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Specifications
Voltage Rating:
100V
Capacitance:
100pF
Temperature Coefficient:
C0G
Tolerance:
±5%
Mfr. Part #:
HHV0603G0101J101NTHJ
Package:
0603
Key Attributes
Model Number:
HHV0603G0101J101NTHJ
Product Description
Product Overview
The HHV series of Multilayer Ceramic Capacitors (MLCCs) from Suining Hongming Huaci Technology Co., Ltd. are designed for high-density, high-efficiency surface mount applications. These capacitors offer high voltage ratings in a given case size, along with high stability and reliability. They are suitable for various applications including analog and digital modems, LAN/WAN interface circuits, voltage multipliers, DC-DC converters, and back-lighting inverter circuits. Available in NP0 (C0G/C0H) and X7R dielectrics, these capacitors provide excellent electrical performance and high reliability for demanding electronic designs.
Product Attributes
- Brand: HHV Series
- Manufacturer: Suining Hongming Huaci Technology Co., Ltd.
- Origin: China
- Dielectric Materials: NP0 (C0G, C0H), X7R, X7S, X7T, X8R, X5R, X6R, X6S
- Termination Types: Cu/Ni/Sn
- Packaging Options: Paper Taping, Embossed Taping, Bulk
Technical Specifications
| Series | Part Name | Series Description | Specification (Size) | Voltage Range | Capacitance Range | Dielectric Type |
|---|---|---|---|---|---|---|
| HHV | Multilayer Ceramic Capacitors | Mid-High Volts Series (100V~3000V) | 0402 ~ 1812 Size | 100V to 3000V DC | 0.5pF to 100F (depending on dielectric and size) | NP0 (C0G/C0H), X7R, X7S, X7T, X8R, X5R, X6R, X6S |
Dimensions (Inch/mm)
| Size Code | Length L (mm) | Width W (mm) | Thickness T (mm)/Symbol |
|---|---|---|---|
| 0402 (1005) | 1.000.05 | 0.500.05 | 0.500.05 / E |
| 0603 (1608) | 1.600.20 | 0.800.20 | 0.800.20 / H |
| 0805 (2012) | 2.000.20 | 1.250.20 | 0.700.10 / G, 0.800.20 / H, 1.250.20 / L |
| 1206 (3216) | 3.200.20 | 1.600.20 | 0.800.20 / H, 1.000.10 / J, 1.250.20 / L, 1.600.20 / P |
| 1210 (3225) | 3.200.30 | 2.500.20 | 1.250.20 / L, 1.600.20 / P, 2.000.20 / U, 2.500.20 / V |
| 1808 (4520) | 4.50.40 | 2.00.25 | 1.250.20 / L, 1.600.20 / P, 2.000.20 / U |
| 1812 (4532) | 4.50.40 | 3.20.30 | 1.250.20 / L, 1.600.20 / P, 2.000.20 / U, 2.500.30 / V |
Temperature Coefficient / Characteristics
| Dielectric | Reference Temperature Point | Nominal Temperature Coefficient | Operation Temperature Range |
|---|---|---|---|
| C0G | 20C | 30 ppm/ | -55125 |
| C0H | 20C | 60 ppm/ | -55125 |
| X7R | 20C | 15% | -55125 |
| X7S | 20C | 22% | -55125 |
Reliability Test Summary
| Test Item | Class I (C0G/C0H) Requirements | Class II (X7R) Requirements |
|---|---|---|
| Capacitance Change (C/C) | 2% or 1pF (whichever is larger) | 10% (Moisture Resistance), 10% (Temperature Cycle), 20% (Durability) |
| Dissipation Factor (DF) | Specific values based on capacitance and frequency | 2.5% (Initial), 2x initial (Moisture Resistance, Durability) |
| Insulation Resistance (IR) | Ri50000M or RiCR500S (for C10nF) | Ri10000M or RiCR100S (for C25nF) |
| Dielectric Withstanding Voltage (DWV) | No breakdown or damage | No breakdown or damage |
| Solderability | 95% solder coverage, no visible damage | 95% solder coverage, no visible damage |
| Termination Adhesion | No visible damage | No visible damage |
| Resistance to Soldering Heat | C/C 0.5%, DF same as initial, IR same as initial | C/C -5%~+10%, DF same as initial, IR same as initial |
| Resistance to Flexure of Substrate | C/C 10%, Appearance: No visible damage | C/C 10%, Appearance: No visible damage |
| Moisture Resistance (Steady State) | C/C 2% or 1pF (whichever is larger), IR 2500M or RiCR25S (whichever is smaller) | C/C 10%, IR 1000M or RiCR25S (whichever is smaller) |
| Temperature Cycle | C/C 1% or 1pF (whichever is larger) | C/C 10% |
| Durability | C/C 2% or 1pF (whichever is larger), IR 4000M or RiCR40S (whichever is smaller) | C/C 20%, IR 2000M or RiCR50S (whichever is smaller) |
Storage and Handling
| Aspect | Details |
|---|---|
| Guaranteed Solderability Period | 6 months (under delivered package condition) |
| Storage Temperature | 5~40 |
| Storage Relative Humidity | 20%~70% |
| Precautions for Use | MLCCs may fail short or open circuit. Avoid severe conditions beyond ratings. Capacitors may catch fire, burn, or explode under extreme conditions. Contact technical department for any uncertainties. |
| Soldering Profile | Follow recommended temperature curves to avoid chip cracking or local explosion due to sudden temperature changes. Refer to enclosure pages for graphs. |
| Manual Soldering | Handle with care to avoid thermal cracks. Avoid direct contact of soldering iron tip with ceramic body. Pay attention to tip selection and temperature control. |
| Solder Amount | Use optimum solder amounts to prevent chip damage from excessive stress or poor connection from insufficient solder. |
2410121646_Chinocera-HHV0603G0101J101NTHJ_C5186667.pdf
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