Product Overview
The Multi-Layer Ceramic Capacitors (MLCC) from Suining Hongming Huaci Technology Co., Ltd. are designed for high-density, high-efficiency surface-mount applications. These capacitors are manufactured using NP0 (C0G, C0H) and X7R materials, offering superior electrical performance and high reliability. They are suitable for mid-high voltage series, ranging from 100V to 3000V, and are available in case sizes from 0402 to 1812. Key features include high voltage capability in a given case size and high stability and reliability. Applications span analog and digital modems, LAN/WAN interfaces, voltage multipliers, DC-DC converters, and back-lighting inverter circuits.
Product Attributes
- Brand: HHV (Series)
- Manufacturer: Suining Hongming Huaci Technology Co., Ltd.
- Material: NP0 (C0G, C0H), X7R
- Series: Mid-High Volts Series (100V~3000V)
- Origin: China (Implied by manufacturer name)
Technical Specifications
| Specification | Details |
|---|---|
| Product Name | Multilayer Ceramic Capacitors |
| Series | Mid-High Volts Series (100V~3000V) |
| Specification (Size) | 0402 ~ 1812 |
| Dielectric Materials | NP0 (C0G/C0H), X7R, X7S, X7T, X5R, X6R, X6S, X8R |
| Temperature Coefficient / Characteristics | C0G: 030 ppm/ (-55125) C0H: 060 ppm/ (-55125) X7R: 15% (-55125) X7S: 22% (-55125) |
| Case Sizes (Inch/mm) | 0402 (1005), 0603 (1608), 0805 (2012), 1206 (3216), 1210 (3225), 1808 (4520), 1812 (4532) |
| Rated Voltages (Vdc) | 100, 200, 250, 500, 630, 1000, 1500, 2000, 2500, 3000 |
| Capacitance Range (Example) | 0.5pF (0R5) to 1.0F (105) for C0G/C0H 100pF (101) to 4.7F (475) for X7R |
| Tolerance Levels | 0.05pF, 0.1pF, 0.25pF, 0.5pF, 1%, 2%, 5%, 10%, 15%, 20%, -20%~+50% |
| Termination Types | Cu/Ni/Sn, Cu/Resin/Ni/Sn |
| Packaging Options | Paper Taping, Bulk, Embossed Taping |
| Reel Sizes | 7 Inch, 13 Inch |
| Reliability Test Items | Appearance, Dimensions, Capacitance, Dissipation Factor (DF), Insulation Resistance (IR), Dielectric Withstanding Voltage (DWV), Solderability, Termination Adhesion, Resistance to Soldering Heat, Resistance to Flexure of Substrate, Moisture Resistance, Temperature Cycle, Durability |
| Storage Conditions | Temperature: 5~40, Relative Humidity: 20%~70% (Guaranteed solderability for 6 months) |
2410121646_Chinocera-HHV0603R7102K251NTHJ_C5186687.pdf
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