• Series: HGC
• Size (inch/mm): 0201 (0603), 0402 (1005), 0603 (1608), 0805 (2012), 1206 (3216), 1210 (3225)
• Dielectric: R5=X5R, R7=X7R, G0=C0G
• Capacitance: e.g., 104=100nF, 105=1F, 106=10F
• Tolerance: A=0.05pF, B=0.1pF, C=0.25pF, D=0.5pF, F=1%, G=2%, J=5%, K=10%, L=15%, M=20%, S=-20%~+50%
• Rated Voltage (Vdc): 4R0=4V, 6R3=6.3V, 100=10V, 160=16V, 250=25V, 500=50V, 101=100V, etc.
• Termination: N=Cu/Ni/Sn
• Packaging: T=Paper taping, B=Bulk, S=Embossed taping
• Thickness (mm): A=0.1mm, B=0.2mm, C=0.3mm, D=0.4mm, E=0.5mm, F=0.6mm, G=0.7mm, H=0.8mm, J=1.0mm, L=1.25mm, P=1.6mm, U=2.0mm, V=2.5mm, W=3.0mm
• Reel Size: J=7 Inch, D=13 Inch

Soldering Method: R=Reflow Soldering, W=Wave Soldering

C0G, C0H Dielectric: (See detailed table in source document for specific size/voltage/capacitance combinations)

X7R Dielectric: (See detailed table in source document for specific size/voltage/capacitance combinations)

X7S Dielectric: (See detailed table in source document for specific size/voltage/capacitance combinations)

X5R Dielectric: (See detailed table in source document for specific size/voltage/capacitance combinations)

X6S Dielectric: (See detailed table in source document for specific size/voltage/capacitance combinations)

• Appearance & Electrical Performance Test: Includes visual inspection, dimensional checks, capacitance, and Dissipation Factor (DF) measurements.
• Insulation Resistance (IR): Specified minimum values based on dielectric type and capacitance.
• Dielectric Withstanding Voltage (DWV): No breakdown or damage at specified test voltages (300% of rated voltage for Class I, 250% for Class II).
• Solderability: Minimum 95% tin coverage on terminals.
• Termination Adhesion: Withstands specified force for a set duration.
• Resistance to Soldering Heat: Electrical performance and appearance requirements after exposure to soldering temperatures.
• Resistance to Flexure of Substrate: Capacitance change and appearance after bending test.
• Moisture Resistance (Steady State): Capacitance, DF, IR, and appearance after 500 hours at 40C/90-95% RH.
• Temperature Cycle: Capacitance change and appearance after 5 cycles between -55C and specified upper limits.
• Durability: Capacitance, DF, IR, and appearance after 1000 hours of operation at rated voltage and elevated temperatures.

• Guaranteed Solderability Period: 6 months (under delivered package condition).
• Storage Conditions: Temperature: 5C~40C, Relative Humidity: 20%~70%.

• MLCCs may fail in short or open circuits. Severe conditions beyond ratings can cause fire, burning, or explosion. Follow specifications and contact technical department for clarification.
• Soldering Conditions: Follow recommended temperature profiles to avoid cracking or explosion due to sudden temperature changes.
• Manual Soldering: Handle with care to avoid thermal shock. Pay attention to soldering iron tip selection and temperature control. Avoid direct contact of the iron tip with the ceramic body.
• Optimum Solder Amount: Ensure appropriate solder amount for reflow and wave soldering to avoid chip damage or poor connection.
• Recommended Soldering Temperature Profiles: Refer to provided graphs for Reflow Soldering (Lead-free and SnPb) and Wave Soldering.
• Hand Soldering Conditions: Specific parameters for preheating, iron tip temperature, power, diameter, and soldering time are provided. Avoid direct contact between soldering iron head and ceramic components.

• |Z|-Frequency Characteristics Curve
• Temperature Characteristics
• DC Bias Characteristics