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Specifications
Voltage Rating:
250V
Capacitance:
220pF
Temperature Coefficient:
X7R
Tolerance:
±10%
Mfr. Part #:
HHV0805R7221K251NTHJ
Package:
0805
Key Attributes
Model Number:
HHV0805R7221K251NTHJ
Product Description
Product Overview
The Multi-layer Ceramic Capacitors (MLCC) from Suining Hongming Huaci Technology Co., Ltd. are designed for high-density, high-efficiency surface mount applications. These capacitors are manufactured using NP0 (C0G/C0H) and X7R dielectric materials, offering superior electrical performance and high reliability. They are suitable for a wide range of applications including analog and digital modems, LAN/WAN interfaces, voltage multipliers, DC-DC converters, and back-lighting inverter circuits. Key features include high voltage in a given case size, high stability, and reliability.
Product Attributes
- Brand: HHV
- Manufacturer: Suining Hongming Huaci Technology Co., Ltd.
- Series: Mid-High Volts Series (100V~3000V)
- Dielectric Materials: NP0 (C0G/C0H), X7R, X5R, X6R, X6S, X7S, X7T, X8R
- Termination Types: Cu/Ni/Sn
- Packaging Options: Paper Taping, Bulk, Embossed Taping
Technical Specifications
| Specification | Details |
|---|---|
| Series | Mid-High Volts Series (100V~3000V) |
| Case Sizes (Inch/mm) | 0402 (1005), 0603 (1608), 0805 (2012), 1206 (3216), 1210 (3225), 1808 (4520), 1812 (4532) |
| Rated Voltage (Vdc) | 100V to 3000V (Varies by dielectric and size) |
| Capacitance Range | 0.5pF to 100F (Varies by dielectric and size) |
| Tolerance | 0.05pF, 0.1pF, 0.25pF, 0.5pF, 1%, 2%, 5%, 10%, 15%, 20%, -20%~+50% |
| Temperature Coefficient / Characteristics |
|
| External Dimensions (Example: 0402) | L: 1.000.05mm, W: 0.500.05mm, T: 0.500.05mm |
| Soldering Method | Reflow Soldering (R), Wave Soldering (W) |
| Packaging Standard Quantity (Example: 0402) | Paper tape: 10,000 pcs/7" reel |
| Reliability Test Items | Appearance, Size, Capacitance, Dissipation Factor (DF), Insulation Resistance (IR), Dielectric Withstanding Voltage (DWV), Solderability, Termination Adhesion, Resistance to Soldering Heat, Resistance to Flexure, Moisture Resistance, Temperature Cycle, Durability |
| Storage Conditions | Temperature: 5~40, Relative Humidity: 20%~70% |
| Guaranteed Period for Solderability | 6 months (Under deliver package condition) |
2410121646_Chinocera-HHV0805R7221K251NTHJ_C5186782.pdf
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