Product Overview
The Suining Hongming Huaci Technology Co., Ltd. offers a series of General Purpose Multilayer Ceramic Capacitors (MLCCs) designed for high-density and high-efficiency Surface Mount Technology (SMT) applications. These capacitors are manufactured using NP0 (C0G/C0H), X7R, X5R, X7S, and X6S dielectric materials, providing excellent electrical performance and high reliability. They are available in a wide range of sizes from 0201 to 1210, offering high capacitance in compact dimensions. Applications include general digital circuits, power supply bypass, consumer electronics, and the telecommunication industry.
Product Attributes
- Brand: HGC
- Supplier: Suining Hongming Huaci Technology Co., Ltd.
- Series: General Purpose Series (4V~63V)
- Dielectric Materials: NP0 (C0G/C0H), X7R, X5R, X7S, X6S
Technical Specifications
| Specification | Details |
|---|---|
| Part Name | Multilayer Ceramic Capacitors |
| Series | General Purpose Series (4V~63V) |
| Specification (Size) | 0201 ~ 1210 |
| Model Designation | HGC [Size] [Dielectric] [Capacitance] [Tolerance] [Rated Voltage] [Termination] [Packaging] [Thickness] [Reel Size] |
| Available Sizes (Inch/mm) | 0201 (0603), 0402 (1005), 0603 (1608), 0805 (2012), 1206 (3216), 1210 (3225) |
| Dielectric Characteristics |
|
| Rated Voltage (VDC) | 4V to 630V (and higher, e.g., 1kV, 1.5kV, etc.) |
| Capacitance Range | 0.3pF to 220F (varies by dielectric and size) |
| Tolerance Levels | 0.05pF, 0.1pF, 0.25pF, 0.5pF, 1%, 2%, 5%, 10%, 15%, 20%, -20%~+50% |
| Termination Types | Cu/Ni/Sn, Cu/Resin/Ni/Sn |
| Packaging Options | Paper taping, Bulk packaging, Embossed taping |
| Reel Sizes | 7 Inch, 13 Inch |
| External Dimensions (Example: 0805) | Length (L): 2.000.20 mm, Width (W): 1.250.20 mm, Thickness (T): 0.700.10 mm, 0.800.20 mm, 1.250.20 mm |
| Soldering Methods | Reflow Soldering (R), Wave Soldering (W) |
| Packaging Standard Quantity (Example: 0805, H thickness) | 4000 pcs per reel (Paper tape or Plastic tape) |
| Reliability Tests | Appearance, Dimension, Capacitance, Dissipation Factor (DF), Insulation Resistance (IR), Dielectric Withstanding Voltage (DWV), Solderability, Termination Adhesion, Resistance to Soldering Heat, Resistance to Flexure of Substrate, Moisture Resistance, Temperature Cycle, Durability. |
| Storage Conditions | Temperature: 5~40, Relative Humidity: 20%~70% |
| Guaranteed Solderability Period | 6 months (Under deliver package condition) |
2410121645_Chinocera-HGC1206R7681K500NTHJ_C5186925.pdf
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