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quality Surface Mount Multilayer Ceramic Capacitors Chinocera HGC0603R7475K160NTHJ with X7R and NP0 Dielectric Materials factory
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quality Surface Mount Multilayer Ceramic Capacitors Chinocera HGC0603R7475K160NTHJ with X7R and NP0 Dielectric Materials factory
>
Specifications
Voltage Rating:
16V
Capacitance:
4.7uF
Temperature Coefficient:
X7R
Tolerance:
±10%
Mfr. Part #:
HGC0603R7475K160NTHJ
Package:
0603
Key Attributes
Model Number: HGC0603R7475K160NTHJ
Product Description

Product Overview

The Suining Hongming Huaci Technology Co., Ltd. Multilayer Ceramic Capacitors (MLCC) are designed for high-density and high-efficiency surface-mount applications. These capacitors are manufactured using NP0 (C0G, C0H), X7R, X5R, X7S, and X6S dielectric materials, offering superior electrical performance and high reliability. They are available in a wide range of sizes from 0201 to 1210, providing high capacitance in a small form factor. Ideal for general digital circuits, power supply bypass, consumer electronics, and telecommunication industries.

Product Attributes

  • Brand: HGC
  • Supplier: Suining Hongming Huaci Technology Co., Ltd.
  • Series: General Purpose Series (4V~63V)
  • Dielectric Materials: NP0 (C0G/C0H), X7R, X5R, X7S, X6S

Technical Specifications

Category Specification Details
General Information Part Name MULTILAYER CERAMIC CAPACITORS
Supplier Suining Hongming Huaci Technology Co., Ltd.
Issue Date 20201116
Product Features Available Sizes 0201 to 1210
Capacitance Density High capacity and small size achievable
Applications General Digital Circuits Yes
Power Supply Bypass Yes
Consumer Electronics Yes
Telecommunication Yes
Model Specification Series HGC (General Purpose)
Size (inch/mm) 0201 (0603) to 1210 (3225)
Dielectric Material Codes R5=X5R, R7=X7R, G0=C0G
Capacitance Codes e.g., 104=100nF, 105=1F
Tolerance Codes A=0.05pF, B=0.1pF, C=0.25pF, D=0.5pF, F=1%, G=2%, J=5%, K=10%, L=15%, M=20%, S=-20%~+50%
Rated Voltage Codes e.g., 4R0=4Vdc, 500=50Vdc, 101=100Vdc
Termination Type Codes N=Cu/Ni/Sn, C=Cu/Resin/Ni/Sn
Packaging Codes T=Paper taping, B=Bulk, S=Embossed taping
Thickness Codes (mm) A=0.1mm, B=0.2mm, C=0.3mm, ..., V=2.5mm
Reel Size Codes J=7Inch, D=13Inch
Temperature Coefficient / Characteristics Dielectric Reference Temp. Temp. Coefficient Operating Temp. Range
C0G 20C 030 ppm/ -55125
C0H 20C 060 ppm/ -55125
X7R 20C 15% -55125
X5R 20C 15% -5585
X7S 20C 22% -55125
X6S 20C 22% -55105
External Dimensions Size (Inch/mm) Length L (mm) Width W (mm) Thickness T (mm)/Symbol Soldering Method Termination Width MB (mm)
0201 (0603) 0.600.09 0.300.09 0.300.09 C R 0.150.05
0402 (1005) 1.000.05 0.500.05 0.500.05 E(C105) R 0.250.10
0603 (1608) 1.600.20 0.800.20 0.800.20 H R / W 0.400.15
0805 (2012) 2.000.20 1.250.20 0.700.10 G R / W 0.500.20
1210 (3225) 3.200.30 2.500.30 1.250.20 L R 0.750.25
Packaging Standard Quantity Size Thickness (mm)/Symbol Paper Tape 7" Reel Plastic Tape 7" Reel
0201 (0603) 0.300.03 C 15,000 -
0402 (1005) 0.500.05 E(C105) 10,000 -
0603 (1608) 0.800.20 H 4000 -
0805 (2012) 0.700.10 G 4000 -
Capacitance Range and Rated Voltage Dielectric Size Rated Voltage (VDC) Capacitance
C0G, C0H 0201 16, 25, 50 0.3pF (0R3) to 100pF (101)
0402 25, 50 0.5pF (0R5) to 120pF (121)
0603 25, 50 0.5pF (0R5) to 100pF (101)
0805 10, 16, 25, 50 0.5pF (0R5) to 100pF (101)
1206 10, 16, 25, 50 1.2pF (1R2) to 100pF (101)
1210 10, 16, 25, 50 1.2pF (1R2) to 100pF (101)
0201 25, 50 120pF (121) to 1000pF (102)
0402 25, 50 120pF (121) to 1000pF (102)
0603 25, 50 120pF (121) to 1000pF (102)
0805 10, 16, 25, 50 120pF (121) to 1000pF (102)
1206 10, 16, 25, 50 120pF (121) to 1000pF (102)
1210 10, 16, 25, 50 120pF (121) to 1000pF (102)
0201 25, 50 1200pF (122) to 0.10F (104)
0402 25, 50 1200pF (122) to 0.10F (104)
0603 25, 50 1200pF (122) to 0.10F (104)
0805 10, 16, 25, 50 1200pF (122) to 0.10F (104)
1206 10, 16, 25, 50 1200pF (122) to 0.10F (104)
1210 10, 16, 25, 50 1200pF (122) to 0.10F (104)
X7R Dielectric 0201 6.3, 10, 16, 25, 50 100pF (101) to 0.10F (104)
0402 6.3, 10, 16, 25, 50 100pF (101) to 0.12F (124)
0603 6.3, 10, 16, 25, 35, 50 100pF (101) to 0.15F (154)
0805 6.3, 10, 16, 25, 35, 50 100pF (101) to 1.0F (105)
1206 10, 16, 25, 35, 50 100pF (101) to 1.0F (105)
1210 10, 16, 25, 35, 50 100pF (101) to 10F (106)
X7S Dielectric 0402 6.3, 10, 16, 25 1.0F (105) to 22F (226)
0603 6.3, 10, 16, 25 1.0F (105) to 22F (226)
0805 10, 16, 25, 50, 100 1.0F (105) to 100F (107)
1206 6.3, 10, 16, 25, 50 1.0F (105) to 22F (226)
1210 6.3, 10, 16, 25, 50 1.0F (105) to 100F (107)
X5R Dielectric 0201 6.3, 10, 16, 25, 50 100pF (101) to 0.10F (104)
0402 6.3, 10, 16, 25, 35, 50 100pF (101) to 0.15F (154)
0603 6.3, 10, 16, 25, 35, 50 100pF (101) to 0.22F (224)
0805 6.3, 10, 16, 25, 35, 50 100pF (101) to 1.0F (105)
1206 6.3, 10, 16, 25, 35, 50 100pF (101) to 10F (106)
1210 4, 6.3, 10, 16, 25, 35, 50 100pF (101) to 100F (107)
X6S Dielectric 0402 6.3, 10, 16, 25 0.10F (104) to 3.3F (335)
0603 4, 6.3, 10, 16, 25 0.10F (104) to 3.3F (335)
0805 4, 6.3, 10, 16, 25, 50 0.10F (104) to 10F (106)
1206 4, 6.3, 10, 16, 25, 50 0.10F (104) to 10F (106)
1210 4, 6.3, 10, 16, 25, 50 0.10F (104) to 100F (107)
Reliability Test Item Technical Requirements Test Method and Remarks
Appearance No remarkable defects or abnormalities. Through microscope (10)
Size Within the specified size range Using a vernier caliper
Capacitance Class I: Within specified tolerance. Class II: Within specified tolerance. Test Temp: 253. Test Conditions vary by capacitance value and class.
Dissipation Factor (DF, tan) Class I: Specific values based on capacitance. Class II: Specific values based on rated voltage and capacitance. Test Temp: 253. Test Conditions vary by capacitance value and class.
Insulation Resistance (IR) Class I: Ri50000M or RiCR500S. Class II: Ri10000M or RiCR100S. Measuring Voltage: Rated Voltage. Duration: 605 sec.
Dielectric Withstanding Voltage (DWV) No breakdown or damage. Measuring Voltage: 300% Rated Voltage (Class I), 250% Rated Voltage (Class II). Duration: 1~5s.
Solderability At least 95% of the terminal electrode is covered by new solder. No visible damage. Preheating, then dipping in leaded or lead-free solder.
Termination Adhesion No visible damage. Applied Force: 2N (0201), 5N (0402-0805), 10N (1206). Duration: 101S.
Resistance to Soldering Heat C/C 0.5% (NPO), -5%~+10% (X7R/X5R/X7S/X6S). DF and IR within initial standards. No visible damage. Preheating, dipping in solder, recovery time.
Resistance to Flexure of Substrate (Bending Strength) C/C 10%. No visible damage. Test Board: PCB, 1.60.2mm thickness. Flexure: 1mm. Holding time: 51s.
Moisture Resistance (Steady State) C/C 2% or 1pF (Class I), 10% (Class II). DF 2x initial. IR within standards. No visible damage. Temp: 402, Humidity: 90%~95%RH. Duration: 500h. Recovery: 242h.
Temperature Cycle C/C 1% or 1pF (Class I), 10% (Class II). 5 cycles. Temp range: -55 to +125 (or lower for X5R/X6S). Recovery: 242h.
Durability C/C 2% or 1pF (Class I), 20% (Class II). DF 2x initial. IR within standards. No visible damage. Applied Voltage: 1.5x Rated Voltage. Duration: 1000h. Temp: 125 (or lower for X5R/X6S). Recovery: 242h.
Packaging Paper Taping Dimensions Details provided for 0201, 0402, 0603, 0805, 1206. Unit: mm. Specific dimensions for A0, B0, W, F*, E, P1, P2*, P0, D0, T.
Embossed Taping Dimensions Details provided for 0805~1812. Unit: mm. Specific dimensions for Tapesize, A, B, C, D*, E, F, G*, H, J, T.
Reel Dimensions Available for 7" and 13" reels, 8mm/12mm width tape. Unit: mm. Specific dimensions for A, B, C, D, E, F, G.
Storage Methods Guaranteed solderability period: 6 months. Storage Temperature: 5~40. Relative Humidity: 20%~70%.
Precautions For Use MLCCs may fail in short circuit or open circuit. Potential for fire, burning, or explosion under severe conditions. Follow specifications and contact technical department for clarification. Refer to specifications and application notes.
Soldering Profile Refer to temperature curve charts for reflow and wave soldering to avoid cracking or explosion due to sudden temperature changes. Specific profiles for leaded and lead-free reflow, and wave soldering.
Manual Soldering Careful operation required to avoid thermal cracks due to uneven local heating. Avoid direct contact of soldering iron tip with ceramic body. Select soldering iron tip and control tip temperature carefully.
Optimum Solder Amount Recommended amounts for reflow, wave, and rework soldering to ensure proper connection and avoid damage. Visual guidelines for solder amount.
Typical Characteristic Data Graph |Z|-Frequency Characteristics, Temperature Characteristics, DC Bias Characteristics. For reference only.

2507111630_Chinocera-HGC0603R7475K160NTHJ_C49333233.pdf

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