Product Overview
The Suining Hongming Huaci Technology Co., Ltd. Multilayer Ceramic Capacitors (MLCCs) are designed for high-density, high-efficiency surface-mount applications. Available in the General Purpose Series (4V~63V) and covering sizes from 0201 to 1210, these capacitors are manufactured with NP0 (C0G, C0H), X7R, X5R, X7S, and X6S dielectrics, offering superior electrical performance and high reliability. They are suitable for general digital circuits, power supply bypass, consumer electronics, and telecommunication industries.
Product Attributes
- Brand: HGC
- Supplier: Suining Hongming Huaci Technology Co., Ltd.
- Series: General Purpose Series (4V~63V)
- Dielectric Materials: NP0 (C0G/C0H), X7R, X5R, X7S, X6S
Technical Specifications
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| General Information |
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| How to Order (Model Representation) | HGC [Series] [Size] [Dielectric] [Capacitance] [Tolerance] [Rated Voltage] [Termination] [Packaging] [Thickness Code] [Reel Size] Example breakdown provided in the source document for each component of the model number. | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Temperature Coefficient / Characteristics |
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| External Dimensions and Structure | Product Peripheral Dimensions:
Structure: (Diagrammatic representation intended, details not textual) | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Packaging Standard Quantity |
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| Capacitance Range and Rated Voltage | C0G, C0H Dielectric: (Detailed table provided in source for various sizes and voltages) X7R Dielectric: (Detailed table provided in source for various sizes and voltages) X7S Dielectric: (Detailed table provided in source for various sizes and voltages) X5R Dielectric: (Detailed table provided in source for various sizes and voltages) X6S Dielectric: (Detailed table provided in source for various sizes and voltages) | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Reliability Test | Appearance and Electrical Performance Test:
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| Packaging | Paper Taping Dimensions: (Detailed dimensions for 0201, 0402, 0603, 0805, 1206 types provided in mm) Embossed Taping Dimensions: (Detailed dimensions for 0805~1812 types provided in mm) Reel Dimensions: (7 and 13 reels specified in mm) Taping Specification: Top tape peeling strength: 0.1N < peeling strength < 0.7N. | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Storage Methods | Guaranteed period for solderability is 6 months (under delivered package condition). Storage Conditions: Temperature: 5C~40C; Relative Humidity: 20%~70%. | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Precautions For Use | MLCCs may fail in short or open circuit. Severe conditions beyond ratings can cause burn out, flaming, or explosion. Follow specifications and contact technical department for clarification. Soldering Profile: Follow temperature curve charts to avoid cracking or explosion due to sudden temperature changes. Manual Soldering: Handle with care to avoid thermal cracks and damage. Pay attention to soldering iron tip selection and temperature control. Optimum Solder Amount: (Diagrams illustrating too much, too little, and optimal solder amounts for reflow and wave soldering) Recommended Soldering Temperature Profile: (Graphs for Lead-free and SnPb Reflow Soldering, Wave Soldering, and Hand Soldering conditions provided) Temperature Differential (T): Specified for different capacitor types during preheating for reflow and wave soldering. Hand Soldering Conditions: Preheating T 130C, Max temp 350C, Max power 20W, Recommended tip diameter 1mm, Max soldering time 3s, Solder paste amount 1/2 chip thickness. Avoid direct contact with ceramic components. | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Typical Characteristic Data Graph |
Note: The above product characteristics are for reference only. |
2507111630_Chinocera-HGC0805R5107M6R3NSLJ_C49333236.pdf
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