Multi-Layer Ceramic Capacitors (MLCC) - Mid-High Voltage Series
Product Overview: (Suining Hongming Huaci Technology Co., Ltd.) presents its Mid-High Voltage Series of Multi-Layer Ceramic Capacitors (MLCCs), designed for high-density and high-efficiency surface mount technology (SMT) applications. These capacitors are manufactured using NP0 (C0G, C0H) and X7R dielectric materials, offering superior electrical performance and high reliability. They are ideal for demanding applications requiring stable capacitance and high voltage handling in a compact package.
Product Attributes
- Brand: HHV Series
- Manufacturer: (Suining Hongming Huaci Technology Co., Ltd.)
- Dielectric Materials: NP0 (C0G/C0H), X7R, X7S, X7T, X8R, X5R, X6R, X6S
- Origin: China
- Series: Mid-High Volts Series
Technical Specifications
| Feature | Specification |
|---|---|
| Series | Mid-High Volts Series (100V ~ 3000V) |
| Case Sizes | 0402 ~ 1812 |
| Voltage Range | 100Vdc to 3000Vdc |
| Capacitance Range | 0.5pF to 100F (Varies by dielectric and size) |
| Dielectric Characteristics |
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| Applications |
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| Key Features |
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| Termination Types | Cu/Ni/Sn, Cu/Resin/Ni/Sn |
| Packaging Options | Paper taping, Bulk, Embossed taping (7" reel, 13" reel) |
| Dimensions (Example: 0402) | Length: 1.000.05mm, Width: 0.500.05mm, Thickness: 0.500.05mm |
| Dimensions (Example: 1812) | Length: 4.50.40mm, Width: 3.20.30mm, Thickness: 1.250.20mm |
| Soldering Methods | Reflow Soldering, Wave Soldering |
| Storage Period | 6 months (guaranteed for solderability under delivered package condition) |
| Storage Conditions | Temperature: 5~40, Relative Humidity: 20%~70% |
How to Order (Model Example)
HHV 1206 R7 102 K 202 N S L J
(Series - Size - Dielectric - Capacitance - Tolerance - Rated Voltage - Termination - Packaging - Thickness Symbol - Reel Size)
Reliability Testing
The product undergoes various reliability tests including Appearance and Electrical Performance, Dielectric Withstanding Voltage, Solderability, Termination Adhesion, Resistance to Soldering Heat, Resistance to Flexure of Substrate, Moisture Resistance, Temperature Cycle, and Durability.
Precautions for Use
Users should adhere to the specified ratings and conditions to prevent potential failures such as burn out, flaming, or explosion. Careful attention to soldering conditions, including temperature profiles and solder amount, is crucial to avoid chip cracking and ensure proper connection. Manual soldering requires careful handling to prevent thermal shock.
2410121646_Chinocera-HHV1210R7475K101NSVK_C33546021.pdf
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