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Specifications
Voltage Rating:
50V
Capacitance:
4.7uF
Temperature Coefficient:
X7R
Tolerance:
±10%
Mfr. Part #:
HGC0805R7475K500NSLJ
Package:
0805
Key Attributes
Model Number:
HGC0805R7475K500NSLJ
Product Description
Product Overview
The Suining Hongming Huaci Technology Co., Ltd. offers Multilayer Ceramic Capacitors (MLCCs) from the General Purpose Series (4V~63V), designed for high-density and high-efficiency SMT applications. These capacitors are manufactured using NP0 (C0G, C0H), X7R, X5R, X7S, and X6S materials, providing excellent electrical performance and high reliability. They are available in a wide range of sizes from 0201 to 1210, offering high capacitance in compact dimensions. Key applications include general digital circuits, power supply bypass, consumer electronics, and the telecommunication industry.
Product Attributes
- Brand: HGC
- Supplier: Suining Hongming Huaci Technology Co., Ltd.
- Series: General Purpose Series (4V~63V)
- Dielectric Materials: NP0 (C0G/C0H), X7R, X5R, X7S, X6S
Technical Specifications
| Category | Specification | Details | ||
|---|---|---|---|---|
| Model Naming Convention | Series | HGC | ||
| Size (inch/mm) | 0201 (0603), 0402 (1005), 0603 (1608), 0805 (2012), 1206 (3216), 1210 (3225) | |||
| Dielectric Material Codes | R5=X5R, R7=X7R, G0=C0G | |||
| Capacitance Code Examples | 104=100nF, 105=1F, 106=10F | |||
| Tolerance Code Examples | J=5%, K=10%, M=20% | |||
| Rated Voltage Code Examples | 500=50 Vdc, 101=100 Vdc | |||
| Termination Type | N=Cu/Ni/Sn, C=Cu/Resin/Ni/Sn | |||
| Packaging | T=Paper taping, B=Bulk, S=Embossed taping | |||
| Dimensions (mm) | Size 0201 (0603) | L: 0.600.03, W: 0.300.03, T: 0.300.03 | ||
| Size 0402 (1005) | L: 1.000.05, W: 0.500.05, T: 0.500.05 | |||
| Size 0603 (1608) | L: 1.600.20, W: 0.800.20, T: 0.800.20 | |||
| Size 0805 (2012) | L: 2.000.20, W: 1.250.20, T: 0.700.10 / 0.800.20 / 1.250.20 | |||
| Size 1206 (3216) | L: 3.200.20, W: 1.600.20, T: 0.700.10 / 0.800.20 / 1.000.10 / 1.250.20 / 1.600.20 | |||
| Size 1210 (3225) | L: 3.200.30, W: 2.500.30, T: 1.250.20 / 1.600.20 / 2.000.20 / 2.500.30 | |||
| Temperature Coefficient / Characteristics | Dielectric | Reference Temp. Point | Temp. Coefficient | Operating Temp. Range |
| C0G | 20C | 30 ppm/ | -55125 | |
| C0H | 20C | 60 ppm/ | -55125 | |
| X7R | 20C | 15% | -55125 | |
| X5R | 20C | 15% | -5585 | |
| X7S | 20C | 22% | -55125 | |
| X6S | 20C | 22% | -55105 | |
| Packaging Standard Quantity | Size 0201 (0603), Thickness 0.300.03 (C) | Paper tape: 15,000 | ||
| Size 0402 (1005), Thickness 0.500.05 (E) | Paper tape: 10,000 | |||
| Size 0603 (1608), Thickness 0.800.20 (H) | Paper tape: 4,000 | |||
| Size 0805 (2012), Thickness 0.700.10 (G) | Paper tape: 4,000 | |||
| Size 1206 (3216), Thickness 0.700.10 (G) | Paper tape: 4,000 | |||
| Size 1210 (3225), Thickness 1.250.20 (L) | Embossed tape (7" reel): 2,000 | |||
| Capacitance Range and Rated Voltage | (See original document for detailed tables for C0G, C0H, X7R, X5R, X7S, X6S dielectrics across various sizes and voltages) | |||
| Reliability Test - Appearance and Electrical Performance | Capacitance (Class I) | Tolerance as specified; Test conditions vary by capacitance value (1MHz or 1KHz, 1.00.2Vrms) | ||
| Capacitance (Class II) | Tolerance as specified; Test conditions vary by capacitance value (1KHz or 120Hz, 1.00.2Vrms or 0.50.1Vrms) | |||
| Dissipation Factor (DF, tan) (Class I) | Specifications vary by capacitance value (1MHz or 1KHz, 1.00.2Vrms) | |||
| Dissipation Factor (DF, tan) (Class II) | Specifications vary by size, rated voltage, and capacitance value (1KHz or 120Hz, 1.00.2Vrms or 0.50.1Vrms) | |||
| Insulation Resistance (IR) (Class I) | C10nF: Ri50000M; C10nF: RiCR500S. Measuring voltage: Rated voltage. | |||
| Insulation Resistance (IR) (Class II) | C25nF: Ri10000M; C25nF: RiCR100S. | |||
| Dielectric Withstanding Voltage (DWV) | No breakdown or damage. Class I: 300% rated voltage; Class II: 250% rated voltage. Duration: 1~5s. | |||
| Solderability | 95% tin coverage. Tested with leaded (2355, 20.5s) or lead-free (2455, 20.5s) solder. | |||
| Termination Adhesion | No visible damage. Force applied varies by size (2N for 0201, 5N for 0402-0805, 10N for 1206). | |||
| Resistance to Soldering Heat | C/C: 0.5% (NPO), -5%~+10% (X7R/X5R/X7S/X6S). DF and IR same as initial. Tested with SnPb (2655, 101s) or lead-free. | |||
| Resistance to Flexure of Substrate | C/C: 10%. Appearance: No visible damage. Tested on PCB (1.60.2mm thick) with 1mm flexure. | |||
| Moisture Resistance (Steady State) | C/C: 2% or 1pF (Class I), 10% (Class II). DF 2x initial. IR varies by class. Tested at 402, 90%~95%RH for 500h. | |||
| Temperature Cycle | C/C: 1% or 1pF (Class I), 10% (Class II). Tested for 5 cycles (-55 to +125/85/105). | |||
| Durability | C/C: 2% or 1pF (Class I), 20% (Class II). DF 2x initial. IR varies by class. Tested at 1.5x rated voltage for 1000h at elevated temperatures (125/85/105). | |||
| Storage Methods | Guaranteed solderability period: 6 months (under delivered package condition). | |||
| Storage Conditions | Temperature: 5~40, Relative Humidity: 20%~70% | |||
| Soldering Conditions | Reflow Soldering Profile | Refer to provided temperature profile charts (SnPb and Lead-free). T 150 for HGC0201 to HGC1206, T 130 for HGC1210. | ||
| Wave Soldering Profile | Refer to provided temperature profile chart. T 150 for HGC0603 to HGC1206. | |||
| Hand Soldering Conditions | Preheating 130, Iron tip temp. 350, Power 20W, Tip diameter: ~1mm recommended, Duration: 3s. Avoid direct contact with ceramic. |
2410121645_Chinocera-HGC0805R7475K500NSLJ_C7472970.pdf
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