC
- Supplier: (Suining Hongming Huaci Technology Co., Ltd.)
- Series: General Purpose Series (4V~63V)
- Dielectric Materials: NP0 (C0G/C0H), X7R, X5R, X7S, X6S
Technical Specifications
| Specification | Details |
|---|---|
| Model Designation | HGC [Size] [Dielectric] [Capacitance] [Tolerance] [Rated Voltage] [Termination] [Packaging] [Thickness Code] [Reel Size] |
| Available Sizes (Inch/mm) | 0201 (0603) to 1210 (3225) |
| Dielectric Characteristics |
|
| Rated Voltage (VDC) | 4V to 630V (Specific values vary by dielectric and size) |
| Capacitance Range | 0.3pF to 220F (Specific values vary by dielectric, size, and voltage) |
| External Dimensions (Example: 0805) | L: 2.000.20 mm, W: 1.250.20 mm, T: 0.700.10 mm (G), 0.800.20 mm (H), 1.250.20 mm (L) |
| Packaging Options | Paper Taping, Embossed Taping, Bulk |
| Reel Sizes | 7 Inch, 13 Inch |
| Termination Types | Cu/Ni/Sn, Cu/Resin/Ni/Sn |
| Soldering Methods | Reflow Soldering (R), Wave Soldering (W) |
| Reliability Tests | Appearance, Dimensions, Capacitance, Dissipation Factor, Insulation Resistance, Dielectric Withstanding Voltage, Solderability, Termination Adhesion, Resistance to Soldering Heat, Resistance to Flexure, Moisture Resistance, Temperature Cycle, Durability. |
2410121645_Chinocera-HGC0402G06R8C500NTEJ_C5186887.pdf
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