Product Overview
The Hongming Huaci Technology Multilayer Ceramic Capacitors (MLCC) are designed for high-density, high-efficiency SMT applications. Available in a general-purpose series with voltage ratings from 4V to 63V and sizes ranging from 0201 to 1210, these capacitors offer excellent electrical performance and high reliability. They are manufactured using NP0 (C0G/C0H), X7R, X5R, X7S, and X6S dielectric materials, making them suitable for a wide range of applications including general digital circuits, power supply bypass, consumer electronics, and telecommunication industries.
Product Attributes
- Brand: Hongming Huaci Technology
- Series: General Purpose Series (4V~63V)
- Supplier: Suining Hongming Huaci Technology Co., Ltd.
- Issue Date: 20201116
- Version: HC202002
Technical Specifications
| Category | Specification | Details |
|---|---|---|
| Product Name | Multilayer Ceramic Capacitors | - |
| Series | General Purpose Series | 4V~63V |
| Specification (Size) | 0201 ~ 1210 | - |
| Dielectric Materials | NP0 (C0G/C0H), X7R, X5R, X7S, X6S | - |
| Key Features | Wide size selection | 0201 to 1210 |
| High capacity in small size | - | |
| Applications | General digital circuits | - |
| Power supply bypass capacitors | - | |
| Consumer electronics | - | |
| Telecommunication industry | - | |
| Model Representation | Series Code | HGC (General Purpose) |
| Size | 0201 (0603) to 1210 (3225) | |
| Dielectric | R5 (X5R), R7 (X7R), G0 (C0G) | |
| Capacitance | e.g., 104 (100nF), 105 (1F), 106 (10F) | |
| Temperature Coefficient/Characteristics | C0G/C0H | -55125, 30 ppm/ to 60 ppm/ |
| X7R/X5R/X7S/X6S | -55 to 125, 15% to 22% | |
| External Dimensions (Example: 0805) | Length (L) | 2.000.20 mm |
| Width (W) | 1.250.20 mm | |
| Thickness (T) | 0.700.10 mm (G), 0.800.20 mm (H), 1.250.20 mm (L) | |
| Terminal Width (MB) | 0.500.20 mm, 0.800.20 mm | |
| Packaging Standard Quantity (Example: 0805) | Paper tape (7" reel) | 4000 pcs (for thickness G or H) |
| Plastic tape (7" reel) | 2000/3000 pcs (for thickness L) | |
| Capacitance Range & Rated Voltage (Example: C0G) | Size 0201 | Capacitance: 0.3pF to 0.10F; Rated Voltage: 16V, 25V, 50V |
| Size 0402 | Capacitance: 0.3pF to 0.10F; Rated Voltage: 16V, 25V, 50V | |
| Size 0603 | Capacitance: 0.3pF to 0.10F; Rated Voltage: 16V, 25V, 50V | |
| Size 0805 | Capacitance: 0.3pF to 0.10F; Rated Voltage: 10V, 16V, 25V, 50V | |
| Size 1206 | Capacitance: 1.2pF to 0.10F; Rated Voltage: 10V, 16V, 25V, 50V | |
| Size 1210 | Capacitance: 1.2pF to 0.10F; Rated Voltage: 10V, 16V, 25V, 50V | |
| Size 0805 (X7R) | Capacitance: 100pF to 1.0F; Rated Voltage: 6.3V to 50V | |
| Size 1210 (X7R) | Capacitance: 100pF to 47F; Rated Voltage: 10V to 50V | |
| Size 0805 (X5R) | Capacitance: 100pF to 1.0F; Rated Voltage: 6.3V to 50V | |
| Size 1210 (X5R) | Capacitance: 100pF to 100F; Rated Voltage: 4V to 50V | |
| Reliability Test (Appearance) | No remarkable defects or abnormalities. | Microscope (10) |
| Reliability Test (Size) | Within specified size range. | Vernier caliper |
| Reliability Test (Capacitance) | Within specified tolerance. | 253, specific frequency and voltage conditions apply. |
| Reliability Test (Dissipation Factor) | Refer to table for Class I and Class II specifications. | 253, specific frequency and voltage conditions apply. |
| Reliability Test (Insulation Resistance) | Class I: Ri50000M (C10nF) or RiCR500S (C>10nF). Class II: Ri10000M (C25nF) or RiCR>100S (C>25nF). | Rated voltage, 605 sec, 253, 75% RH. |
| Reliability Test (Dielectric Withstanding Voltage) | No breakdown or damage. | Class I: 300% Rated voltage; Class II: 250% Rated voltage, 1~5s. |
| Reliability Test (Solderability) | 95% tin coverage, no visible damage. | Lead-free: 2455, 20.5s. |
| Reliability Test (Termination Adhesion) | No visible damage. | Force applied: 2N (0201), 5N (0402-0805), 10N (1206). |
| Reliability Test (Resistance to Soldering Heat) | C/C 0.5% (Class I), -5%~+10% (Class II). DF and IR within initial standards. | Solder temp: 2655, 101s. Recovery: 242h. |
| Reliability Test (Moisture Resistance) | C/C 2% or 1pF (Class I), 10% (Class II). DF/IR within limits. | 402, 90%~95%RH, 500h. Recovery: 242h. |
| Reliability Test (Temperature Cycle) | C/C 1% or 1pF (Class I), 10% (Class II). | 5 cycles: -55 to +125 (or other specified temps), 30 min per step. Recovery: 242h. |
| Reliability Test (Durability) | C/C 2% or 1pF (Class I), 20% (Class II). DF/IR within limits. | 1.5x Rated Voltage at elevated temperatures (125/85/105), 1000h. Recovery: 242h. |
| Packaging (Paper Taping Dimensions) | 0201: 0.370.10 A0, 0.670.10 B0, 8.000.10 W | - |
| Packaging (Embossed Taping Dimensions) | 0805: 1.550.20 A, 2.350.20 B, 8.000.20 C | - |
| Packaging (Reel Dimensions) | 7" Reel: 1782.0 A, 3.0 B, 130.5 C | - |
| Storage Method | Temperature: 5~40, Relative Humidity: 20%~70%. Guaranteed solderability for 6 months. | - |
| Precautions for Use | Avoid short circuit, open circuit, severe conditions, and external mechanical stress. Follow specifications for safe operation. | - |
| Soldering Profile | Refer to temperature profile charts for reflow and wave soldering. Minimize temperature differential (T). | Reflow T 150 (0201-1206), T 130 (1210). Wave T 150 (0603-1206). |
| Manual Soldering | Handle carefully to avoid thermal shock. Avoid direct contact of soldering iron with ceramic body. Max temp: 350, Max power: 20W, Max time: 3s. | - |
| Solder Amount | Optimal amount for reflow, wave, and rework soldering. Avoid too much or too little solder. | - |
2410121645_Chinocera-HGC0805G0471J500NTGJ_C5186756.pdf
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