Product Overview
The Hongming Huaci Technology Multilayer Ceramic Capacitors (MLCC) are designed for high-density, high-efficiency surface-mount applications. These general-purpose series capacitors are available in a wide range of sizes from 0201 to 1210 and offer excellent electrical performance and high reliability. They are manufactured using NP0 (C0G/C0H), X7R, X5R, X7S, and X6S dielectric materials, making them suitable for various applications including general digital circuits, power supply bypass, consumer electronics, and telecommunications.
Product Attributes
- Brand: Hongming Huaci Technology
- Series: General Purpose Series (4V~63V)
- Origin: Suining Hongming Huaci Technology Co., Ltd.
Technical Specifications
| Specification | Details |
|---|---|
| Product Name | Multilayer Ceramic Capacitors |
| Series | General Purpose Series (4V~63V) |
| Available Sizes | 0201 ~ 1210 |
| Dielectric Materials | NP0 (C0G/C0H), X7R, X5R, X7S, X6S |
| Key Features | Wide selection of sizes (0201 to 1210), High capacity in small size |
| Applications | General digital circuits, Power supply bypass, Consumer electronics, Telecommunication |
| How to Order (Example Breakdown) | HGC (Series) + Size (e.g., 0805) + Dielectric (e.g., R7=X7R) + Capacitance (e.g., 104=100nF) + Tolerance (e.g., K=10%) + Rated Voltage (e.g., 500=50V) + Termination (e.g., N=Cu/Ni/Sn) + Packaging (e.g., T=Paper taping) + Thickness Code (e.g., H=0.8mm) + Reel Size (e.g., J=7Inch) |
| Temperature Coefficients/Characteristics |
|
| External Dimensions (Example: 0201) | L: 0.600.03mm, W: 0.300.03mm, T: 0.300.03mm |
| Soldering Method | Reflow Soldering (R), Wave Soldering (W) |
| Packaging Standard Quantity (Example: 0603) | Paper tape: 4000 pcs/7" reel |
| Capacitance Range & Rated Voltage | Extensive range detailed in tables 8-1 through 8-5, covering various dielectrics, sizes, and voltage ratings. |
| Reliability Test Items | Appearance, Size, Capacitance, Dissipation Factor, Insulation Resistance, Dielectric Withstanding Voltage, Solderability, Termination Adhesion, Resistance to Soldering Heat, Resistance to Flexure of Substrate, Moisture Resistance (Steady State), Temperature Cycle, Durability. |
| Storage Conditions | Temperature: 5~40, Relative Humidity: 20%~70% (Guaranteed solderability for 6 months) |
| Soldering Profile | Recommended temperature profiles for Reflow Soldering, Wave Soldering, and Hand Soldering are provided, with specific T requirements for different series. |
2410121645_Chinocera-HGC0603G0390J500NTHJ_C5186678.pdf
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