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Specifications
Voltage Rating:
50V
Capacitance:
1.2nF
Temperature Coefficient:
X7R
Tolerance:
±10%
Mfr. Part #:
HGC0603R7122K500NTHJ
Package:
0603
Key Attributes
Model Number:
HGC0603R7122K500NTHJ
Product Description
Product Overview
The Hongming Huaci Technology Multilayer Ceramic Capacitors (MLCC) are designed for high-density, high-efficiency SMT applications. These general-purpose series capacitors are manufactured using NP0 (C0G/C0H), X7R, X5R, X7S, and X6S dielectric materials, offering superior electrical performance and high reliability. Available in a wide range of sizes from 0201 to 1210, these capacitors provide high capacity in a small form factor. They are suitable for general digital circuits, power supply bypass, consumer electronics, and telecommunication industries.
Product Attributes
- Brand: Hongming Huaci Technology
- Product Name: Multilayer Ceramic Capacitors
- Series: General Purpose Series (4V~63V)
- Supplier: Suining Hongming Huaci Technology Co., Ltd.
- Origin: China (Implied by company name and language)
Technical Specifications
| Category | Specification | Details |
|---|---|---|
| General Information | Application | High density and high efficiency SMT application |
| Dielectric Materials | NP0 (C0G/C0H), X7R, X5R, X7S, X6S | |
| Key Benefits | High reliability and excellent electrical performance | |
| Product Features | Size Range | 0201 to 1210 |
| Capacity | High capacity and small size | |
| Applications | General Digital Circuit | Yes |
| Power Supply Bypass | Yes | |
| Consumer Electronics | Yes | |
| Telecommunication | Yes | |
| Model Designation | HGC [Size] [Dielectric] [Capacitance] [Tolerance] [Rated Voltage] [Termination] [Packaging] [Thickness Code] [Reel Size] | |
| Size Specifications | Inch (mm) | 0201 (0603) to 1210 (3225) |
| Length (L) | 0.600.03mm (0201) to 3.200.30mm (1210) | |
| Width (W) | 0.300.03mm (0201) to 2.500.30mm (1210) | |
| Thickness (T) | 0.300.03mm (0201) to 2.500.30mm (1210) | |
| Temperature Characteristics | Dielectric | C0G, C0H, X7R, X5R, X7S, X6S |
| Operating Temperature Range | -55 to 125 (varies by dielectric) | |
| Temperature Coefficient | 30 ppm/ (C0G), 15% (X7R), 15% (X5R), 22% (X7S), 22% (X6S) | |
| Packaging Quantity | 0201 (0603) | 15,000 pcs (Paper tape, 7" reel) |
| 0402 (1005) | 10,000 pcs (Paper tape, 7" reel) | |
| 0603 (1608) | 4,000 pcs (Paper tape, 7" reel) | |
| 0805 (2012) | 4,000 pcs (Paper tape, 7" reel) | |
| 1206 (3216) | 4,000 pcs (Paper tape, 7" reel) | |
| 1210 (3225) | 2,000 pcs (Plastic tape, 7" reel) | |
| Reliability Tests | Appearance | No remarkable defects or abnormalities |
| Capacitance Tolerance (Class I) | Within specified tolerance levels (e.g., 1% for C0G) | |
| Capacitance Tolerance (Class II) | Within specified tolerance levels (e.g., 10% for X7R) | |
| Dissipation Factor (DF) | Specified limits for Class I and Class II dielectrics | |
| Insulation Resistance (IR) | Specified limits (e.g., 50000M for Class I, 10000M for Class II) | |
| Dielectric Withstanding Voltage (DWV) | 300% Rated voltage (Class I), 250% Rated voltage (Class II) | |
| Solderability | 95% tinning rate, no visible damage | |
| Termination Adhesion | No visible damage, specified force and time | |
| Resistance to Soldering Heat | Specified C/C, DF, IR limits, no visible damage | |
| Resistance to Flexure of Substrate | C/C 10%, no visible damage | |
| Moisture Resistance (Steady State) | Specified C/C, DF, IR limits, no visible damage | |
| Temperature Cycle | Specified C/C limits | |
| Durability | Specified C/C, DF, IR limits, no visible damage | |
| Storage Methods | Guaranteed Solderability Period | 6 months (under delivered package condition) |
| Storage Conditions | Temperature: 5~40, Relative Humidity: 20%~70% | |
| Precautions for Use | General | MLCCs may fail in short or open circuit. Risk of burn out, flaming, or explosion under severe conditions. Follow specifications and contact technical department for unclear matters. |
| Soldering Profile | Follow recommended temperature profile charts to avoid cracking or explosion due to sudden temperature changes. | |
| Manual Soldering | Handle carefully to avoid thermal shock and damage. Pay attention to soldering iron tip selection and temperature control. Avoid direct contact with ceramic body. | |
| Solder Amount | Use optimum solder amount for reflow and wave soldering to ensure proper connection and avoid damage. | |
| Temperature Differential (T) | Minimize T during preheating (e.g., 150 for HGC0201-HGC1206, 130 for HGC1210 in reflow). | |
2410121645_Chinocera-HGC0603R7122K500NTHJ_C5186691.pdf
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