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Specifications
Voltage Rating:
50V
Capacitance:
100pF
Temperature Coefficient:
X7R
Mfr. Part #:
HGC0805R7101K500NTHJ
Package:
0805
Key Attributes
Model Number:
HGC0805R7101K500NTHJ
Product Description
Product Overview
The Hongming Huaci Technology Multilayer Ceramic Capacitors (MLCC) are designed for high-density, high-efficiency SMT applications. These general-purpose series capacitors are available in a wide range of sizes from 0201 to 1210 and feature excellent electrical performance and high reliability. They are manufactured using NP0 (C0G/C0H), X7R, X5R, X7S, and X6S dielectric materials. Ideal for general digital circuits, power supply bypass, consumer electronics, and telecommunication industries, these capacitors offer high capacitance in small sizes.
Product Attributes
- Brand: HGC (Hongming Huaci Technology)
- Supplier: Suining Hongming Huaci Technology Co., Ltd.
- Series: General Purpose Series (4V~63V)
- Dielectric Materials: NP0 (C0G/C0H), X7R, X5R, X7S, X6S
Technical Specifications
| Category | Details |
|---|---|
| Part Name | Multilayer Ceramic Capacitors |
| Series | General Purpose Series (4V~63V) |
| Specification (Size) | 0201 ~ 1210 |
| Supplier | Suining Hongming Huaci Technology Co., Ltd. |
| Issue Date | 20201116 |
| Model Designation | HGC [Size] [Dielectric] [Capacitance] [Tolerance] [Rated Voltage] [Termination] [Packaging] [Thickness Code] [Reel Size] |
| Available Sizes (Inch/mm) | 0201 (0603), 0402 (1005), 0603 (1608), 0805 (2012), 1206 (3216), 1210 (3225) |
| Dielectric Types & Temperature Characteristics |
|
| External Dimensions (Example: 0201) | L: 0.600.03 mm, W: 0.300.03 mm, T: 0.300.03 mm |
| External Dimensions (Example: 1210) | L: 3.200.30 mm, W: 2.500.30 mm, T: 1.250.20 mm |
| Soldering Methods | Reflow Soldering (R), Wave Soldering (W) |
| Packaging Options | Paper Taping, Embossed Taping, Bulk |
| Reel Sizes | 7 Inch, 13 Inch |
| Applications | General digital circuits, Power supply bypass, Consumer electronics, Telecommunication industry |
| Reliability Test Items | Appearance, Dimensions, Capacitance, Dissipation Factor (DF), Insulation Resistance (IR), Dielectric Withstanding Voltage (DWV), Solderability, Termination Adhesion, Resistance to Soldering Heat, Resistance to Flexure of Substrate, Moisture Resistance (Steady State), Temperature Cycle, Durability |
| Storage Conditions | Temperature: 5~40, Relative Humidity: 20%~70% |
| Guaranteed Solderability Period | 6 months (Under deliver package condition) |
2410121645_Chinocera-HGC0805R7101K500NTHJ_C5186763.pdf
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