Product Overview
The HHV series of Multilayer Ceramic Capacitors (MLCCs) from Suining Hongming Huaci Technology Co., Ltd. are designed for high-density, high-efficiency surface mount applications. These capacitors are manufactured using NP0 (C0G, C0H) and X7R materials, offering superior electrical performance and high reliability. They are suitable for mid-to-high voltage applications ranging from 100V to 3000V, with case sizes from 0402 to 1812. Key features include high voltage capability in a given case size, high stability, and reliability. Applications include analog and digital modems, LAN/WAN interface circuits, voltage multipliers, DC-DC converters, and back-lighting inverter circuits.
Product Attributes
- Brand: HHV Series
- Manufacturer: Suining Hongming Huaci Technology Co., Ltd.
- Origin: China
- Materials: NP0 (C0G, C0H), X7R
Technical Specifications
| Category | Specification | Details |
|---|---|---|
| Product Type | Multilayer Ceramic Capacitors | Mid-High Volts Series (100V~3000V) |
| Series | HHV | High Voltage Series |
| Case Sizes | 0402 ~ 1812 | (1005 ~ 4532) |
| Rated Voltage | 100Vdc to 3000Vdc | (e.g., 101=100Vdc, 302=3kVdc) |
| Capacitance Range | 0.5pF to 100F (depending on dielectric and size) | (e.g., 0R5=0.5pF, 105=1F) |
| Dielectric Materials | NP0 (C0G/C0H), X7R | |
| Temperature Characteristics | C0G/C0H: 0 30 ppm/ (-55125) X7R: 15% (-55125) | |
| Dimensions (mm) | 0402 (1005): L 1.000.05, W 0.500.05, T 0.500.05 0603 (1608): L 1.600.20, W 0.800.20, T 0.800.20 0805 (2012): L 2.000.20, W 1.250.20, T 0.700.10 to 0.800.20 1206 (3216): L 3.200.20, W 1.600.20, T 0.800.20 to 1.600.20 1210 (3225): L 3.200.30, W 2.500.20, T 1.250.20 to 2.500.20 1808 (4520): L 4.50.40, W 2.00.25, T 1.250.20 to 2.000.20 1812 (4532): L 4.50.40, W 3.20.30, T 1.250.20 to 2.500.30 | |
| Soldering Method | Reflow Soldering (R), Wave Soldering (W) | |
| Packaging | Paper Taping, Embossed Taping, Bulk | (7" Reel, 13" Reel) |
| Reliability Test Items | Appearance, Dimensions, Capacitance, DF, IR, DWV, Solderability, Termination Adhesion, Resistance to Soldering Heat, Resistance to Flexure, Moisture Resistance, Temperature Cycle, Durability | (Details in document) |
| Storage Conditions | Temperature: 5~40, Relative Humidity: 20%~70% | Guaranteed solderability period: 6 months |
Note: Technical specifications are subject to change without notice. Please refer to the latest product documentation for the most up-to-date information.
2410121646_Chinocera-HHV1206R7103K101NTHJ_C5186825.pdf
Please Use Our Online Inquiry Contact Form Below If You Have Any Questions, Our Team Will Get Back To You As Soon As Possible
