Product Overview
The HGC General Purpose Series Multilayer Ceramic Capacitors (MLCCs) are designed for high-density, high-efficiency SMT applications. These capacitors are manufactured using NP0 (C0G/C0H), X7R, X5R, X7S, and X6S dielectrics, offering excellent electrical performance and high reliability. They are available in a wide range of sizes from 0201 to 1210 and provide high capacitance in small packages. Ideal for general digital circuits, power supply bypass, consumer electronics, and telecommunication industries.
Product Attributes
- Brand: HGC
- Supplier: Suining Hongming Huaci Technology Co., Ltd.
- Series: General Purpose Series (4V~63V)
- Dielectric Materials: NP0 (C0G/C0H), X7R, X5R, X7S, X6S
Technical Specifications
| Category | Specification | Details | |||
|---|---|---|---|---|---|
| Part Name | Multilayer Ceramic Capacitors | ||||
| Series | General Purpose Series (4V~63V) | ||||
| Available Sizes | 0201 ~ 1210 | ||||
| Model Designation | HGC [Size] [Dielectric] [Capacitance] [Tolerance] [Rated Voltage] [Termination] [Packaging] [Thickness Code] [Reel Size] | ||||
| Dielectric Characteristics | C0G (NP0) | Temp. Coefficient: 0 30 ppm/; Operating Temp: -55125 | |||
| C0H | Temp. Coefficient: 0 60 ppm/; Operating Temp: -55125 | ||||
| X7R | Temp. Coefficient: 15%; Operating Temp: -55125 | ||||
| X5R | Temp. Coefficient: 15%; Operating Temp: -5585 | ||||
| X7S | Temp. Coefficient: 22%; Operating Temp: -55125 | ||||
| X6S | Temp. Coefficient: 22%; Operating Temp: -55105 | ||||
| Class I vs Class II Note | Class I: Capacitance change between 20 and 85. Class II: Capacitance change relative to 20 across operating range. | ||||
| Product Dimensions (mm) | Size | Length (L) | Width (W) | Thickness (T) / Code | Termination Width (MB) |
| 0201 (0603) | 0.600.03 | 0.300.03 | 0.300.03 (C) | 0.150.05 | |
| 0402 (1005) | 1.000.05 | 0.500.05 | 0.500.05 (E) | 0.250.10 | |
| 0603 (1608) | 1.600.20 | 0.800.20 | 0.800.20 (H) | 0.400.15 | |
| 0805 (2012) | 2.000.20 | 1.250.20 | 0.700.10 (G), 0.800.20 (H), 1.250.20 (L) | 0.500.20 | |
| 1206 (3216) | 3.200.20 | 1.600.20 | 0.700.10 (G), 0.800.20 (H), 1.000.10 (J), 1.250.20 (L), 1.600.20 (P) | 0.600.20 | |
| 1210 (3225) | 3.200.30 | 2.500.30 | 1.250.20 (L), 1.600.20 (P), 2.000.20 (U), 2.500.30 (V) | 0.750.25 | |
| Packaging Quantity | Size | Thickness (mm) / Symbol | Paper Tape (7" Reel) | Embossed Tape (7" Reel) | |
| 0201 (0603) | 0.300.03 (C) | 15,000 | - | ||
| 0402 (1005) | 0.500.05 (E) | 10,000 | - | ||
| 0603 (1608) | 0.800.20 (H) | 4,000 | - | ||
| Applications | General digital circuit, Power supply bypass, Consumer electronics, Telecommunication industry | ||||
| Soldering Methods | Reflow Soldering (R), Wave Soldering (W) | ||||
| Storage Conditions | Temperature: 5~40, Relative Humidity: 20%~70% | ||||
Capacitance Range and Rated Voltage (Examples)
| Dielectric | Size | Rated Voltage (VDC) | Capacitance |
|---|---|---|---|
| C0G (NP0) | 0201 | 16, 25, 50 | 0.3pF - 0.10F |
| 0805 | 10, 16, 25, 50 | 0.8pF - 0.10F | |
| 1210 | 10, 16, 25, 50 | 1.2pF - 0.10F | |
| X7R | 0201 | 6.3, 10, 16, 25, 50 | 100pF - 0.10F |
| 0805 | 6.3, 10, 16, 25, 50 | 100pF - 1.0F | |
| 1210 | 10, 16, 25, 50 | 100pF - 47F | |
| X5R | 0805 | 6.3, 10, 16, 25, 35, 50 | 100pF - 1.0F |
| 1210 | 4, 6.3, 10, 16, 25, 35, 50 | 100pF - 100F |
Reliability Test Summary
| Test Item | Technical Requirements | Test Method |
|---|---|---|
| Appearance | No remarkable defects or abnormalities. | Microscope (10) |
| Size | Within specified range. | Vernier caliper |
| Capacitance Tolerance | Within specified tolerance levels. | Specified conditions (frequency, voltage, temperature). |
| Dissipation Factor (DF) | Meets specified limits based on dielectric, size, and voltage. | Specified conditions. |
| Insulation Resistance (IR) | Meets specified limits (M or MF). | Specified voltage, time, temperature, humidity. |
| Dielectric Withstanding Voltage (DWV) | No breakdown or damage. | 300% Rated Voltage (Class I), 250% Rated Voltage (Class II) for 1-5s. |
| Solderability | 95% tin coverage, no visible damage. | Lead/Lead-free solder bath at specified temperatures and times. |
| Termination Adhesion | No visible damage. | Applied force for specified time (e.g., 5N for 101S for 0402-0805). |
| Resistance to Soldering Heat | C/C, DF, IR within limits; appearance intact. | Preheating, specified solder temperature/time, recovery. |
| Resistance to Flexure of Substrate | C/C 10%; no visible damage. | Bending test on PCB substrate. |
| Moisture Resistance (Steady State) | C/C, DF, IR within limits; appearance intact. | 402, 90%~95%RH for 500h, with recovery. |
| Temperature Cycle | C/C within limits; appearance intact. | 5 cycles of specified temperature extremes (-55 to +125/85/105) with dwell times, with recovery. |
| Durability | C/C, DF, IR within limits; appearance intact. | 1.5x Rated Voltage at elevated temperatures (125/85/105) for 1000h, with recovery. |
Packaging Details
| Packaging Type | Size | Tape Dimensions (mm) | Reel Size | Quantity per Reel |
|---|---|---|---|---|
| Paper Taping | 0201 (0603) | A0: 0.370.10, B0: 0.670.10, W: 8.000.10, F: 3.500.05, P1: 1.750.10, P2: 2.000.05 | 7" | 15,000 |
| 0402 (1005) | A0: 0.650.10, B0: 1.150.10, W: 8.000.10, F: 3.500.05, P1: 1.750.10, P2: 2.000.05 | 7" | 10,000 | |
| 0603 (1608) | A: 1.100.10, B: 1.900.10, C: 8.000.10, D: 3.500.05, E: 1.750.10, F: 4.000.10, G: 2.000.10 | 7" | 4,000 | |
| Embossed Taping | 0805 | A: 1.550.20, B: 2.350.20, C: 8.000.20, D: 3.500.05, E: 1.750.10, F: 4.000.10, G: 2.000.10 | 7" | 4,000 |
| 1206 | A: 1.950.20, B: 3.600.20, C: 8.000.20, D: 3.500.05, E: 1.750.10, F: 4.000.10, G: 2.000.10 | 7" | 3,000 | |
| 1210 | A: 2.700.10, B: 3.420.10, C: 8.000.10, D: 3.500.05, E: 1.750.10, F: 4.000.10, G: 2.000.05 | 7" | 2,000 | |
| Reel Dimensions | 8mm/7" REEL | A: 1782.0, B: 3.0, C: 130.5, D: 210.8, E: 50 or more, F: 10.01.5, G: 14.4max | - | - |
| Top Tape Peeling Strength | 0.1N < peeling strength < 0.7N | |||
Precautions for Use
MLCCs may fail in short or open circuit. Operation in severe environments exceeding specified ratings or external mechanical stress can lead to burn out, flaming, or explosion. Always adhere to the specifications and consult technical support for any uncertainties. Avoid sudden temperature changes during soldering to prevent cracking or explosion. Ensure proper solder amount for good connection and mechanical strength. Follow recommended temperature profiles for reflow, wave, and hand soldering. Avoid direct contact of soldering iron tip with the ceramic body.
Typical Characteristic Data
Includes |Z|-Frequency Characteristics, Temperature Characteristics, and DC Bias Characteristics curves (for reference only).
2410121645_Chinocera-HGC0805G0150J500NTGJ_C5186731.pdf
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