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Specifications
Voltage Rating:
250V
Capacitance:
20pF
Temperature Coefficient:
C0G
Mfr. Part #:
HHV0603G0200J251NTHJ
Package:
0603
Key Attributes
Model Number:
HHV0603G0200J251NTHJ
Product Description
Product Overview
The Suining Hongming Huaci Technology Co., Ltd. Multilayer Ceramic Capacitors (MLCC) are designed for high-density, high-efficiency surface mount applications. Available in the Mid-High Volts Series (100V~3000V) and sizes ranging from 0402 to 1812, these capacitors are manufactured using NP0 (C0G, C0H) and X7R dielectric materials, offering superior electrical performance and high reliability. Key features include high voltage capability in a given case size and excellent stability. They are suitable for applications such as analog and digital modems, LAN/WAN interfaces, voltage multipliers, DC-DC converters, and back-lighting inverter circuits.
Product Attributes
- Brand: Suining Hongming Huaci Technology Co., Ltd.
- Product Name: Multilayer Ceramic Capacitors
- Series: Mid-High Volts Series (100V~3000V)
- Dielectric Materials: NP0 (C0G, C0H), X7R
Technical Specifications
| Specification | Details |
|---|---|
| Product Name | Multilayer Ceramic Capacitors |
| Series | Mid-High Volts Series (100V~3000V) |
| Size Specification | 0402 ~ 1812 |
| Supplier | Suining Hongming Huaci Technology Co., Ltd. |
| Issue Date | 20201116 |
| Version | HC202002 |
| Description | High voltage ceramic capacitors for high density and high efficiency SMT application. Available in NP0(C0G/C0H)/X7R with high reliability and excellent electrical performance. |
| Features | High voltage in a given case size; High stability and reliability. |
| Applications | Analog & Digital Modems, LAN/WAN Interface, Voltage Multipliers, DC-DC Converters, Back-lighting Inverters. |
| How to Order - Series | HHV |
| How to Order - Size (Inch/mm) | 0402(1005), 0603(1608), 0805(2012), 1206(3216), 1210(3225), 1808(4520), 1812(4532) |
| How to Order - Dielectric | R5=X5R, R6=X6R, S6=X6S, R7=X7R, S7=X7S, T7=X7T, R8=X8R, G0=C0G, H0=C0H |
| How to Order - Capacitance | R75=0.75pF, 0R5=0.5pF, 1R0=1pF, 100=10pF, 101=100pF, 102=1000pF, 103=10nF, 104=100nF, 105=1F, 106=10F, 107=100F |
| How to Order - Tolerance | A=0.05pF, B=0.1pF, C=0.25pF, D=0.5pF, F=1%, G=2%, J=5%, K=10%, L=15%, M=20%, S=-20%~+50% |
| How to Order - Rated Voltage (Vdc) | 101=100, 201=200, 251=250, 501=500, 631=630, 102=1k, 152=1.5k, 202=2k, 252=2.5k, 302=3k, 402=4k, 502=5k, 602=6k |
| How to Order - Termination Type | N=Cu/Ni/Sn, C=Cu/Resin/Ni/Sn |
| How to Order - Packaging | T=Paper taping, B=Bulk packaging, S=Embossed taping |
| How to Order - Thickness Symbol | A=0.1mm, B=0.2mm, C=0.3mm, D=0.4mm, E=0.5mm, F=0.6mm, G=0.7mm, H=0.8mm, J=1.0mm, L=1.25mm, P=1.6mm, S=1.8mm, U=2.0mm, V=2.5mm, W=3.0mm |
| How to Order - Reel Size | J=7Inch, D=13Inch, K=7Inch 12mm width tape |
| Temperature Coefficient / Characteristics - C0G | Reference Temp: 20C, Temp Coeff: 030 ppm/, Operating Temp: -55125 |
| Temperature Coefficient / Characteristics - C0H | Reference Temp: 20C, Temp Coeff: 060 ppm/, Operating Temp: -55125 |
| Temperature Coefficient / Characteristics - X7R | Reference Temp: 20C, Temp Coeff: 15%, Operating Temp: -55125 |
| Temperature Coefficient / Characteristics - X7S | Reference Temp: 20C, Temp Coeff: 22%, Operating Temp: -55125 |
| External Dimensions - Size (Inch/mm) | 0402 (1005), 0603 (1608), 0805 (2012), 1206 (3216), 1210 (3225), 1808 (4520), 1812 (4532) |
| Soldering Method | R=Reflow Soldering, W=Wave Soldering |
| Packaging Standard Quantity - Paper Tape (Pieces) | 0402 (E): 10,000; 0603 (H): 4,000; 0805 (G): 4,000; 0805 (H): 4,000; 1206 (G): 4,000; 1206 (H): 4,000; 1808 (L): 2,000 |
| Packaging Standard Quantity - Plastic Tape (Pieces) | 0805 (L): 3,000; 1206 (J): 3,000; 1206 (L): 3,000; 1210 (L): 2,000; 1210 (P): 2,000; 1210 (U): 1,000; 1210 (V): 1,000; 1808 (L): 2,000; 1808 (P): 2,000; 1808 (U): 1,000; 1812 (L): 1,000; 1812 (P): 1,000; 1812 (U): 1,000; 1812 (V): 500 |
| Reliability Test - Appearance | No remarkable defects or abnormalities. |
| Reliability Test - Capacitance Measurement (Class I) | Test Temp: 253, C1000pF: 1MHz10%, 1.00.2Vrms; C1000pF: 1KHz10%, 1.00.2Vrms |
| Reliability Test - Capacitance Measurement (Class II) | Test Temp: 253, C10F: 1KHz10%, 1.00.2Vrms; C10F: 12024 Hz, 0.50.1Vrms |
| Reliability Test - Dissipation Factor (DF) (Class I) | 0.56% (Cr5 pF, 1MHz10%, 1.00.2Vrms); 1.5[(150/Cr)+7]10-4 (5pFCr50 pF, 1MHz10%); 0.15% (50pFCr1000 pF, 1MHz10%); 0.15% (1000 pF, 1KHz10%) |
| Reliability Test - Dissipation Factor (DF) (Class II) | 2.5% (Test Temp: 253, C10F: 1KHz10%, 1.00.2Vrms; C10F: 12024 Hz, 0.50.1Vrms) |
| Reliability Test - Insulation Resistance (IR) (Class I) | C10 nF: Ri50000M; C10 nF: RiCR500S (Test Voltage: Rated Voltage, Max 500V; Duration: 605s; Temp: 253; Humidity: 75%) |
| Reliability Test - Insulation Resistance (IR) (Class II) | C25 nF: Ri10000M; C25 nF: RiCR100S |
| Reliability Test - Dielectric Withstanding Voltage (DWV) | 100VVr500V: 200%Rated voltage for 5s; 500VVr1000V: 150%Rated voltage for 5s; 1000VVr2000V: 120%Rated voltage for 5s; 2000VVr5000V: 120%Rated voltage for 5s. Max current 50mA (or 10mA for Vr>2000V). |
| Reliability Test - Solderability | 95% tinning rate, no visible damage. Lead solder: 2355 for 20.5s. Lead-free solder: 2455 for 20.5s. |
| Reliability Test - Termination Adhesion | No visible damage. Force: 5N (0402-0805), 10N (1206). Duration: 101S. |
| Reliability Test - Resistance to Soldering Heat | Electrical performance and appearance requirements met. Preheating: 100-200 for 20.5min. Solder Temp: 2655 for 101s. Recovery: 242h. |
| Reliability Test - Resistance to Flexure of Substrate | C/C: 10%; Appearance: No visible damage. Test Board: PCB 1.60.2mm thickness. Flexure: 1mm. Speed: 1mm/sec. Holding: 51s. |
| Reliability Test - Moisture Resistance (Steady State) | C/C: Class I 2% or 1pF (whichever is larger), Class II 10%. DF: 2x initial. IR: Class I 2500M or RiCR25S (whichever is smaller), Class II 1000M or RiCR25S (whichever is smaller). Temp: 402, Humidity: 90%~95%RH, Duration: 500h. Recovery: 242h. |
| Reliability Test - Temperature Cycle | C/C: Class I 1% or 1pF (whichever is larger), Class II 10%. 5 cycles: -55 (30min) -> +20 (2-3min) -> +125 (30min) -> +20 (2-3min). Recovery: 242h. |
| Reliability Test - Durability | C/C: Class I 2% or 1pF (whichever is larger), Class II 20%. Voltage: 2x rated (<500V), 1.5x rated (500-1000V), 1.2x rated (>1000V). Temp: 125. Duration: 1000h. Recovery: 242h. |
| Storage Method | Guaranteed solderability for 6 months. Storage Temp: 5~40, Relative Humidity: 20%~70%. |
| Soldering Profile - Reflow Soldering (SnPb) | Refer to provided profile graph. T 150 (0603/0805/1206), T 130 (1210/1808/1812). |
| Soldering Profile - Reflow Soldering (Lead-free) | Refer to provided profile graph. T 150 (0603/0805/1206), T 130 (1210/1808/1812). |
| Soldering Profile - Wave Soldering | Refer to provided profile graph. T 150 (0603/0805/1206). |
| Soldering Profile - Hand Soldering | Preheating: 130. Iron Tip Temp: Max 350. Power: Max 20W. Tip Diameter: 1mm recommended. Duration: Max 3s. Solder Paste: 1/2 chip thickness. Avoid direct contact with ceramic. |
2410121646_Chinocera-HHV0603G0200J251NTHJ_C5186672.pdf
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