Product Overview
The Hongming Huaci Technology Multilayer Ceramic Capacitors (MLCC) are designed for high-density, high-efficiency Surface Mount Technology (SMT) applications. These general-purpose series capacitors, available in sizes from 0201 to 1210, are manufactured with NP0 (C0G/C0H), X7R, X5R, X7S, and X6S dielectrics, offering superior electrical performance and high reliability. They are ideal for general digital circuits, power supply bypass, consumer electronics, and telecommunication industries.
Product Attributes
- Brand: Hongming Huaci Technology ()
- Series: General Purpose Series (4V~63V)
- Origin: Suining Hongming Huaci Technology Co., Ltd.
- Dielectric Materials: NP0 (C0G/C0H), X7R, X5R, X7S, X6S
Technical Specifications
| Category | Specification | Details | ||||
|---|---|---|---|---|---|---|
| General Information | Product Name | Multilayer Ceramic Capacitors | ||||
| Series | General Purpose Series (4V~63V) | |||||
| Specification | 0201 ~ 1210 Size | |||||
| Features | Size Range | 0201 to 1210 | ||||
| Capacity | High capacity and small size achievable | |||||
| Applications | General Digital Circuits | Yes | ||||
| Power Supply Bypass | Yes | |||||
| Consumer Electronics | Yes | |||||
| Telecommunication Industry | Yes | |||||
| Model Designation Breakdown | Series Code | HGC (General Purpose) | ||||
| Size (inch/mm) | 0201 (0603), 0402 (1005), 0603 (1608), 0805 (2012), 1206 (3216), 1210 (3225) | |||||
| Dielectric Material Codes | R5=X5R, R7=X7R, G0=C0G | |||||
| Capacitance Codes | e.g., 104=100nF, 105=1F, 106=10F | |||||
| Tolerance Codes | e.g., J=5%, K=10%, M=20% | |||||
| Rated Voltage Codes | e.g., 500=50 Vdc, 101=100 Vdc | |||||
| Termination Type Codes | N=Cu/Ni/Sn, C=Cu/Resin/Ni/Sn | |||||
| Packaging Codes | T=Paper taping, B=Bulk, S=Embossed taping | |||||
| Thickness Codes (mm) | e.g., A=0.1mm, B=0.2mm, H=0.8mm, V=2.5mm | |||||
| Reel Size Codes | J=7 Inch, D=13 Inch | |||||
| Temperature Coefficient / Characteristics | Dielectric | Reference Temp. Point | Temp. Coefficient | Operating Temp. Range | ||
| C0G | 20C | 30 ppm/ | -55C125C | |||
| C0H | 20C | 60 ppm/ | -55C125C | |||
| X7R | 20C | 15% | -55C125C | |||
| X5R | 20C | 15% | -55C85C | |||
| X7S | 20C | 22% | -55C125C | |||
| X6S | 20C | 22% | -55C105C | |||
| External Dimensions | Size (Inch/mm) | Length L (mm) | Width W (mm) | Thickness T (mm)/Symbol | Soldering Method | Terminal Width MB (mm) |
| 0201 (0603) | 0.600.03 | 0.300.03 | 0.300.03 C | R | 0.150.05 | |
| 0402 (1005) | 1.000.05 | 0.500.05 | 0.500.05 E | R | 0.250.10 | |
| 0603 (1608) | 1.600.20 | 0.800.20 | 0.800.20 H | R / W | 0.400.15 | |
| 0805 (2012) | 2.000.20 | 1.250.20 | 0.700.10 G | R / W | 0.500.20 | |
| 1206 (3216) | 3.200.20 | 1.600.20 | 0.700.10 G | R / W | 0.600.20 | |
| 1210 (3225) | 3.200.30 | 2.500.30 | 1.250.20 L | R | 0.750.25 | |
| Packaging Standard Quantity | Size (Inch/mm) | Thickness (mm)/Symbol | Paper Tape (7" reel) | Plastic Tape (7" reel) | ||
| 0201 (0603) | 0.300.03 C | 15,000 | - | |||
| 0402 (1005) | 0.500.05 E | 10,000 | - | |||
| 0603 (1608) | 0.800.20 H | 4000 | - | |||
| 0805 (2012) | 0.700.10 G | 4000 | - | |||
| 1206 (3216) | 0.700.10 G | 4000 | - | |||
| 1210 (3225) | 1.250.20 L | - | 2000 | |||
| Capacitance Range and Rated Voltage | Dielectric | Size | Rated Voltage (VDC) | Capacitance | ||
| C0G/C0H | 0201 | 16, 25, 50 | 0.3pF to 100pF | |||
| 0402 | 25, 50 | 0.3pF to 120pF | ||||
| 0603 | 25, 50 | 0.3pF to 100pF | ||||
| 0805 | 10, 16, 25, 50 | 0.3pF to 100pF | ||||
| 1206 | 10, 16, 25, 50 | 1.2pF to 0.10F | ||||
| 1210 | 10, 16, 25, 50 | 1.2pF to 0.10F | ||||
| X7R | 0201 | 6.3, 10, 16, 25, 50 | 100pF to 0.10F | |||
| 0402 | 6.3, 10, 16, 25, 50 | 100pF to 0.12F | ||||
| 0603 | 6.3, 10, 16, 25, 50 | 100pF to 0.10F | ||||
| 0805 | 6.3, 10, 16, 25, 50 | 100pF to 1.0F | ||||
| 1206 | 6.3, 10, 16, 25, 50 | 100pF to 1.0F | ||||
| 1210 | 10, 16, 25, 50 | 100pF to 47F | ||||
| X7S | 0402 | 6.3, 10, 16, 25 | 1.0F to 22F | |||
| 0603 | 6.3, 10, 16, 25 | 1.0F to 22F | ||||
| 0805 | 10, 16, 25, 50, 100 | 1.0F to 100F | ||||
| 1206 | 6.3, 10, 16, 25, 50 | 1.0F to 100F | ||||
| 1210 | 6.3, 10, 16, 25, 50 | 1.0F to 100F | ||||
| X5R | 0201 | 6.3, 10, 16, 25, 50 | 100pF to 100F | |||
| 0402 | 6.3, 10, 16, 25, 50 | 100pF to 100F | ||||
| 0603 | 6.3, 10, 16, 25, 35, 50 | 100pF to 100F | ||||
| 0805 | 6.3, 10, 16, 25, 35, 50 | 100pF to 100F | ||||
| 1206 | 6.3, 10, 16, 25, 35, 50 | 100pF to 100F | ||||
| 1210 | 4, 6.3, 10, 16, 25, 35, 50 | 100pF to 220F | ||||
| X6S | 0402 | 6.3, 10, 16, 25 | 0.10F to 47F | |||
| 0603 | 4, 6.3, 10, 16, 25 | 0.10F to 47F | ||||
| 0805 | 4, 6.3, 10, 16, 25, 50 | 0.10F to 100F | ||||
| 1206 | 4, 6.3, 10, 16, 25, 50 | 0.10F to 100F | ||||
| 1210 | 4, 6.3, 10, 16, 25, 50 | 0.10F to 220F | ||||
| Reliability Test | Item | Technical Requirements | Test Method and Remarks | |||
| Appearance | No remarkable defects or abnormalities. | Through microscope (10) | ||||
| Size | Within the specified size range. | Using a vernier caliper. | ||||
| Capacitance (Class I: C0G, C0H) | Should be within the specified tolerance. | Test Temp: 253C. Conditions: C1000pF: 1MHz10%, 1.00.2Vrms; C>1000pF: 1KHz10%, 1.00.2Vrms. | ||||
| Capacitance (Class II: X7R/X5R, X7S/X6S) | Should be within the specified tolerance. | Test Temp: 253C. Conditions: C10F: 1KHz10%, 1.00.2Vrms; C>10F: 12024 Hz, 0.50.1Vrms. Pretreatment before initial measurement (Class II only). | ||||
| Dissipation Factor (DF, tan) (Class I) | Standard DF values based on capacitance. | Test Temp: 253C. Conditions: C1000pF: 1MHz10%, 1.00.2Vrms; C>1000pF: 1KHz10%, 1.00.2Vrms. | ||||
| Dissipation Factor (DF, tan) (Class II) | Standard DF values based on rated voltage and capacitance. | Test Temp: 253C. Conditions: C10F: 1KHz10%, 1.00.2Vrms; C>10F: 12024 Hz, 0.50.1Vrms. | ||||
| Insulation Resistance (IR) (Class I) | Standard IR values based on capacitance. | Measuring Voltage: Rated voltage. Duration: 605s. Test Temp: 253C. Humidity: 75%. | ||||
| Insulation Resistance (IR) (Class II) | Standard IR values based on capacitance. | Measuring Voltage: Rated voltage. Duration: 605s. Test Temp: 253C. Humidity: 75%. | ||||
| Dielectric Withstanding Voltage (DWV) | No breakdown or damage. | Measuring Voltage: Class I: 300% Rated voltage; Class II: 250% Rated voltage. Duration: 1~5s. | ||||
| Solderability | At least 95% of the terminal electrode is covered by new solder. No visible damage. | Preheating: 80-120C for 10-30s. Soldering Temp: 2355C (Leaded) / 2455C (Lead-free). Duration: 20.5s. | ||||
| Termination Adhesion | No visible damage. | Applied Force: 2N (0201), 5N (0402-0805), 10N (1206). Time: 101s. | ||||
| Resistance to Soldering Heat | C/C, DF, IR within limits. No visible damage. Solderability 95%. | Preheating (Class II): 100-200C for 20.5min. Solder Temp: 2655C. Duration: 101s. Recovery: 242h. (1210 and above: Reflow Soldering). | ||||
| Resistance to Flexure of Substrate | C/C 10%. No visible damage. | Test Board: PCB Thickness: 1.60.2mm. Flexure: 1mm. Holding time: 51s. | ||||
| Moisture Resistance (Steady State) | C/C, DF, IR within limits. No visible damage. | Temp: 402C. Humidity: 90%-95%RH. Duration: 500h. Recovery: 242h. | ||||
| Temperature Cycle | C/C within limits. | 5 cycles. Temp range: -55C to +125C (or +85C/+105C for X5R/X6S). Recovery: 242h. | ||||
| Durability | C/C, DF, IR within limits. No visible damage. | Applied Voltage: 1.5x Rated Voltage. Duration: 1000h. Temp: 125C (or 85C/105C). Recovery: 242h. | ||||
| Packaging Details | Paper Taping Dimensions | Code A0, B0, W, F*, E, P1, P2*, P0, D0, T | Specific dimensions provided for 0201/0402 and 0603/0805/1206 types. | |||
| Embossed Taping Dimensions | Code A, B, C, D*, E, F, G*, H, J, T | Specific dimensions provided for 0805~1812 types. | ||||
| Reel Dimensions | Codes: 8mm/7' REEL, 13' REEL, 12mm/7' REEL | Specific dimensions (A, B, C, D, E, F, G) provided. | ||||
| Taping Specification | Top tape peeling strength: 0.1N < peeling strength < 0.7N. | Details on paper and plastic tape peeling. | ||||
| Storage Methods | Guaranteed Solderability Period | 6 months (under delivered package condition). | Storage Conditions: Temperature 5C~40C, Relative Humidity 20%~70%. | |||
| Precautions for Use | General Warning | MLCCs may fail short or open. Severe conditions can lead to burn out, flaming, or explosion. Follow specifications and contact technical department for unclear points. | ||||
| Soldering Conditions | Follow recommended temperature profiles to avoid cracking or explosion. | Refer to soldering profile charts. | ||||
| Manual Soldering | Handle carefully to avoid thermal shock, cracks, or damage. Pay attention to soldering iron tip selection and temperature control. Avoid direct contact with ceramic body. | |||||
| Solder Amount (Reflow/Wave) | Use optimum solder amount to avoid chip damage (too much) or poor connection (too little). | Recommended solder fillet amounts provided. | ||||
| Recommended Soldering Temperature Profiles | Separate profiles for Reflow (Leaded/Lead-free), Wave, and Hand soldering. | Includes preheating, temperature differential (T) requirements. | ||||
| Typical Characteristic Data Graph | Graphs | |Z|-Frequency Characteristics, Temperature Characteristics, DC Bias Characteristics. | Note: Product characteristics are for reference only. |
2410121645_Chinocera-HGC0603S6475K160NTHJ_C7432776.pdf
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