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Specifications
Voltage Rating:
50V
Capacitance:
470pF
Temperature Coefficient:
X7R
Tolerance:
±10%
Mfr. Part #:
HGC0603R7471K500NTHJ
Package:
0603
Key Attributes
Model Number:
HGC0603R7471K500NTHJ
Product Description
Product Overview
The Hongming Huaci Technology Multilayer Ceramic Capacitors (MLCC) are designed for high-density, high-efficiency Surface Mount Technology (SMT) applications. These general-purpose series capacitors are manufactured using NP0 (C0G/C0H), X7R, X5R, X7S, and X6S dielectric materials, offering superior electrical performance and high reliability. They are available in a wide range of sizes from 0201 to 1210, providing high capacitance in compact dimensions. Ideal for general digital circuits, power supply bypass, consumer electronics, and telecommunication industries.
Product Attributes
- Brand: Hongming Huaci Technology
- Supplier: Suining Hongming Huaci Technology Co., Ltd.
- Series: General Purpose Series (4V~63V)
- Dielectric Materials: NP0 (C0G/C0H), X7R, X5R, X7S, X6S
Technical Specifications
| Category | Specification | Details | |||||
|---|---|---|---|---|---|---|---|
| Product Name | Chinese | ||||||
| English | MULTILAYER CERAMIC CAPACITORS | ||||||
| Series | Chinese | 4V~63V | |||||
| English | General Purpose Series4V~63V | ||||||
| Specification | Size | 0201 ~ 1210 | |||||
| Applications | General Digital Circuit, Power Supply Bypass, Consumer Electronics, Telecommunication | ||||||
| Temperature Coefficient / Characteristics | Dielectric | Reference Temperature Point | Temperature Coefficient | Operation Temperature Range | |||
| C0G | 20C | 30 ppm/ | -55C125C | ||||
| C0H | 20C | 60 ppm/ | -55C125C | ||||
| X7R | 20C | 15% | -55C125C | ||||
| X5R | 20C | 15% | -55C85C | ||||
| X7S | 20C | 22% | -55C125C | ||||
| X6S | 20C | 22% | -55C105C | ||||
| External Dimensions | Size | Length L (mm) | Width W (mm) | Thickness T (mm)/Symbol | End Width MB (mm) | ||
| 0201 (0603) | 0.600.03 | 0.300.03 | 0.300.03 C | 0.150.05 | |||
| 0402 (1005) | 1.000.05 | 0.500.05 | 0.500.05 E | 0.250.10 | |||
| 0603 (1608) | 1.600.20 | 0.800.20 | 0.800.20 H | 0.400.15 | |||
| 0805 (2012) | 2.000.20 | 1.250.20 | 0.700.10 G / 0.800.20 H / 1.250.20 L | 0.500.20 | |||
| 1206 (3216) | 3.200.20 | 1.600.20 | 0.700.10 G / 0.800.20 H / 1.000.10 J / 1.250.20 L / 1.600.20 P | 0.600.20 | |||
| 1210 (3225) | 3.200.30 | 2.500.30 | 1.250.20 L / 1.600.20 P / 2.000.20 U / 2.500.30 V | 0.750.25 | |||
| Packaging Standard Quantity | Size | Thickness (mm)/Symbol | Paper Tape 7" reel | Plastic Tape 7" reel | |||
| 0201 (0603) | 0.300.03 C | 15,000 | ------- | ||||
| 0402 (1005) | 0.500.05 E(C105) | 10,000 | ------- | ||||
| 0.500.20 E(C105) | 10,000 | ------- | |||||
| 0603 (1608) | 0.800.20 H | 4000 | ------- | ||||
| 0805 (2012) | 0.700.10 G | 4000 | ------- | ||||
| 0.800.20 H | 4000 | ------- | |||||
| 1.250.20 L | ------ | 2000/3000 | |||||
| 1206 (3216) | 0.700.10 G | 4000 | ------- | ||||
| 0.800.20 H | 4000 | ------- | |||||
| 1.000.10 J | ------- | 3000 | |||||
| 1.250.20 L | ------- | 3000 | |||||
| 1.600.20 P | ------- | 2000 | |||||
| 1210 (3225) | 1.250.20 L | ------- | 2000 | ||||
| 1.600.20 P | ------- | 2000 | |||||
| 2.000.20 U | ------- | 2000 | |||||
| 2.500.30 V | ------- | 1000 | |||||
| Capacitance Range and Rated Voltage | Dielectric | Size | Rated Voltage (VDC) | ||||
| C0G, C0H | 0201 | 16, 25, 50 | |||||
| 0402 | 25, 50 | ||||||
| 0603 | 25, 50, 10, 16, 25, 50 | ||||||
| 0805 | 10, 16, 25, 50, 10, 16, 25, 50 | ||||||
| 1206 | 10, 16, 25, 50, 10, 16, 25, 50 | ||||||
| 1210 | 10, 16, 25, 50, 10, 16, 25, 50 | ||||||
| X7R | 0201 | 6.3, 10, 16, 25, 50 | |||||
| 0402 | 6.3, 10, 16, 25, 50 | ||||||
| 0603 | 6.3, 10, 16, 25, 50 | ||||||
| 0805 | 6.3, 10, 16, 25, 50 | ||||||
| 1206 | 10, 16, 25, 50, 100 | ||||||
| 1210 | 6.3, 10, 16, 25, 50 | ||||||
| X7S | 0402 | 6.3, 10, 16, 25 | |||||
| 0603 | 6.3, 10, 16, 25 | ||||||
| 0805 | 10, 16, 25, 50, 100 | ||||||
| 1206 | 6.3, 10, 16, 25, 50 | ||||||
| 1210 | 6.3, 10, 16, 25, 50 | ||||||
| X5R | 0201 | 6.3, 10, 16, 25, 50 | |||||
| 0402 | 6.3, 10, 16, 25, 50 | ||||||
| 0603 | 6.3, 10, 16, 25, 35, 50 | ||||||
| 0805 | 6.3, 10, 16, 25, 35, 50 | ||||||
| 1206 | 6.3, 10, 16, 25, 35, 50 | ||||||
| 1210 | 4, 6.3, 10, 16, 25, 35, 50 | ||||||
| X6S | 0402 | 6.3, 10, 16, 25 | |||||
| 0603 | 4, 6.3, 10, 16, 25 | ||||||
| 0805 | 4, 6.3, 10, 16, 25, 50 | ||||||
| 1206 | 4, 6.3, 10, 16, 25, 50 | ||||||
| 1210 | 4, 6.3, 10, 16, 25, 50 | ||||||
| Reliability Test | Item | Technical Requirements | Test Method and Remarks | ||||
| Appearance | No remarkable defects or abnormalities. | Through microscope (10) | |||||
| Size | Within the specified size range | Using a vernier caliper | |||||
| Capacitance | Should be within the specified tolerance. | Class I: 253, 1MHz10% (C1000pF), 1KHz10% (C>1000pF), 1.00.2Vrms. Class II: 253, 1KHz10% (C10F), 12024 Hz (C>10F), 1.00.2Vrms (C10F), 0.50.1Vrms (C>10F). | |||||
| Dissipation Factor (DF, tan) | Class I: Varies by capacitance. Class II: Varies by rated voltage and capacitance. | Class I: 253, 1MHz10% (C1000pF), 1KHz10% (C>1000pF), 1.00.2Vrms. Class II: 253, 1KHz10% (C10F), 12024 Hz (C>10F), 1.00.2Vrms (C10F), 0.50.1Vrms (C>10F). | |||||
| Insulation Resistance (IR) | Class I: C10nF Ri50000M, C>10nF RiCR500S. Class II: C25nF Ri10000M, C>25nF RiCR100S. | Rated voltage, 605 sec, 50mA, 253, 75% RH. | |||||
| Dielectric Withstanding Voltage (DWV) | No breakdown or damage. | Class I: 300% Rated voltage; Class II: 250% Rated voltage, 1-5s, 50mA. | |||||
| Solderability | At least 95% of the terminal electrode is covered by new solder. No visible damage. | Preheating 80-120 (10-30s). Lead solder: 2355 (20.5s). Lead-free solder: 2455 (20.5s). | |||||
| Termination Adhesion | No visible damage. | 0201: 2N (101s). 0402-0805: 5N (120s). 1206: 10N (120s). | |||||
| Resistance to Soldering Heat | Electrical performance within limits, appearance: No visible damage, 95% solder coverage. | Pretreatment (Class II). Solder Temp: 2655 (101s). Recovery: 242h. (1210+ uses reflow). | |||||
| Resistance to Flexure of Substrate | C/C: 10%. Appearance: No visible damage. | Pretreatment (Class II). PCB Thickness: 1.60.2mm. Flexure: 1mm. Holding time: 51s. | |||||
| Moisture Resistance (Steady State) | C/C: Class I 2% or 1pF (larger). Class II 10%. DF 2x initial. IR: Class I 2500M or RiCR25S (smaller). Class II 1000M or RiCR25S (smaller). Appearance: No damage. | Pre-test & Post-test treatment (Class II). Temp: 402. Humidity: 90%-95%RH. Duration: 500h. Recovery: 242h. | |||||
| Temperature Cycle | C/C: Class I 1% or 1pF (larger). Class II 10%. | Pretreatment (Class II). 5 cycles: -55 (30min) -> +20 (2-3min) -> Upper Temp (30min) -> +20 (2-3min). Recovery: 242h. | |||||
| Durability | C/C: Class I 2% or 1pF (larger). Class II 20%. DF 2x initial. IR: Class I 4000M or RiCR40S (smaller). Class II 2000M or RiCR50S (smaller). Appearance: No damage. | Pre-test & Post-test treatment (Class II). Low-voltage (<100V): 1.5x Rated Voltage for 1000h at specified temperatures. Charge current 50mA. Recovery: 242h. | |||||
| Packaging | Paper Taping Dimensions | 0201: 0.370.10 (A0), 0.670.10 (B0), 8.000.10 (W), 3.500.05 (F*), 1.750.10 (P1), 2.000.05 (P2*), 2.000.05 (P0), 4.000.10 (D0), 1.50 -0/+0.10 (T). 0402: 0.650.10 (A0), 1.150.10 (B0), 8.000.10 (W), 3.500.05 (F*), 1.750.10 (P1), 2.000.05 (P2*), 2.000.05 (P0), 4.000.10 (D0), 1.50 -0/+0.10 (T). | |||||
| Embossed Taping Dimensions | 0805: Tapesize 1.550.20 (A), 2.350.20 (B), 8.000.20 (C), 3.500.05 (D*), 1.750.10 (E), 4.000.10 (F), 2.000.10 (G*), 4.000.10 (H), 1.50 -0/+0.10 (J), 1.50 Max (T). 1206: Tapesize 1.950.20 (A), 3.600.20 (B), 8.000.20 (C), 3.500.05 (D*), 1.750.10 (E), 4.000.10 (F), 2.000.10 (G*), 4.000.1 (H), 1.50 -0/+0.10 (J), 1.85 Max (T). 1210: Tapesize 2.700.10 (A), 3.420.10 (B), 8.000.10 (C), 3.500.05 (D*), 1.750.10 (E), 4.000.10 (F), 2.000.05 (G*), 4.000.10 (H), 1.55 -0/+0.10 (J), 3.2 Max (T). | ||||||
| Reel Dimensions | 8mm/7REEL: 1782.0 (A), 3.0 (B), 130.5 (C), 210.8 (D), 50 or more (E), 10.01.5 (F), 14.4max (G). 13REEL: 3302.0 (A), 3.0 (B), 130.5 (C), 210.8 (D), 50 or more (E), 10.01.5 (F), 14.4max (G). 12mm/7REEL: 1782.0 (A), 3.0 (B), 130.5 (C), 210.8 (D), 50 or more (E), 13.41.5 (F), 18.4max (G). | ||||||
| Taping Specification | Paper Taping: 0.1N < peeling strength < 0.7N. Embossed Taping: 0.1N < peeling strength < 0.7N. | ||||||
| Storage Methods | Guaranteed period for solderability: 6 months (under deliver package condition). | ||||||
| Storage Conditions: Temperature 5~40, Relative Humidity 20%~70%. | |||||||
| Precautions For Use | MLCC may fail in short or open circuit. Severe conditions may cause burn out, flaming, or explosion. Follow specifications and contact technical department for clarification. | ||||||
| Soldering Profile: Follow temperature curves to avoid cracking or explosion due to sudden temperature changes. Refer to enclosure pages for graphs. | |||||||
| Manual Soldering: Avoid direct contact of soldering iron tip with ceramic body. Handle carefully, pay attention to tip selection and temperature control. | |||||||
| Optimum Solder Amount: Too much solder may cause chip damage due to excessive stress. Too little solder may cause poor connection. | |||||||
| Recommended Soldering Amounts: For reflow, wave, and rework soldering. | |||||||
| Recommended Soldering Temperature Profile: Reflow soldering (SnPb & Lead-free), Wave soldering, Hand soldering. | |||||||
| Reflow Soldering Temperature Differential (T): HGC0201/0402/0603/0805/1206 T150. HGC1210 T130. | |||||||
| Wave Soldering Temperature Differential (T): HGC0603/0805/1206 T150. | |||||||
| Hand Soldering Conditions: Preheating 130, Max Temp 350, Max Power 20W, Tip Diameter 1mm recommended, Max Soldering Time 3s, Solder paste 1/2 chip thickness. Avoid direct contact with ceramic components. | |||||||
| Typical Characteristic Data Graph | 1. |Z|-Frequency Characteristics Curve 2. Temperature Characteristics 3. DC Bias Characteristics | Note: Above product characteristics are for reference only. | |||||
2410121645_Chinocera-HGC0603R7471K500NTHJ_C482477.pdf
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