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Specifications
Voltage Rating:
100V
Capacitance:
33pF
Temperature Coefficient:
C0G
Mfr. Part #:
HHV0805G0330J101NTGJ
Package:
0805
Key Attributes
Model Number:
HHV0805G0330J101NTGJ
Product Description
Product Overview
The HHV series of Multilayer Ceramic Capacitors (MLCCs) from Suining Hongming Huaci Technology Co., Ltd. are designed for high-density, high-efficiency surface mount applications. These capacitors are manufactured using NP0 (C0G/C0H) and X7R dielectric materials, offering superior electrical performance and high reliability. Key features include high voltage capability within a given case size and high stability. They are suitable for applications such as analog and digital modems, LAN/WAN interfaces, voltage multipliers, DC-DC converters, and back-lighting inverter circuits.
Product Attributes
- Brand: HHV Series
- Manufacturer: Suining Hongming Huaci Technology Co., Ltd.
- Origin: China
- Dielectric Materials: NP0 (C0G/C0H), X7R
Technical Specifications
| Category | Specification | Details |
|---|---|---|
| Series | Series Name | Mid-High Volts Series (HHV) |
| Voltage Range | 100V ~ 3000V | |
| Size Specification | Case Sizes | 0402 ~ 1812 |
| Temperature Coefficient / Characteristics | C0G (C0H) | Reference Temperature: 20C, Temp. Coefficient: 30 ppm/, Operating Temp: -55C ~ 125C |
| X7R | Reference Temperature: 20C, Temp. Coefficient: 15%, Operating Temp: -55C ~ 125C | |
| External Dimensions | Size (Inch/mm) | 0402 (1005), 0603 (1608), 0805 (2012), 1206 (3216), 1210 (3225), 1808 (4520), 1812 (4532) |
| Length (L), Width (W), Thickness (T) | Refer to page 3 for detailed dimensions per size. | |
| Soldering Method | Reflow Soldering (R), Wave Soldering (W) | |
| Packaging Standard Quantity | Quantity per Reel | Varies by size and thickness; refer to page 7 for details. |
| Capacitance Range and Rated Voltage | C0G/C0H Dielectric | Refer to page 8 for detailed capacitance and voltage combinations per size. |
| X7R Dielectric | Refer to page 9 for detailed capacitance and voltage combinations per size. | |
| Reliability Test | Appearance and Electrical Performance Test | Includes tests for Appearance, Size, Capacitance, Dissipation Factor (DF), Insulation Resistance (IR). Refer to pages 7-8 for detailed requirements and test methods. |
| Reliability Tests | Includes Dielectric Withstanding Voltage, Solderability, Termination Adhesion, Resistance to Soldering Heat, Resistance to Flexure, Moisture Resistance, Temperature Cycle, Durability. Refer to pages 8-10 for detailed requirements and test methods. | |
| Storage Method | Guaranteed Solderability Period | 6 months (under delivered package condition) |
| Storage Conditions | Temperature: 5~40, Relative Humidity: 20%~70% | |
| Soldering Conditions | Reflow Soldering Profile | Refer to pages 17-18 for SnPb and Lead-free profiles. |
| Wave Soldering Profile | Refer to page 19 for profile details. | |
| Manual Soldering Conditions | Refer to page 19 for details on preheating, tip temperature, power, diameter, and time. |
2410121646_Chinocera-HHV0805G0330J101NTGJ_C5186747.pdf
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