Product Overview
The HHV Series of Multilayer Ceramic Capacitors (MLCCs) from Suining Hongming Huaci Technology Co., Ltd. are designed for high-density, high-efficiency surface mount applications. These capacitors offer high voltage ratings in a given case size, along with superior electrical performance and high reliability. They are suitable for use in analog and digital modems, LAN/WAN interface circuits, voltage multipliers, DC-DC converters, and back-lighting inverter circuits.
Product Attributes
- Brand: HHV Series
- Manufacturer: Suining Hongming Huaci Technology Co., Ltd.
- Origin: China
- Materials: NP0 (C0G/C0H), X7R dielectric
- Certifications: Customer Approval Sheet (HC202002)
Technical Specifications
| Category | Specification | Details |
|---|---|---|
| Product Series | Mid-High Volts Series | 100V ~ 3000V |
| Specification (Size) | 0402 ~ 1812 | (1005 ~ 4532) |
| Dielectric Materials | NP0 (C0G/C0H), X7R, X7S, X7T, X8R, X5R, X6R, X6S | Refer to 'HOW TO ORDER' for specific codes. |
| Capacitance Range | 0.5pF ~ 100F (depending on dielectric and size) | Refer to Capacitance Range tables. |
| Tolerance | 0.05pF, 0.1pF, 0.25pF, 0.5pF, 1%, 2%, 5%, 10%, 15%, 20%, -20%~+50% | Refer to 'HOW TO ORDER' for specific codes. |
| Rated Voltage | 100Vdc to 3000Vdc | Refer to 'HOW TO ORDER' and Capacitance Range tables. |
| Temperature Coefficient/Characteristics | C0G: 030 ppm/ (-55125) C0H: 060 ppm/ (-55125) X7R: 15% (-55125) X7S: 22% (-55125) | Class I vs Class II definitions provided. |
| External Dimensions | 0402 (1005) to 1812 (4532) | Detailed dimensions (L, W, T) provided in mm. |
| Soldering Method | Reflow Soldering (R), Wave Soldering (W) | |
| Packaging | Paper Taping, Embossed Taping, Bulk | Standard quantities per reel size (7-inch, 13-inch) available. |
| Reliability Tests | Appearance, Dimensions, Capacitance, DF, IR, DWV, Solderability, Termination Adhesion, Resistance to Soldering Heat, Resistance to Flexure, Moisture Resistance, Temperature Cycle, Durability | Detailed technical requirements and test methods provided. |
| Storage Method | Guaranteed solderability period: 6 months (under delivered package condition) | Storage Temperature: 5~40, Relative Humidity: 20%~70% |
| Soldering Conditions | Reflow Soldering, Wave Soldering, Manual Soldering | Recommended temperature profiles and conditions provided for leaded and lead-free solder. |
2410121646_Chinocera-HHV1206R7222K102NSLJ_C571059.pdf
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