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quality Multilayer Ceramic Capacitors Chinocera HGC0603S6475K160NTHJ for SMT Applications and Electronic Devices factory
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quality Multilayer Ceramic Capacitors Chinocera HGC0603S6475K160NTHJ for SMT Applications and Electronic Devices factory
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Specifications
Voltage Rating:
16V
Capacitance:
4.7uF
Temperature Coefficient:
X6S
Tolerance:
±10%
Mfr. Part #:
HGC0603S6475K160NTHJ
Package:
0603
Key Attributes
Model Number: HGC0603S6475K160NTHJ
Product Description

Product Overview

The Hongming Huaci Technology Multilayer Ceramic Capacitors (MLCC) are designed for high-density, high-efficiency Surface Mount Technology (SMT) applications. These general-purpose series capacitors, available in sizes from 0201 to 1210, are manufactured with NP0 (C0G/C0H), X7R, X5R, X7S, and X6S dielectrics, offering superior electrical performance and high reliability. They are ideal for general digital circuits, power supply bypass, consumer electronics, and telecommunication industries.

Product Attributes

  • Brand: Hongming Huaci Technology ()
  • Series: General Purpose Series (4V~63V)
  • Origin: Suining Hongming Huaci Technology Co., Ltd.
  • Dielectric Materials: NP0 (C0G/C0H), X7R, X5R, X7S, X6S

Technical Specifications

Category Specification Details
General Information Product Name Multilayer Ceramic Capacitors
Series General Purpose Series (4V~63V)
Specification 0201 ~ 1210 Size
Features Size Range 0201 to 1210
Capacity High capacity and small size achievable
Applications General Digital Circuits Yes
Power Supply Bypass Yes
Consumer Electronics Yes
Telecommunication Industry Yes
Model Designation Breakdown Series Code HGC (General Purpose)
Size (inch/mm) 0201 (0603), 0402 (1005), 0603 (1608), 0805 (2012), 1206 (3216), 1210 (3225)
Dielectric Material Codes R5=X5R, R7=X7R, G0=C0G
Capacitance Codes e.g., 104=100nF, 105=1F, 106=10F
Tolerance Codes e.g., J=5%, K=10%, M=20%
Rated Voltage Codes e.g., 500=50 Vdc, 101=100 Vdc
Termination Type Codes N=Cu/Ni/Sn, C=Cu/Resin/Ni/Sn
Packaging Codes T=Paper taping, B=Bulk, S=Embossed taping
Thickness Codes (mm) e.g., A=0.1mm, B=0.2mm, H=0.8mm, V=2.5mm
Reel Size Codes J=7 Inch, D=13 Inch
Temperature Coefficient / Characteristics Dielectric Reference Temp. Point Temp. Coefficient Operating Temp. Range
C0G 20C 30 ppm/ -55C125C
C0H 20C 60 ppm/ -55C125C
X7R 20C 15% -55C125C
X5R 20C 15% -55C85C
X7S 20C 22% -55C125C
X6S 20C 22% -55C105C
External Dimensions Size (Inch/mm) Length L (mm) Width W (mm) Thickness T (mm)/Symbol Soldering Method Terminal Width MB (mm)
0201 (0603) 0.600.03 0.300.03 0.300.03 C R 0.150.05
0402 (1005) 1.000.05 0.500.05 0.500.05 E R 0.250.10
0603 (1608) 1.600.20 0.800.20 0.800.20 H R / W 0.400.15
0805 (2012) 2.000.20 1.250.20 0.700.10 G R / W 0.500.20
1206 (3216) 3.200.20 1.600.20 0.700.10 G R / W 0.600.20
1210 (3225) 3.200.30 2.500.30 1.250.20 L R 0.750.25
Packaging Standard Quantity Size (Inch/mm) Thickness (mm)/Symbol Paper Tape (7" reel) Plastic Tape (7" reel)
0201 (0603) 0.300.03 C 15,000 -
0402 (1005) 0.500.05 E 10,000 -
0603 (1608) 0.800.20 H 4000 -
0805 (2012) 0.700.10 G 4000 -
1206 (3216) 0.700.10 G 4000 -
1210 (3225) 1.250.20 L - 2000
Capacitance Range and Rated Voltage Dielectric Size Rated Voltage (VDC) Capacitance
C0G/C0H 0201 16, 25, 50 0.3pF to 100pF
0402 25, 50 0.3pF to 120pF
0603 25, 50 0.3pF to 100pF
0805 10, 16, 25, 50 0.3pF to 100pF
1206 10, 16, 25, 50 1.2pF to 0.10F
1210 10, 16, 25, 50 1.2pF to 0.10F
X7R 0201 6.3, 10, 16, 25, 50 100pF to 0.10F
0402 6.3, 10, 16, 25, 50 100pF to 0.12F
0603 6.3, 10, 16, 25, 50 100pF to 0.10F
0805 6.3, 10, 16, 25, 50 100pF to 1.0F
1206 6.3, 10, 16, 25, 50 100pF to 1.0F
1210 10, 16, 25, 50 100pF to 47F
X7S 0402 6.3, 10, 16, 25 1.0F to 22F
0603 6.3, 10, 16, 25 1.0F to 22F
0805 10, 16, 25, 50, 100 1.0F to 100F
1206 6.3, 10, 16, 25, 50 1.0F to 100F
1210 6.3, 10, 16, 25, 50 1.0F to 100F
X5R 0201 6.3, 10, 16, 25, 50 100pF to 100F
0402 6.3, 10, 16, 25, 50 100pF to 100F
0603 6.3, 10, 16, 25, 35, 50 100pF to 100F
0805 6.3, 10, 16, 25, 35, 50 100pF to 100F
1206 6.3, 10, 16, 25, 35, 50 100pF to 100F
1210 4, 6.3, 10, 16, 25, 35, 50 100pF to 220F
X6S 0402 6.3, 10, 16, 25 0.10F to 47F
0603 4, 6.3, 10, 16, 25 0.10F to 47F
0805 4, 6.3, 10, 16, 25, 50 0.10F to 100F
1206 4, 6.3, 10, 16, 25, 50 0.10F to 100F
1210 4, 6.3, 10, 16, 25, 50 0.10F to 220F
Reliability Test Item Technical Requirements Test Method and Remarks
Appearance No remarkable defects or abnormalities. Through microscope (10)
Size Within the specified size range. Using a vernier caliper.
Capacitance (Class I: C0G, C0H) Should be within the specified tolerance. Test Temp: 253C. Conditions: C1000pF: 1MHz10%, 1.00.2Vrms; C>1000pF: 1KHz10%, 1.00.2Vrms.
Capacitance (Class II: X7R/X5R, X7S/X6S) Should be within the specified tolerance. Test Temp: 253C. Conditions: C10F: 1KHz10%, 1.00.2Vrms; C>10F: 12024 Hz, 0.50.1Vrms. Pretreatment before initial measurement (Class II only).
Dissipation Factor (DF, tan) (Class I) Standard DF values based on capacitance. Test Temp: 253C. Conditions: C1000pF: 1MHz10%, 1.00.2Vrms; C>1000pF: 1KHz10%, 1.00.2Vrms.
Dissipation Factor (DF, tan) (Class II) Standard DF values based on rated voltage and capacitance. Test Temp: 253C. Conditions: C10F: 1KHz10%, 1.00.2Vrms; C>10F: 12024 Hz, 0.50.1Vrms.
Insulation Resistance (IR) (Class I) Standard IR values based on capacitance. Measuring Voltage: Rated voltage. Duration: 605s. Test Temp: 253C. Humidity: 75%.
Insulation Resistance (IR) (Class II) Standard IR values based on capacitance. Measuring Voltage: Rated voltage. Duration: 605s. Test Temp: 253C. Humidity: 75%.
Dielectric Withstanding Voltage (DWV) No breakdown or damage. Measuring Voltage: Class I: 300% Rated voltage; Class II: 250% Rated voltage. Duration: 1~5s.
Solderability At least 95% of the terminal electrode is covered by new solder. No visible damage. Preheating: 80-120C for 10-30s. Soldering Temp: 2355C (Leaded) / 2455C (Lead-free). Duration: 20.5s.
Termination Adhesion No visible damage. Applied Force: 2N (0201), 5N (0402-0805), 10N (1206). Time: 101s.
Resistance to Soldering Heat C/C, DF, IR within limits. No visible damage. Solderability 95%. Preheating (Class II): 100-200C for 20.5min. Solder Temp: 2655C. Duration: 101s. Recovery: 242h. (1210 and above: Reflow Soldering).
Resistance to Flexure of Substrate C/C 10%. No visible damage. Test Board: PCB Thickness: 1.60.2mm. Flexure: 1mm. Holding time: 51s.
Moisture Resistance (Steady State) C/C, DF, IR within limits. No visible damage. Temp: 402C. Humidity: 90%-95%RH. Duration: 500h. Recovery: 242h.
Temperature Cycle C/C within limits. 5 cycles. Temp range: -55C to +125C (or +85C/+105C for X5R/X6S). Recovery: 242h.
Durability C/C, DF, IR within limits. No visible damage. Applied Voltage: 1.5x Rated Voltage. Duration: 1000h. Temp: 125C (or 85C/105C). Recovery: 242h.
Packaging Details Paper Taping Dimensions Code A0, B0, W, F*, E, P1, P2*, P0, D0, T Specific dimensions provided for 0201/0402 and 0603/0805/1206 types.
Embossed Taping Dimensions Code A, B, C, D*, E, F, G*, H, J, T Specific dimensions provided for 0805~1812 types.
Reel Dimensions Codes: 8mm/7' REEL, 13' REEL, 12mm/7' REEL Specific dimensions (A, B, C, D, E, F, G) provided.
Taping Specification Top tape peeling strength: 0.1N < peeling strength < 0.7N. Details on paper and plastic tape peeling.
Storage Methods Guaranteed Solderability Period 6 months (under delivered package condition). Storage Conditions: Temperature 5C~40C, Relative Humidity 20%~70%.
Precautions for Use General Warning MLCCs may fail short or open. Severe conditions can lead to burn out, flaming, or explosion. Follow specifications and contact technical department for unclear points.
Soldering Conditions Follow recommended temperature profiles to avoid cracking or explosion. Refer to soldering profile charts.
Manual Soldering Handle carefully to avoid thermal shock, cracks, or damage. Pay attention to soldering iron tip selection and temperature control. Avoid direct contact with ceramic body.
Solder Amount (Reflow/Wave) Use optimum solder amount to avoid chip damage (too much) or poor connection (too little). Recommended solder fillet amounts provided.
Recommended Soldering Temperature Profiles Separate profiles for Reflow (Leaded/Lead-free), Wave, and Hand soldering. Includes preheating, temperature differential (T) requirements.
Typical Characteristic Data Graph Graphs |Z|-Frequency Characteristics, Temperature Characteristics, DC Bias Characteristics. Note: Product characteristics are for reference only.

2410121645_Chinocera-HGC0603S6475K160NTHJ_C7432776.pdf

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