Name: General Purpose Multilayer Ceramic Capacitors Chinocera HGC0402R5104K250NTEJ with Wide Voltage Range
Brand: Beijing Silk Road Enterprise Management Services Co., Ltd.
SKU: HGC0402R5104K250NTEJ
Availability: InStock

quality General Purpose Multilayer Ceramic Capacitors Chinocera HGC0402R5104K250NTEJ with Wide Voltage Range factory

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Specifications

Voltage Rating:

25V

Capacitance:

100nF

Temperature Coefficient:

X5R

Tolerance:

±10%

Mfr. Part #:

HGC0402R5104K250NTEJ

Package:

0402

Key Attributes

Model Number: HGC0402R5104K250NTEJ

Product Description

Product Overview

The HGC General Purpose Series Multilayer Ceramic Capacitors (MLCCs) are designed for high-density, high-efficiency SMT applications. Manufactured using NP0 (C0G/C0H), X7R, X5R, X7S, and X6S dielectric materials, these capacitors offer superior electrical performance and high reliability. They are available in a wide range of sizes from 0201 to 1210, providing high capacitance in small packages. Ideal for general digital circuits, power supply bypass, consumer electronics, and telecommunication industries.

Product Attributes

Brand: HGC
Supplier: Suining Hongming Huaci Technology Co., Ltd.
Series: General Purpose Series (4V~63V)
Dielectric Materials: NP0 (C0G/C0H), X7R, X5R, X7S, X6S

Technical Specifications

Category	Details
Series	General Purpose Series (4V~63V)
Available Sizes	0201 ~ 1210
How to Order (Example Breakdown)	HGC (Series) + 0805 (Size) + R7 (Dielectric) + 104 (Capacitance) + K (Tolerance) + 500 (Rated Voltage) + N (Termination) + T (Packaging) + H (Thickness) + J (Reel Size)
Dielectric Characteristics	C0G (NP0): Temp. Coeff: 0 30 ppm/, Operating Temp: -55125 C0H: Temp. Coeff: 0 60 ppm/, Operating Temp: -55125 X7R: Temp. Coeff: 15%, Operating Temp: -55125 X5R: Temp. Coeff: 15%, Operating Temp: -5585 X7S: Temp. Coeff: 22%, Operating Temp: -55125 X6S: Temp. Coeff: 22%, Operating Temp: -55105
Product Peripheral Dimensions (Example: 0201)	Size: 0201 (0603) Length (L): 0.600.03 mm Width (W): 0.300.03 mm Thickness (T): 0.300.03 mm (Symbol C) Termination Width (MB): 0.150.05 mm Soldering Method: Reflow Soldering (R)
Packaging Standard Quantity (Example: 0201)	Size: 0201 (0603) Thickness: 0.300.03 mm (Symbol C) Paper Tape (7" reel): 15,000 pcs
Capacitance Range & Rated Voltage (Partial Example: C0G)	Size 0201: 0.3pF (0R3) to 0.10F (104) with various rated voltages (e.g., 16V, 25V, 50V) Size 1210: 0.010F (103) to 0.10F (104) with various rated voltages (e.g., 10V, 16V, 25V, 50V)
Capacitance Range & Rated Voltage (Partial Example: X7R)	Size 0201: 100pF (101) to 0.10F (104) with various rated voltages (e.g., 6.3V, 10V, 16V, 25V, 50V) Size 1210: 10F (106) to 47F (476) with various rated voltages (e.g., 10V, 16V, 25V, 50V)
Reliability Test - Appearance & Electrical Performance	Appearance: No remarkable defects or abnormalities. Size: Within specified range. Capacitance Tolerance: Meets specified tolerance (Class I & II have different test conditions). Dissipation Factor (DF, tan): Meets specified limits (Class I & II have different limits and test conditions). Insulation Resistance (IR): Meets specified limits (Class I & II have different limits and test conditions). Dielectric Withstanding Voltage (DWV): No breakdown or damage (Class I: 300% rated voltage; Class II: 250% rated voltage). Solderability: 95% tin coverage, no visible damage. Termination Adhesion: No visible damage under applied force. Resistance to Soldering Heat: Meets electrical performance and appearance requirements. Resistance to Flexure of Substrate: C/C 10%, no visible damage. Moisture Resistance (Steady State): Meets C/C, DF, IR, and appearance requirements. Temperature Cycle: Meets C/C and appearance requirements. Durability: Meets C/C, DF, IR, and appearance requirements.
Packaging - Paper Taping Dimensions (Example: 0603)	Code: 0603 A: 1.10 0.10 mm B: 1.90 0.10 mm C: 8.00 0.10 mm *D: 3.50 0.05 mm E: 1.75 0.10 mm F: 4.00 0.10 mm G:* 2.00 0.10 mm H: 4.00 0.10 mm J: 1.50 -0/+0.10 mm T: 1.10 Max mm
Packaging - Embossed Taping Dimensions (Example: 0805)	Code: 0805 Tapesize: 8.00 0.20 mm A: 1.55 0.20 mm B: 2.35 0.20 mm C: 8.00 0.20 mm *D: 3.50 0.05 mm E: 1.75 0.10 mm F: 4.00 0.10 mm G:* 2.00 0.10 mm H: 4.00 0.10 mm J: 1.50 -0/+0.10 mm T: 1.50 Max mm
Reel Dimensions	8mm/7' REEL: A: 1782.0, B: 3.0, C: 130.5, D: 210.8, E: 50 or more, F: 10.01.5, G: 14.4max 13' REEL: A: 3302.0, B: 3.0, C: 130.5, D: 210.8, E: 50 or more, F: 10.01.5, G: 14.4max 12mm/7' REEL: A: 1782.0, B: 3.0, C: 130.5, D: 210.8, E: 50 or more, F: 13.41.5, G: 18.4max
Taping Specification	Paper Taping: Peeling Strength: 0.1N < peeling strength < 0.7N. No paper dirty remains. Embossed Taping: Peeling Strength: 0.1N < peeling strength < 0.7N.
Storage Methods	Guaranteed Period for Solderability: 6 months (Under deliver package condition). Storage Conditions: Temperature: 5~40, Relative Humidity: 20%~70%.
Precautions For Use	MLCCs may fail in short or open circuits. Risk of burn out, flaming, or explosion under severe conditions. Follow specifications and consult technical department for uncertainties. Soldering Profile: Follow recommended temperature curves to avoid cracking or explosion due to sudden temperature changes. Manual Soldering: Handle with care to avoid thermal shock. Pay attention to soldering iron tip selection and temperature control. Avoid direct contact with ceramic body. Optimum Solder Amount: Use appropriate solder amounts for reflow and wave soldering to ensure proper connection and avoid chip damage. Recommended Soldering Temperature Curves: Provided for Reflow Soldering (Leaded & Lead-free) and Wave Soldering. Hand Soldering Conditions: Preheating 130, Max Soldering Iron Temp: 350, Max Power: 20W, Recommended Tip Diameter: 1mm, Max Soldering Time: 3s, Solder Paste Amount: 1/2 chip thickness. Avoid direct contact between soldering iron head and ceramic components.
Typical Characteristic Data Graph (Reference Only)	\|Z\|- Frequency Characteristics Curve Temperature Characteristics DC Bias Characteristics

2410121645_Chinocera-HGC0402R5104K250NTEJ_C7432761.pdf

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