Product Overview
The HHV series of Multilayer Ceramic Capacitors (MLCCs) from Suining Hongming Huaci Technology Co., Ltd. are designed for high-density, high-efficiency Surface Mount Technology (SMT) applications. These capacitors are manufactured using NP0 (C0G, C0H) and X7R materials, offering superior electrical performance and high reliability. They are suitable for mid-to-high voltage applications ranging from 100V to 3000V and are available in case sizes from 0402 to 1812. Key features include high voltage capability in a given case size, high stability, and reliability, making them ideal for applications such as analog & digital modems, LAN/WAN interfaces, voltage multipliers, DC-DC converters, and back-lighting inverters.
Product Attributes
- Brand: HHV Series
- Manufacturer: Suining Hongming Huaci Technology Co., Ltd.
- Material: NP0 (C0G/C0H), X7R
- Series: Mid-High Volts Series
Technical Specifications
| Specification | Details |
|---|---|
| Product Name | Multilayer Ceramic Capacitors |
| Series | Mid-High Volts Series (100V~3000V) |
| Specification (Size) | 0402 ~ 1812 |
| Dielectric Types | NP0 (C0G/C0H), X7R, X7S, X7T, X8R, X5R, X6R, X6S |
| Case Sizes (Inch/mm) | 0402 (1005), 0603 (1608), 0805 (2012), 1206 (3216), 1210 (3225), 1808 (4520), 1812 (4532) |
| Rated Voltage | 100Vdc to 3000Vdc |
| Capacitance Range | 0.5pF to 100F (depending on dielectric and size) |
| Tolerance | 0.05pF, 0.1pF, 0.25pF, 0.5pF, 1%, 2%, 5%, 10%, 15%, 20%, -20%~+50% |
| Temperature Coefficient (C0G/C0H) | 0 30 ppm/, 0 60 ppm/ |
| Temperature Coefficient (X7R) | 15% |
| Operating Temperature Range | -55125 |
| Termination Types | Cu/Ni/Sn, Cu/Resin/Ni/Sn |
| Packaging | Paper taping, Embossed taping, Bulk |
| Reel Size | 7 Inch, 13 Inch |
| Dimensions (L x W x T) | Refer to section 6-1 for detailed dimensions per case size. |
| Soldering Method | Reflow Soldering, Wave Soldering |
| Reliability Test Items | Appearance, Size, Capacitance, Dissipation Factor (DF), Insulation Resistance (IR), Dielectric Withstanding Voltage (DWV), Solderability, Termination Adhesion, Resistance to Soldering Heat, Resistance to Flexure of Substrate, Moisture Resistance, Temperature Cycle, Durability. |
| Storage Conditions | Temperature: 5~40, Relative Humidity: 20%~70% |
| Guaranteed Solderability Period | 6 months (under delivered package condition) |
2410121646_Chinocera-HHV0805R7222K101NTHJ_C5186785.pdf
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