Product Overview
The Suining Hongming Huaci Technology Co., Ltd. offers a series of General Purpose Multilayer Ceramic Capacitors (MLCCs) designed for high-density and high-efficiency SMT applications. These capacitors are manufactured using NP0 (C0G/C0H), X7R, X5R, X7S, and X6S dielectric materials, providing excellent electrical performance and high reliability. Available in a wide range of sizes from 0201 to 1210, they offer high capacitance in small sizes, making them suitable for general digital circuits, power supply bypass, consumer electronics, and telecommunication industries.
Product Attributes
- Brand: HGC
- Supplier: Suining Hongming Huaci Technology Co., Ltd.
- Series: General Purpose Series (4V~63V)
- Origin: China
- Dielectric Materials: NP0 (C0G/C0H), X7R, X5R, X7S, X6S
Technical Specifications
| Category | Details |
|---|---|
| Model Designation | HGC [Series] [Size] [Dielectric] [Capacitance] [Tolerance] [Rated Voltage] [Termination] [Packaging] [Thickness Code] [Reel Size] |
| Available Sizes (Inch/mm) | 0201 (0603), 0402 (1005), 0603 (1608), 0805 (2012), 1206 (3216), 1210 (3225) |
| Rated Voltage Range | 4Vdc to 630Vdc (Specific values include 4R0, 6R3, 100, 160, 250, 500, 101, 201, 251, 501, 631, 102, etc.) |
| Capacitance Range | From 0.3pF (0R3) to 220F (227) (Specific values vary by dielectric and size) |
| Tolerance Levels | 0.05pF, 0.1pF, 0.25pF, 0.5pF, 1%, 2%, 5%, 10%, 15%, 20%, -20%~+50% |
| Dielectric Characteristics |
|
| Product Dimensions (Example: 0805) | Length (L): 2.000.20 mm Width (W): 1.250.20 mm Thickness (T): 0.700.10 mm (G), 0.800.20 mm (H), 1.250.20 mm (L) |
| Termination Types | Cu/Ni/Sn (N), Cu/Resin/Ni/Sn (C) |
| Packaging Options | Paper taping (T), Bulk (B), Embossed taping (S) |
| Reel Sizes | 7 Inch (J, K), 13 Inch (D) |
| Soldering Methods | Reflow Soldering (R), Wave Soldering (W) |
| Reliability Tests | Includes Appearance, Dimensions, Capacitance, Dissipation Factor, Insulation Resistance, Dielectric Withstanding Voltage, Solderability, Termination Adhesion, Resistance to Soldering Heat, Resistance to Flexure, Moisture Resistance, Temperature Cycle, Durability. |
| Storage Conditions | Temperature: 5~40, Relative Humidity: 20%~70% (Guaranteed solderability for 6 months) |
2410121645_Chinocera-HGC0603R7822K500NTHJ_C5186723.pdf
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