<
>
Specifications
Voltage Rating:
50V
Capacitance:
1.8pF
Temperature Coefficient:
C0G
Mfr. Part #:
HGC0402G01R8B500NTEJ
Package:
0402
Key Attributes
Model Number:
HGC0402G01R8B500NTEJ
Product Description
Product Overview
The Hongming Huaci Technology Multilayer Ceramic Capacitors (MLCC) are designed for high-density, high-efficiency surface-mount applications. These general-purpose series capacitors, available in voltage ratings from 4V to 63V and sizes from 0201 to 1210, are manufactured using NP0 (C0G/C0H), X7R, X5R, X7S, and X6S dielectrics, offering excellent electrical performance and high reliability. They are suitable for general digital circuits, power supply bypass, consumer electronics, and telecommunication industries.
Product Attributes
- Brand: Hongming Huaci Technology
- Supplier: Suining Hongming Huaci Technology Co., Ltd.
- Series: General Purpose Series (4V~63V)
- Dielectric Materials: NP0 (C0G/C0H), X7R, X5R, X7S, X6S
Technical Specifications
| Category | Specification | Details |
|---|---|---|
| Product Name | Multilayer Ceramic Capacitors | |
| Series | General Purpose Series (4V~63V) | |
| Specification (Size) | 0201 ~ 1210 Size | |
| Overview | Ceramic capacitors for high density and high efficiency SMT application. | |
| Features | Wide selection of sizes (0201 to 1210). High capacity in small size. | |
| Applications | General digital circuit, Power supply bypass capacitors, Consumer electronics, Telecommunication industry. | |
| How to Order | HGC [Series] [Size] [Dielectric] [Capacitance] [Tolerance] [Rated Voltage] [Termination] [Packaging] [Thickness Code] [Reel Size] | Example: HGC 0805 R7 104 K 500 N T H J |
| Dielectric Characteristics | C0G/C0H: 0 30/60 ppm/, -55125 X7R: 15%, -55125 X5R: 15%, -5585 X7S: 22%, -55125 X6S: 22%, -55105 | |
| Product Dimensions (L x W x T mm) | 0201 (0603): 0.600.03 x 0.300.03 x 0.300.03 0402 (1005): 1.000.05 x 0.500.05 x 0.500.05 0603 (1608): 1.600.20 x 0.800.20 x 0.800.20 0805 (2012): 2.000.20 x 1.250.20 x 0.700.10 1206 (3216): 3.200.20 x 1.600.20 x 0.700.10 1210 (3225): 3.200.30 x 2.500.30 x 1.250.20 | Soldering Method: R=Reflow, W=Wave |
| Packaging Standard Quantity | 0201 (0603) 0.300.03 C: 15,000/Paper tape 0402 (1005) 0.500.05 E: 10,000/Paper tape 0603 (1608) 0.800.20 H: 4000/Paper tape 0805 (2012) 0.700.10 G: 4000/Paper tape 1206 (3216) 0.700.10 G: 4000/Paper tape 1210 (3225) 1.250.20 L: 2000/Embossed tape | Quantities vary by size, thickness, and tape type. |
| Capacitance Range & Rated Voltage | Detailed tables provided for C0G/C0H, X7R, X7S, X5R, X6S dielectrics across various sizes and voltage ratings. | E.g., 0201 C0G dielectric available in 16V, 25V, 50V with capacitance from 0.3pF to 0.10F. |
| Reliability Test - Appearance & Electrical Performance | Appearance: No defects. Size: Within specified range. Capacitance: Within specified tolerance. DF (tan): Within specified limits based on dielectric type and capacitance. IR: Within specified limits based on dielectric type and capacitance. DWV: No breakdown or damage (300% rated voltage for Class I, 250% for Class II). Solderability: >95% tin coverage. Termination Adhesion: No visible damage. | Various test methods and conditions are specified. |
| Reliability Test - Environmental & Thermal | Resistance to Soldering Heat: C/C within limits, DF/IR same as initial, no visible damage. Resistance to Flexure of Substrate: C/C 10%, no visible damage. Moisture Resistance (Steady State): C/C within limits, DF/IR within limits, no visible damage. Temperature Cycle: C/C within limits. Durability: C/C within limits, DF/IR within limits, no visible damage. | Specific conditions for temperature, humidity, voltage, and time are detailed. |
| Packaging - Taping Dimensions | Detailed dimensions for paper and embossed taping for various sizes (0201 to 1210). | Includes dimensions like A0, B0, W, F, E, P1, P2, P0, D0, T. |
| Packaging - Reel Dimensions | Standard reel sizes (7" and 13") with specified dimensions (A, B, C, D, E, F, G). | Available for 8mm/7" REEL, 13" REEL, 12mm/7" REEL. |
| Taping Specification | Paper Taping: 0.1N < peeling strength < 0.7N. Embossed Taping: 0.1N < peeling strength < 0.7N. | No paper dirty remains on the tape. |
| Storage Methods | Guaranteed Solderability Period: 6 months (under delivered package condition). Storage Conditions: Temperature 5~40, Relative Humidity 20%~70%. | |
| Precautions For Use | MLCCs may fail in short or open circuits under severe conditions, potentially causing fire, burning, or explosion. Follow specified ratings and conditions. | Contact technical department for unclear issues. |
| Soldering Conditions | Follow recommended temperature profiles (Reflow, Wave, Hand Soldering) to avoid chip cracking or explosion. Ensure optimum solder amount. | Specific temperature profiles and T limits are provided for different sizes and soldering methods. |
| Typical Characteristic Data | Graphs for |Z|-Frequency, Temperature Characteristics, and DC Bias Characteristics are available (for reference only). |
2410121645_Chinocera-HGC0402G01R8B500NTEJ_C5186869.pdf
Request A Quote
Please Use Our Online Inquiry Contact Form Below If You Have Any Questions, Our Team Will Get Back To You As Soon As Possible
