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quality Surface Mount Technology Multilayer Ceramic Capacitors Featuring Chinocera HGC0805G0331J500NTGJ Model factory
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quality Surface Mount Technology Multilayer Ceramic Capacitors Featuring Chinocera HGC0805G0331J500NTGJ Model factory
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Specifications
Voltage Rating:
50V
Capacitance:
330pF
Temperature Coefficient:
C0G
Tolerance:
±5%
Mfr. Part #:
HGC0805G0331J500NTGJ
Package:
0805
Key Attributes
Model Number: HGC0805G0331J500NTGJ
Product Description

Product Overview

The Hongming Huaci Technology Multilayer Ceramic Capacitors (MLCC) are designed for high-density and high-efficiency Surface Mount Technology (SMT) applications. These capacitors are manufactured using NP0 (C0G/C0H), X7R, X5R, X7S, and X6S dielectric materials, offering superior electrical performance and high reliability. They are available in a wide range of sizes from 0201 to 1210, providing high capacity in compact dimensions. Key applications include general digital circuits, power supply bypass, consumer electronics, and the telecommunication industry.

Product Attributes

  • Brand: Hongming Huaci Technology
  • Origin: Suining, China
  • Series: General Purpose Series (4V~63V)
  • Dielectric Materials: NP0 (C0G/C0H), X7R, X5R, X7S, X6S

Technical Specifications

Category Details
Model Designation HGC Series (e.g., HGC 0805 R7 104 K 500 N T H J)
Series General Purpose Series (4V~63V)
Available Sizes (Inch/mm) 0201 (0603) to 1210 (3225)
Dielectric Characteristics
  • C0G/C0H: Temperature Coefficient: 0 30 ppm/ (C0G), 0 60 ppm/ (C0H); Operating Temp: -55 to 125
  • X7R: Temperature Coefficient: 15%; Operating Temp: -55 to 125
  • X5R: Temperature Coefficient: 15%; Operating Temp: -55 to 85
  • X7S: Temperature Coefficient: 22%; Operating Temp: -55 to 125
  • X6S: Temperature Coefficient: 22%; Operating Temp: -55 to 105
Rated Voltages (VDC) 4V to 630V (e.g., 4R0, 6R3, 100, 160, 250, 500, 101, 631, 1k, 5k)
Capacitance Range 0.3pF to 220F (varies by dielectric and size)
Tolerance Levels 0.05pF, 0.1pF, 0.25pF, 0.5pF, 1%, 2%, 5%, 10%, 15%, 20%, -20%~+50%
Termination Types Cu/Ni/Sn
Packaging Options Paper Taping, Embossed Taping, Bulk
Reel Sizes 7 Inch, 13 Inch
Dimensions (L x W x T in mm)
0201 (0603)0.600.03 x 0.300.03 x 0.300.03
0402 (1005)1.000.05 x 0.500.05 x 0.500.05
0603 (1608)1.600.20 x 0.800.20 x 0.800.20
0805 (2012)2.000.20 x 1.250.20 x 0.700.10 to 1.250.20
1206 (3216)3.200.20 x 1.600.20 x 0.700.10 to 1.600.20
1210 (3225)3.200.30 x 2.500.30 x 1.250.20 to 2.500.30
Soldering Methods Reflow Soldering (R), Wave Soldering (W)
Reliability Tests Appearance, Dimensions, Capacitance, Dissipation Factor, Insulation Resistance, Dielectric Withstanding Voltage, Solderability, Termination Adhesion, Resistance to Soldering Heat, Resistance to Flexure, Moisture Resistance, Temperature Cycle, Durability
Storage Conditions Temperature: 5~40, Relative Humidity: 20%~70% (Guaranteed solderability for 6 months)

2410121645_Chinocera-HGC0805G0331J500NTGJ_C5186750.pdf

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