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Specifications
Voltage Rating:
50V
Capacitance:
560pF
Temperature Coefficient:
X7R
Tolerance:
±10%
Mfr. Part #:
HGC0603R7561K500NTHJ
Package:
0603
Key Attributes
Model Number:
HGC0603R7561K500NTHJ
Product Description
Product Overview
The Suining Hongming Huaci Technology Co., Ltd. Multilayer Ceramic Capacitors (MLCC) - General Purpose Series (4V~63V) are designed for high-density and high-efficiency SMT applications. These capacitors are manufactured using NP0 (C0G, C0H), X7R, X5R, X7S, and X6S dielectrics, offering excellent electrical performance and high reliability. Available in a wide range of sizes from 0201 to 1210, they provide high capacitance in compact dimensions. Key applications include general digital circuits, power supply bypass, consumer electronics, and the telecommunication industry.
Product Attributes
- Brand: HGC
- Supplier: Suining Hongming Huaci Technology Co., Ltd.
- Series: General Purpose Series (4V~63V)
- Dielectric Materials: NP0 (C0G/C0H), X7R, X5R, X7S, X6S
- Origin: China
Technical Specifications
| Category | Specification | Details | |||
|---|---|---|---|---|---|
| General Information | Part Name | Multilayer Ceramic Capacitors | |||
| Series | General Purpose Series (4V~63V) | ||||
| Specification Size Range | 0201 ~ 1210 | ||||
| Features | Size Range | 0201 to 1210 | |||
| Capacitance Density | High capacity and small size achieved | ||||
| Applications | Digital Circuits | General digital circuit | |||
| Power Supply | Bypass capacitors | ||||
| Consumer Electronics | Consumer electronics | ||||
| Telecommunications | Telecommunication industry | ||||
| General Purpose | General purpose | ||||
| Ordering Information (Example: HGC 0805 R7 104 K 500 N T H J) | Series Code | HGC | |||
| Size (inch/mm) | 0201 (0603), 0402 (1005), 0603 (1608), 0805 (2012), 1206 (3216), 1210 (3225) | ||||
| Dielectric | R5=X5R, R7=X7R, G0=C0G | ||||
| Capacitance | e.g., 104 = 100nF, 105 = 1F, 106 = 10F | ||||
| Tolerance | A=0.05pF, B=0.1pF, C=0.25pF, D=0.5pF, F=1%, G=2%, J=5%, K=10%, L=15%, M=20%, S=-20%~+50% | ||||
| Rated Voltage (VDC) | 4R0=4V, 6R3=6.3V, 100=10V, 160=16V, 250=25V, 500=50V, 101=100V, etc. | ||||
| Termination Type | N=Cu/Ni/Sn, C=Cu/Resin/Ni/Sn | ||||
| Packaging | T=Paper taping, B=Bulk, S=Embossed taping | ||||
| Thickness Code (mm) | A=0.1mm, B=0.2mm, C=0.3mm, D=0.4mm, E=0.5mm, F=0.6mm, G=0.7mm, H=0.8mm, J=1.0mm, L=1.25mm, P=1.6mm, S=1.8mm, U=2.0mm, V=2.5mm, W=3.0mm | ||||
| Reel Size | J=7Inch, D=13Inch, K=7Inch (12mm width tape) | ||||
| Temperature Coefficient / Characteristics | Dielectric | Reference Temp. Point | Temp. Coefficient | Operating Temp. Range | |
| C0G | 20C | 0 30 ppm/ | -55C ~ 125C | ||
| C0H | 20C | 0 60 ppm/ | -55C ~ 125C | ||
| X7R | 20C | 15% | -55C ~ 125C | ||
| X5R | 20C | 15% | -55C ~ 85C | ||
| X7S | 20C | 22% | -55C ~ 125C | ||
| X6S | 20C | 22% | -55C ~ 105C | ||
| External Dimensions (mm) | Size (inch/mm) | Length L | Width W | Thickness T (Code) | Terminal Width MB |
| 0201 (0603) | 0.600.03 | 0.300.03 | 0.300.03 (C) | 0.150.05 | |
| 0402 (1005) | 1.000.05 | 0.500.05 | 0.500.05 (E) | 0.250.10 | |
| 0603 (1608) | 1.600.20 | 0.800.20 | 0.800.20 (H) | 0.400.15 | |
| 0805 (2012) | 2.000.20 | 1.250.20 | 0.700.10 (G), 0.800.20 (H), 1.250.20 (L) | 0.500.20 | |
| 1206 (3216) | 3.200.20 | 1.600.20 | 0.700.10 (G), 0.800.20 (H), 1.000.10 (J), 1.250.20 (L), 1.600.20 (P) | 0.600.20 | |
| 1210 (3225) | 3.200.30 | 2.500.30 | 1.250.20 (L), 1.600.20 (P), 2.000.20 (U), 2.500.30 (V) | 0.750.25 | |
| Packaging Standard Quantity | Size | Thickness (mm)/Symbol | Paper Tape (7" reel) | Plastic Tape (7" reel) | |
| 0201 (0603) | 0.300.03 (C) | 15,000 | - | ||
| 0402 (1005) | 0.500.05 (E) | 10,000 | - | ||
| 0603 (1608) | 0.800.20 (H) | 4000 | - | ||
| 0805 (2012) | 0.700.10 (G), 0.800.20 (H) | 4000 | 2000/3000 (L) | ||
| 1206 (3216) | 0.700.10 (G), 0.800.20 (H) | 4000 | 3000 (J, L) | ||
| 1210 (3225) | 1.250.20 (L), 1.600.20 (P), 2.000.20 (U), 2.500.30 (V) | - | 2000 (L, P, U), 1000 (V) | ||
| Capacitance Range and Rated Voltage | Dielectric | Size | Rated Voltage (VDC) | Capacitance | |
| C0G, C0H | 0201 to 1210 | 16, 25, 50, 100, etc. | 0.3pF to 0.10F | ||
| X7R | 0201 to 1210 | 6.3, 10, 16, 25, 50, etc. | 100pF to 47F | ||
| X7S | 0402 to 1210 | 6.3, 10, 16, 25, 50, 100, etc. | 1.0F to 100F | ||
| X5R | 0201 to 1210 | 4, 6.3, 10, 16, 25, 35, 50, etc. | 100pF to 220F | ||
| X6S | 0402 to 1210 | 4, 6.3, 10, 16, 25, 50, etc. | 0.10F to 220F | ||
| Reliability Test | Appearance & Electrical Performance | Visual inspection, dimensional checks, capacitance, DF, IR, DWV tests | Details specified in document | ||
| Environmental Tests | Solderability, Termination Adhesion, Resistance to Soldering Heat, Flexure, Moisture Resistance, Temperature Cycle, Durability | Details specified in document | |||
| Test Conditions | Various temperatures, humidity levels, voltages, and durations as per standards | Refer to document for specific parameters | |||
| Packaging | Taping Structure | Paper Taping (0201, 0402, 0603, 0805, 1206) and Embossed Taping (0805~1812) | Dimensions and specifications provided | ||
| Reel Dimensions | 7" Reel and 13" Reel available | Diameter, core size, etc. specified | |||
| Taping Specification | Top tape peeling strength: 0.1N < strength < 0.7N | No paper debris on tape | |||
| Standard Quantity | Varies by size and thickness (e.g., 15,000 for 0201 paper tape) | Refer to table for specific quantities | |||
| Storage Methods | Guaranteed solderability period: 6 months (in delivered package) | Storage Temperature: 5C~40C, Relative Humidity: 20%~70% | |||
| Precautions for Use | General | MLCCs can fail short or open circuit. Risk of fire, burn, or explosion under severe conditions. Follow specifications. | Contact technical department for unclear issues. | ||
| Soldering Conditions | Follow recommended temperature profiles to avoid cracking or explosion. Avoid sudden temperature changes. | Refer to soldering profile charts. | |||
| Manual Soldering | Handle carefully to avoid thermal shock. Pay attention to soldering iron tip selection and temperature control. Avoid direct contact with ceramic body. | Avoid direct contact between soldering iron head and ceramic components. | |||
| Soldering Amount | Optimum solder amount for reflow and wave soldering. Avoid too much or too little solder. | Refer to diagrams for recommended amounts. | |||
| Recommended Soldering Temperature Profile | Reflow Soldering (Leaded/Lead-free), Wave Soldering, Hand Soldering | Specific temperature profiles and conditions provided for each method. T limits specified. | |||
| Typical Characteristic Data Graph | |Z|-Frequency Characteristics, Temperature Characteristics, DC Bias Characteristics | For reference only. |
2410121645_Chinocera-HGC0603R7561K500NTHJ_C5186718.pdf
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