Product Overview
The Suining Hongming Huaci Technology Co., Ltd. Multilayer Ceramic Capacitors (MLCC) are designed for high-density, high-efficiency surface mount applications. These capacitors are manufactured using NP0 (C0G, C0H) and X7R dielectrics, offering superior electrical performance and high reliability. They are suitable for mid-to-high voltage series, ranging from 100V to 3000V, with sizes from 0402 to 1812. Key features include high voltage capability in a given case size and high stability and reliability. Applications include analog & digital modems, LAN/WAN interfaces, voltage multipliers, DC-DC converters, and back-lighting inverters.
Product Attributes
- Brand: Suining Hongming Huaci Technology Co., Ltd.
- Series: Mid-High Volts Series (100V~3000V)
- Dielectric Materials: NP0 (C0G/C0H), X7R, X7S, X7T, X5R, X6R, X6S, X8R
- Origin: China
Technical Specifications
| Category | Specification | Details |
|---|---|---|
| General | Model Series | HHV (Multilayer Ceramic Capacitors) |
| Supplier | Suining Hongming Huaci Technology Co., Ltd. | |
| Electrical Characteristics | Voltage Range | 100V to 3000V DC |
| Capacitance Range | 0.5pF to 100F (depending on dielectric and size) | |
| Temperature Coefficients | C0G: 0 30 ppm/ (-55125) C0H: 0 60 ppm/ (-55125) X7R: 15% (-55125) X7S: 22% (-55125) | |
| Physical Dimensions | Case Sizes | 0402 (1005) to 1812 (4532) |
| External Dimensions (Example: 0402) | Length (L): 1.000.05 mm Width (W): 0.500.05 mm Thickness (T): 0.500.05 mm | |
| Soldering Method | Reflow Soldering (R), Wave Soldering (W) | |
| Packaging | Standard Packaging | Paper Taping, Embossed Taping, Bulk |
| Reel Size | 7 Inch, 13 Inch | |
| Reliability | Dielectric Withstanding Voltage (DWV) | 100VVr500V: 200% Rated Voltage for 5s 500VVr1000V: 150% Rated Voltage for 5s 1000VVr2000V: 120% Rated Voltage for 5s 2000VVr5000V: 120% Rated Voltage for 5s |
| Solderability | 95% tinning rate, no visible damage. | |
| Moisture Resistance | 500 hours at 402, 90%~95%RH. | |
| Storage | Storage Conditions | Temperature: 5~40, Relative Humidity: 20%~70% (Guaranteed solderability for 6 months) |
2410121646_Chinocera-HHV0805G0330J251NTGJ_C5186749.pdf
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