Product Overview
The Suining Hongming Huaci Technology Co., Ltd. Multilayer Ceramic Capacitors (MLCC) are designed for high-density, high-efficiency surface-mount applications. These capacitors are manufactured using NP0 (C0G, C0H), X7R, X5R, X7S, and X6S dielectric materials, offering superior electrical performance and high reliability. They are suitable for general digital circuits, power supply bypass, consumer electronics, and telecommunication industries. Available in a wide range of sizes from 0201 to 1210, these capacitors provide high capacity in a small form factor.
Product Attributes
- Brand: HGC
- Supplier: Suining Hongming Huaci Technology Co., Ltd.
- Series: General Purpose Series (4V~63V)
- Dielectric Materials: NP0 (C0G/C0H), X7R, X5R, X7S, X6S
Technical Specifications
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| General Information |
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| Features |
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| Applications |
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| How to Order | HGC [Series] [Size] [Dielectric] [Capacitance] [Tolerance] [Rated Voltage] [Termination] [Packaging] [Thickness Code] [Reel Size] Example: HGC 0805 R7 104 K 500 N T H J | ||||||||||||||||||||||||||||||||||||||||||
| Temperature Coefficient / Characteristics |
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| External Dimensions and Structure |
Soldering Method: R=Reflow Soldering, W=Wave Soldering | ||||||||||||||||||||||||||||||||||||||||||
| Packaging Standard Quantity |
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| Capacitance Range and Rated Voltage | 8-1 C0G, C0H Dielectric (See attached table for detailed ranges) 8-2 X7R Dielectric (See attached table for detailed ranges) 8-3 X7S Dielectric (See attached table for detailed ranges) 8-4 X5R Dielectric (See attached table for detailed ranges) 8-5 X6S Dielectric (See attached table for detailed ranges) | ||||||||||||||||||||||||||||||||||||||||||
| Reliability Test | 9-1 Appearance and Electrical Performance Test: Includes tests for appearance, size, capacitance, dissipation factor, and insulation resistance with specified technical requirements and test methods. 9-2 Reliability Test: Includes tests for insulation resistance, dielectric withstanding voltage, solderability, termination adhesion, resistance to soldering heat, resistance to flexure of substrate, moisture resistance (steady state), temperature cycle, and durability, each with defined technical requirements and test methods. | ||||||||||||||||||||||||||||||||||||||||||
| Package | 10-1 Paper Taping: Dimensions for 0201, 0402, 0603, 0805, 1206 types. 10-2 Embossed Taping: Dimensions for 0805~1812 type. 10-3 Reel Dimensions: Available in 7" and 13" reel sizes. 10-4 Taping Specification: Includes top tape peeling strength requirements. | ||||||||||||||||||||||||||||||||||||||||||
| Storage Methods | Guaranteed solderability for 6 months under specified storage conditions.
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| Precautions For Use | MLCCs may fail in short or open circuits. Operating outside specified conditions can lead to fire, burning, or explosion. Follow specifications and contact technical department for any uncertainties. 12-1 Soldering Profile: Refer to temperature curve charts to avoid cracking or local explosion due to sudden temperature changes. 12-2 Manual Soldering: Handle with care to avoid thermal cracks and damage. Pay attention to soldering iron tip selection and temperature control. 12-3 Optimum Solder Amount: Proper solder amount is crucial for connection integrity and preventing chip damage. 12-4 Recommended Soldering Amounts: Optimal fillet amounts for reflow, wave, and rework soldering. 12-5 Recommended Soldering Temperature Profile: Includes profiles for Lead-free and SnPb Reflow Soldering, Wave Soldering, and Hand Soldering. | ||||||||||||||||||||||||||||||||||||||||||
| Typical Characteristic Data Graph |
Note: The above product characteristics are for reference only. |
2507111630_Chinocera-HGC0402R5224K500NTEJ_C49333232.pdf
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