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Specifications
Voltage Rating:
50V
Capacitance:
1nF
Temperature Coefficient:
X7R
Tolerance:
±10%
Mfr. Part #:
HGC0603R7102K500NTHJ
Package:
0603
Key Attributes
Model Number:
HGC0603R7102K500NTHJ
Product Description
Product Overview
The HGC General Purpose Series Multilayer Ceramic Capacitors (MLCCs) are designed for high-density and high-efficiency SMT applications. Manufactured with NP0 (C0G/C0H), X7R, X5R, X7S, and X6S dielectrics, these capacitors offer excellent electrical performance and high reliability. Available in a wide range of sizes from 0201 to 1210, they provide high capacitance in compact dimensions. Key applications include general digital circuits, power supply bypass, consumer electronics, and the telecommunication industry.
Product Attributes
- Brand: HGC
- Supplier: (Suining Hongming Huaci Technology Co., Ltd.)
- Series: General Purpose Series (4V~63V)
- Dielectric Materials: NP0 (C0G/C0H), X7R, X5R, X7S, X6S
Technical Specifications
| Specification | Details |
|---|---|
| Part Name | Multilayer Ceramic Capacitors |
| Series | General Purpose Series (4V~63V) |
| Specification (Size) | 0201 ~ 1210 |
| Supplier | Suining Hongming Huaci Technology Co., Ltd. |
| Issue Date | 20201116 |
| Model Designation | HGC + Size + Dielectric + Capacitance + Tolerance + Rated Voltage + Termination + Packaging + Thickness |
| Available Sizes (Inch/mm) | 0201 (0603), 0402 (1005), 0603 (1608), 0805 (2012), 1206 (3216), 1210 (3225) |
| Dielectric Types & Temperature Characteristics |
|
| External Dimensions (Example: 0201) |
|
| Packaging Standard Quantities (Examples) |
|
| Capacitance Range & Rated Voltage | Refer to detailed tables in the original document (Sections 8-1 to 8-5) for specific combinations of dielectric, size, capacitance, and rated voltage. |
| Reliability Test Items | Appearance, Dimensions, Capacitance, Dissipation Factor (DF), Insulation Resistance (IR), Dielectric Withstanding Voltage (DWV), Solderability, Termination Adhesion, Resistance to Soldering Heat, Resistance to Flexure of Substrate, Moisture Resistance, Temperature Cycle, Durability. |
| Storage Conditions |
|
| Soldering Methods | Reflow Soldering, Wave Soldering, Manual Soldering. Specific temperature profiles and recommendations are provided in the original document. |
2410121645_Chinocera-HGC0603R7102K500NTHJ_C482471.pdf
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