Product Overview
The Hongming Huaci Technology Multilayer Ceramic Capacitors (MLCC) are designed for high-density, high-efficiency SMT applications. These general-purpose series capacitors are available in a wide range of sizes from 0201 to 1210 and offer excellent electrical performance and high reliability. They are manufactured using NP0 (C0G/C0H), X7R, X5R, X7S, and X6S dielectric materials. Key features include a broad selection of available sizes and high capacitance for their given dimensions. Applications span general digital circuits, power supply bypass, consumer electronics, and the telecommunication industry.
Product Attributes
- Brand: Hongming Huaci Technology ()
- Series: General Purpose Series (4V~63V)
- Origin: Suining, China
- Dielectric Materials: NP0 (C0G/C0H), X7R, X5R, X7S, X6S
Technical Specifications
| Category | Specification | Details |
|---|---|---|
| Product Name | Multilayer Ceramic Capacitors | |
| Series | General Purpose Series | (4V~63V) |
| Available Sizes | 0201 to 1210 | |
| Supplier | Suining Hongming Huaci Technology Co., Ltd. | |
| Issue Date | 20201116 | |
| Model Designation | HGC [Size] [Dielectric] [Capacitance] [Tolerance] [Rated Voltage] [Termination] [Packaging] [Thickness Code] [Reel Size] | |
| Size (Inch/mm) | 0201 | (0603) |
| 0402 | (1005) | |
| 0603 | (1608) | |
| 0805 | (2012) | |
| 1206 | (3216) | |
| 1210 | (3225) | |
| 1812 | (Not explicitly detailed in size table, but implied in packaging) | |
| Dielectric Material | NP0 (C0G/C0H) | Temperature Coefficient: 0 30 ppm/ (C0G), 0 60 ppm/ (C0H); Operating Temp: -55125 |
| X7R | Temperature Coefficient: 15%; Operating Temp: -55125 | |
| X5R | Temperature Coefficient: 15%; Operating Temp: -5585 | |
| X7S | Temperature Coefficient: 22%; Operating Temp: -55125 | |
| X6S | Temperature Coefficient: 22%; Operating Temp: -55105 | |
| Rated Voltage (VDC) | 4V | (4R0) |
| 6.3V | (6R3) | |
| 10V | (100) | |
| 16V | (160) | |
| 25V | (250) | |
| 50V | (500) | |
| 100V | (101) | |
| 200V | (201) | |
| 250V | (251) | |
| 500V | (501) | |
| Termination Type | Cu/Ni/Sn | (N) |
| Packaging | Paper Taping | (T) |
| Bulk | (B) | |
| Embossed Taping | (S) | |
| Thickness Codes (mm) | 0.1mm (A), 0.2mm (B), 0.3mm (C), 0.4mm (D), 0.5mm (E), 0.6mm (F), 0.7mm (G), 0.8mm (H), 1.0mm (J), 1.25mm (L), 1.6mm (P), 1.8mm (S), 2.0mm (U), 2.5mm (V), 3.0mm (W) | |
| Reel Size | 7 Inch | (J, K) |
| 13 Inch | (D) | |
| Soldering Method | Reflow Soldering | (R) |
| Wave Soldering | (W) | |
| Capacitance Range & Voltage | Detailed tables provided for C0G/C0H, X7R, X7S, X5R, X6S dielectrics across various sizes and rated voltages. | |
| Reliability Test Items | Appearance, Size, Capacitance, Dissipation Factor (DF), Insulation Resistance (IR), Dielectric Withstanding Voltage (DWV), Solderability, Termination Adhesion, Resistance to Soldering Heat, Resistance to Flexure of Substrate, Moisture Resistance (Steady State), Temperature Cycle, Durability. | |
| Storage Method | Guaranteed solderability for 6 months. Storage Conditions: Temperature 5~40, Relative Humidity 20%~70%. | |
| Precautions for Use | Potential for failure in short/open circuits, fire, burning, or explosion under severe conditions. Adherence to specifications and contact with technical department for unclear matters. Careful soldering practices recommended to avoid thermal cracks and damage. Proper solder amount and temperature profiles are crucial. | |
| Soldering Profiles | Detailed temperature profile charts for Reflow Soldering (Lead/Lead-free) and Wave Soldering. Hand soldering conditions also specified. | |
| Typical Characteristic Data | Includes |Z|-Frequency Characteristics, Temperature Characteristics, and DC Bias Characteristics curves (for reference only). | |
2410121645_Chinocera-HGC1210R5226K250NSVK_C7472978.pdf
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