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Specifications
Voltage Rating:
16V
Capacitance:
10uF
Temperature Coefficient:
X5R
Tolerance:
±10%
Mfr. Part #:
HGC0603R5106K160NTHJ
Package:
0603
Key Attributes
Model Number:
HGC0603R5106K160NTHJ
Product Description
Product Overview
The Suining Hongming Huaci Technology Co., Ltd. offers a series of General Purpose Multilayer Ceramic Capacitors (MLCCs) designed for high-density and high-efficiency SMT applications. These capacitors are manufactured using NP0 (C0G/C0H), X7R, X5R, X7S, and X6S dielectric materials, providing excellent electrical performance and high reliability. Available in a wide range of sizes from 0201 to 1210, these components are suitable for general digital circuits, power supply bypass, consumer electronics, and telecommunication industries.
Product Attributes
- Brand: HGC
- Supplier: Suining Hongming Huaci Technology Co., Ltd.
- Series: General Purpose Series (4V~63V)
- Dielectric Materials: NP0 (C0G/C0H), X7R, X5R, X7S, X6S
Technical Specifications
| Specification | Details |
|---|---|
| Model Designation System | HGC [Series] [Size] [Dielectric] [Capacitance] [Tolerance] [Rated Voltage] [Termination] [Packaging] [Thickness Code] [Reel Size] |
| Available Sizes | 0201 (0603) to 1210 (3225) |
| Rated Voltage Range | 4Vdc to 630Vdc (Specific values include 4R0, 6R3, 100, 160, 250, 500, 101, 201, 251, 501, 631, etc.) |
| Capacitance Values | From 0.3pF (0R3) to 220F (227) (Specific values vary by dielectric and size) |
| Tolerance Levels | 0.05pF, 0.1pF, 0.25pF, 0.5pF, 1%, 2%, 5%, 10%, 15%, 20%, -20%~+50% |
| Temperature Coefficients / Characteristics |
|
| External Dimensions (Example: 0201) | Length: 0.600.03 mm, Width: 0.300.03 mm, Thickness: 0.300.03 mm |
| Termination Types | Cu/Ni/Sn (N) |
| Packaging Options | Paper taping (T), Bulk packaging (B), Embossed taping (S) |
| Reel Sizes | 7 Inch (J, K), 13 Inch (D) |
| Standard Packaging Quantities | Varies by size and thickness (e.g., 0201/0.30mm: 15,000 pcs/paper tape 7" reel) |
| Reliability Test Items | Appearance, Size, Capacitance, Dissipation Factor (DF), Insulation Resistance (IR), Dielectric Withstanding Voltage (DWV), Solderability, Termination Adhesion, Resistance to Soldering Heat, Resistance to Flexure of Substrate, Moisture Resistance, Temperature Cycle, Durability. |
| Storage Conditions | Temperature: 5~40, Relative Humidity: 20%~70% (Guaranteed solderability period: 6 months) |
2410121645_Chinocera-HGC0603R5106K160NTHJ_C7432767.pdf
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