<
>
Specifications
Voltage Rating:
50V
Capacitance:
1nF
Temperature Coefficient:
X7R
Tolerance:
±10%
Mfr. Part #:
HGC1206R7102K500NTHJ
Package:
1206
Key Attributes
Model Number:
HGC1206R7102K500NTHJ
Product Description
Product Overview
The HGC General Purpose Series Multilayer Ceramic Capacitors (MLCCs) are designed for high-density and high-efficiency SMT applications. These capacitors are manufactured using NP0 (C0G/C0H), X7R, X5R, X7S, and X6S dielectric materials, offering excellent electrical performance and high reliability. They are available in a wide range of sizes from 0201 to 1210, providing high capacitance in small dimensions. Key applications include general digital circuits, power supply bypass, consumer electronics, and the telecommunication industry.
Product Attributes
- Brand: HGC
- Supplier: Suining Hongming Huaci Technology Co., Ltd.
- Series: General Purpose Series (4V~63V)
- Dielectric Materials: NP0 (C0G/C0H), X7R, X5R, X7S, X6S
Technical Specifications
| Specification | Details | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
| Product Name | Multilayer Ceramic Capacitors | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Series | General Purpose Series (4V~63V) | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Available Sizes | 0201 to 1210 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| How to Order (Example: HGC 0805 R7 104 K 500 N T H J) |
| ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Temperature Coefficient / Characteristics |
| ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Product Peripheral Dimensions |
| ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Packaging Standard Quantity |
| ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Capacitance Range and Rated Voltage | (See detailed tables in original document for specific combinations of dielectric, size, and voltage.) | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Reliability Test - Appearance and Electrical Performance |
| ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Packaging - Paper Taping Dimensions |
| ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Packaging - Embossed Taping Dimensions |
| ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Reel Dimensions |
| ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Taping Specification - Top Tape Peeling Strength | 0.1N < peeling strength < 0.7N. No paper dirty remains on the scotch when peeling, and sticks to top and bottom tape. | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Storage Methods | Guaranteed solderability period: 6 months (under delivered package condition). Storage Temperature: 5~40, Relative Humidity: 20%~70%. | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Precautions for Use | MLCCs may fail in short or open circuit. Severe conditions beyond ratings may cause burn out, flaming, or explosion. Follow specifications and contact technical department for any uncertainties. Avoid sudden temperature changes during soldering to prevent cracking or explosion. Manual soldering requires careful operation, tip selection, and temperature control. Ensure optimal solder amount to avoid damage or poor connection. Refer to soldering temperature profile charts. | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Soldering Temperature Profile | Refer to provided charts for Reflow Soldering (Lead-free and SnPb) and Wave Soldering profiles. Temperature differential (T) should be minimized during preheating (150 for most sizes, 130 for HGC1210). For hand soldering, preheating 130, iron tip temperature 350, power 20W, diameter 1mm, time 3s, solder paste 1/2 chip thickness. Avoid direct contact between soldering iron tip and ceramic component. | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Typical Characteristic Data Graph | Includes |Z|-Frequency Characteristics, Temperature Characteristics, and DC Bias Characteristics. (Note: These are for reference only.) |
2410121645_Chinocera-HGC1206R7102K500NTHJ_C5186818.pdf
Request A Quote
Please Use Our Online Inquiry Contact Form Below If You Have Any Questions, Our Team Will Get Back To You As Soon As Possible
