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Specifications
Voltage Rating:
50V
Capacitance:
100nF
Temperature Coefficient:
X5R
Tolerance:
±10%
Mfr. Part #:
HGC0402R5104K500NTEJ
Package:
0402
Key Attributes
Model Number:
HGC0402R5104K500NTEJ
Product Description
Multilayer Ceramic Capacitors (MLCC) - General Purpose Series (4V~63V)
Product Overview
These multilayer ceramic capacitors are designed for high-density and high-efficiency Surface Mount Technology (SMT) applications. Manufactured with NP0 (C0G/C0H), X7R, X5R, X7S, and X6S dielectric materials, they offer superior electrical performance and high reliability. Available in a wide range of sizes from 0201 to 1210, these capacitors provide high capacitance in compact dimensions, making them suitable for general digital circuits, power supply bypass, consumer electronics, and telecommunication industries.
Product Attributes
- Brand: HGC
- Supplier: Suining Hongming Huaci Technology Co., Ltd.
- Series: General Purpose Series (4V~63V)
- Dielectric Materials: NP0 (C0G/C0H), X7R, X5R, X7S, X6S
Technical Specifications
| Specification | Details |
|---|---|
| Part Name | Multilayer Ceramic Capacitors |
| Series | General Purpose Series (4V~63V) |
| Available Sizes | 0201 to 1210 |
| Applications | General digital circuits, Power supply bypass, Consumer electronics, Telecommunication |
| Model Designation | HGC [Size] [Dielectric] [Capacitance] [Tolerance] [Rated Voltage] [Termination] [Packaging] [Thickness Code] [Reel Size] |
| Dielectric Characteristics |
|
| External Dimensions (Example: 0201) | Size: 0.600.03mm (L) x 0.300.03mm (W) x 0.300.03mm (T) |
| Packaging Quantity (Example: 0201) | Paper Tape: 15,000 pcs/7" reel |
| Reliability Test Highlights | Appearance, Dimensions, Capacitance, Dissipation Factor, Insulation Resistance, Dielectric Withstanding Voltage, Solderability, Termination Adhesion, Resistance to Soldering Heat, Flexure Strength, Moisture Resistance, Temperature Cycle, Durability. |
| Storage Conditions | Temperature: 5~40, Relative Humidity: 20%~70% (Guaranteed solderability for 6 months) |
| Soldering Recommendations | Reflow soldering, Wave soldering, Manual soldering (refer to temperature profiles and solder amount guidelines). Avoid direct contact with ceramic body during manual soldering. Minimize temperature differentials (T) during preheating. |
2410121645_Chinocera-HGC0402R5104K500NTEJ_C7432762.pdf
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