Product Overview
The Hongming Huaci Technology Multilayer Ceramic Capacitors (MLCC) are designed for high-density and high-efficiency Surface Mount Technology (SMT) applications. These capacitors are manufactured using NP0 (C0G/C0H), X7R, X5R, X7S, and X6S dielectric materials, offering superior electrical performance and high reliability. They are available in a wide range of sizes from 0201 to 1210, providing high capacity in compact dimensions. Key applications include general digital circuits, power supply bypass, consumer electronics, and the telecommunication industry.
Product Attributes
- Brand: Hongming Huaci Technology
- Origin: Suining, China
- Series: General Purpose Series (4V~63V)
- Dielectric Materials: NP0 (C0G/C0H), X7R, X5R, X7S, X6S
Technical Specifications
| Category | Details | ||||||||||||
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
| Model Designation | HGC Series (e.g., HGC 0805 R7 104 K 500 N T H J) | ||||||||||||
| Series | General Purpose Series (4V~63V) | ||||||||||||
| Available Sizes (Inch/mm) | 0201 (0603) to 1210 (3225) | ||||||||||||
| Dielectric Characteristics |
| ||||||||||||
| Rated Voltages (VDC) | 4V to 630V (e.g., 4R0, 6R3, 100, 160, 250, 500, 101, 631, 1k, 5k) | ||||||||||||
| Capacitance Range | 0.3pF to 220F (varies by dielectric and size) | ||||||||||||
| Tolerance Levels | 0.05pF, 0.1pF, 0.25pF, 0.5pF, 1%, 2%, 5%, 10%, 15%, 20%, -20%~+50% | ||||||||||||
| Termination Types | Cu/Ni/Sn | ||||||||||||
| Packaging Options | Paper Taping, Embossed Taping, Bulk | ||||||||||||
| Reel Sizes | 7 Inch, 13 Inch | ||||||||||||
| Dimensions (L x W x T in mm) |
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| Soldering Methods | Reflow Soldering (R), Wave Soldering (W) | ||||||||||||
| Reliability Tests | Appearance, Dimensions, Capacitance, Dissipation Factor, Insulation Resistance, Dielectric Withstanding Voltage, Solderability, Termination Adhesion, Resistance to Soldering Heat, Resistance to Flexure, Moisture Resistance, Temperature Cycle, Durability | ||||||||||||
| Storage Conditions | Temperature: 5~40, Relative Humidity: 20%~70% (Guaranteed solderability for 6 months) |
2410121645_Chinocera-HGC0805G0331J500NTGJ_C5186750.pdf
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