Product Overview
The Multi-Layer Ceramic Capacitors (MLCC) General Purpose Series (4V~63V) from Suining Hongming Huaci Technology Co., Ltd. are designed for high-density and high-efficiency SMT applications. Manufactured with NP0 (C0G/C0H), X7R, X5R, X7S, and X6S dielectrics, these capacitors offer excellent electrical performance and high reliability. They are available in a wide range of sizes from 0201 to 1210, providing high capacity in small form factors. Key applications include general digital circuits, power supply bypass, consumer electronics, and the telecommunication industry.
Product Attributes
- Brand: HGC
- Supplier: Suining Hongming Huaci Technology Co., Ltd.
- Series: General Purpose Series
- Dielectric Materials: NP0 (C0G/C0H), X7R, X5R, X7S, X6S
Technical Specifications
| Category | Specification | Details |
|---|---|---|
| Product Information | Part Name | MULTILAYER CERAMIC CAPACITORS |
| Series | General Purpose Series (4V~63V) | |
| Supplier | Suining Hongming Huaci Technology Co., Ltd. | |
| Size & Dimensions | Specification Range | 0201 ~ 1210 Size |
| External Dimensions (Example: 0201) | Length: 0.600.03mm, Width: 0.300.03mm, Thickness: 0.300.03mm | |
| Electrical Characteristics | Rated Voltage Range | 4Vdc to 630Vdc (refer to model number for specific voltages) |
| Capacitance Range | 0.3pF to 220F (dependent on dielectric and size) | |
| Dielectric Types & Temperature Characteristics |
| |
| Tolerance | 0.05pF to 20%, S (-20%~+50%) | |
| Dissipation Factor (DF, tan) | Varies by dielectric, size, and voltage (see document for details) | |
| Insulation Resistance (IR) | Varies by dielectric, size, and voltage (see document for details) | |
| Dielectric Withstanding Voltage (DWV) | Class I: 300% Rated Voltage; Class II: 250% Rated Voltage | |
| Packaging | Available Taping | Paper Taping, Embossed Taping |
| Reel Sizes | 7 Inch, 13 Inch | |
| Ordering Information | Model Structure | HGC [Size] [Dielectric] [Capacitance] [Tolerance] [Rated Voltage] [Termination] [Packaging] [Thickness Code] [Reel Size] |
Applications
- General digital circuits
- Power supply bypass capacitors
- Consumer electronics
- Telecommunication industry
Reliability Test Summary
| Test Item | Technical Requirements | Test Method |
|---|---|---|
| Appearance | No remarkable defects or abnormalities | Microscope (10) |
| Size | Within specified range | Vernier caliper |
| Capacitance | Within specified tolerance | Refer to document for conditions (frequency, voltage) |
| Dissipation Factor (DF) | Refer to document for limits | Refer to document for conditions |
| Insulation Resistance (IR) | Refer to document for limits | Refer to document for conditions |
| Dielectric Withstanding Voltage (DWV) | No breakdown or damage | 300% Rated Voltage (Class I), 250% Rated Voltage (Class II) for 1-5s |
| Solderability | 95% tin coverage, no visible damage | Lead/Lead-free solder bath conditions specified |
| Termination Adhesion | No visible damage | Applied force and time specified by size |
| Resistance to Soldering Heat | Electrical performance within limits, 95% tin coverage, no visible damage | Solder bath conditions and recovery time specified |
| Resistance to Flexure of Substrate | C/C 10%, no visible damage | Bending test on PCB |
| Moisture Resistance (Steady State) | C/C within limits, DF 2x initial, IR within limits, no visible damage | 402, 90%~95%RH for 500h |
| Temperature Cycle | C/C within limits | 5 cycles of -55 to +125 (or other specified temperatures) |
| Durability | C/C within limits, DF 2x initial, IR within limits, no visible damage | 1.5x Rated Voltage at elevated temperature for 1000h |
Storage and Handling Precautions
Storage Methods: Guaranteed solderability for 6 months under specified conditions (5~40, 20%~70% RH).
Precautions for Use: MLCCs can fail in short or open circuits. Avoid operating outside specified conditions to prevent fire, burning, or explosion. Follow all safety precautions and consult technical documentation.
Soldering: Adhere to recommended temperature profiles (Reflow, Wave, Hand Soldering) to prevent cracking or damage. Ensure optimal solder amount for reliable connections.
Typical Characteristic Data
Includes |Z|-Frequency Characteristics, Temperature Characteristics, and DC Bias Characteristics curves (for reference only).
2410121645_Chinocera-HGC0402R5225M250NTEJ_C7472953.pdf
Please Use Our Online Inquiry Contact Form Below If You Have Any Questions, Our Team Will Get Back To You As Soon As Possible
