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quality High Reliability Multilayer Ceramic Capacitors Chinocera HGC0402G00R9C500NTEJ for Power Supply Bypass factory
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quality High Reliability Multilayer Ceramic Capacitors Chinocera HGC0402G00R9C500NTEJ for Power Supply Bypass factory
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Specifications
Voltage Rating:
50V
Capacitance:
0.9pF
Temperature Coefficient:
C0G
Mfr. Part #:
HGC0402G00R9C500NTEJ
Package:
0402
Key Attributes
Model Number: HGC0402G00R9C500NTEJ
Product Description

Product Overview

The Suining Hongming Huaci Technology Co., Ltd. offers a series of General Purpose Multilayer Ceramic Capacitors (MLCCs) designed for high-density and high-efficiency SMT applications. These capacitors are manufactured using NP0 (C0G/C0H), X7R, X5R, X7S, and X6S dielectric materials, providing superior electrical performance and high reliability. Available in a wide range of sizes from 0201 to 1210, they offer high capacitance in small packages. Key applications include general digital circuits, power supply bypass, consumer electronics, and the telecommunication industry.

Product Attributes

  • Brand: HGC
  • Supplier: Suining Hongming Huaci Technology Co., Ltd.
  • Series: General Purpose Series (4V~63V)
  • Dielectric Materials: NP0 (C0G/C0H), X7R, X5R, X7S, X6S

Technical Specifications

Specification Details
Part Name Multilayer Ceramic Capacitors
Series General Purpose Series (4V~63V)
Available Sizes (Inch/mm) 0201 (0603) to 1210 (3225)
Model Designation HGC [Size] [Dielectric] [Capacitance] [Tolerance] [Rated Voltage] [Termination] [Packaging] [Thickness Code] [Reel Size]
Dielectric Characteristics
  • C0G/C0H: 0 30 ppm/, -55125
  • X7R: 15%, -55125
  • X5R: 15%, -5585
  • X7S: 22%, -55125
  • X6S: 22%, -55105
External Dimensions (mm)
Size (Inch/mm) Length L Width W Thickness T
0201 (0603) 0.600.03 0.300.03 0.300.03
0402 (1005) 1.000.05 0.500.05 0.500.05
0603 (1608) 1.600.20 0.800.20 0.800.20
0805 (2012) 2.000.20 1.250.20 0.700.10
1206 (3216) 3.200.20 1.600.20 0.700.10
1210 (3225) 3.200.30 2.500.30 1.250.20
Packaging Standard Quantity (Pieces/Reel)
Size Thickness Paper Tape (7" Reel) Plastic Tape (7" Reel)
0201 (0603)0.300.0315,000-
0402 (1005)0.500.0510,000-
0603 (1608)0.800.204000-
0805 (2012)0.700.104000-
0805 (2012)0.800.204000-
1206 (3216)0.700.104000-
1206 (3216)0.800.204000-
1206 (3216)1.000.10-3000
1206 (3216)1.250.20-3000
1206 (3216)1.600.20-2000
1210 (3225)1.250.20-2000
1210 (3225)1.600.20-2000
1210 (3225)2.000.20-2000
1210 (3225)2.500.30-1000
Reliability Test Summary
ItemTechnical RequirementsTest Method
AppearanceNo remarkable defects or abnormalities.Microscope (10)
SizeWithin specified range.Vernier caliper
Capacitance ToleranceAs per specified tolerance levels (Class I & II).253, specified frequency and voltage.
Dissipation Factor (DF)As per specified limits for Class I & II.253, specified frequency and voltage.
Insulation Resistance (IR)As per specified limits (M or MF).Rated voltage, 605s, 253, 75% RH.
Dielectric Withstanding Voltage (DWV)No breakdown or damage.300% Rated Voltage (Class I), 250% Rated Voltage (Class II) for 1-5s.
Solderability95% terminal coverage, no visible damage.Lead/Lead-free solder baths at specified temperatures and times.
Termination AdhesionNo visible damage.Applied force and time based on size.
Resistance to Soldering HeatC/C, DF, IR within limits; Appearance OK.Preheating, solder bath (2655, 101s), recovery.
Resistance to Flexure of SubstrateC/C 10%; Appearance OK.1.60.2mm PCB, 1mm flexure, 51s hold.
Moisture Resistance (Steady State)C/C, DF, IR within limits; Appearance OK.402, 90%~95% RH for 500h, recovery.
Temperature CycleC/C within limits.5 cycles of -55 to +125 (or other specified temps), recovery.
DurabilityC/C, DF, IR within limits; Appearance OK.1.5x Rated Voltage at elevated temperatures for 1000h, recovery.
Storage Method
  • Guaranteed solderability for 6 months under delivered package conditions.
  • Storage Conditions: Temperature: 5~40, Relative Humidity: 20%~70%.
Precautions for Use
  • MLCCs may fail short or open circuit. Avoid operating conditions exceeding ratings.
  • Risk of burn out, flaming, or explosion under severe electrical/mechanical stress.
  • Follow safety precautions and application notes. Contact technical department for clarifications.
  • Soldering: Avoid sudden temperature changes to prevent cracking. Follow recommended temperature profiles.
  • Manual Soldering: Handle with care to avoid thermal shock and damage. Control soldering iron tip and temperature.
  • Solder Amount: Use optimal amounts to ensure proper connection and avoid damage.
  • Temperature Profiles: Refer to provided diagrams for Reflow and Wave soldering. Minimize temperature differentials (T) during preheating.

2410121645_Chinocera-HGC0402G00R9C500NTEJ_C5186866.pdf

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