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quality Chinocera HGC0402R5475M100NTEJ Multilayer Ceramic Capacitors Featuring X7R X5R Dielectrics for Electronic Circuit factory
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quality Chinocera HGC0402R5475M100NTEJ Multilayer Ceramic Capacitors Featuring X7R X5R Dielectrics for Electronic Circuit factory
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Specifications
Voltage Rating:
10V
Capacitance:
4.7uF
Temperature Coefficient:
X5R
Tolerance:
±20%
Mfr. Part #:
HGC0402R5475M100NTEJ
Package:
0402
Key Attributes
Model Number: HGC0402R5475M100NTEJ
Product Description

Product Overview

The Hongming Huaci Technology Multilayer Ceramic Capacitors (MLCC) are designed for high-density, high-efficiency SMT applications. These capacitors are manufactured using NP0 (C0G/C0H), X7R, X5R, X7S, and X6S dielectric materials, offering superior electrical performance and high reliability. Available in a wide range of sizes from 0201 to 1210, they provide high capacitance in compact dimensions.

Key applications include general digital circuits, power supply bypass, consumer electronics, and telecommunication industries.

Product Attributes

  • Brand: Hongming Huaci Technology (HGC)
  • Origin: Suining, China
  • Dielectric Materials: NP0 (C0G/C0H), X7R, X5R, X7S, X6S
  • Series: General Purpose Series (4V~63V)

Technical Specifications

Category Specification Details
Product Identification Supplier Suining Hongming Huaci Technology Co., Ltd.
Version HC202002
Product Details Part Name Multilayer Ceramic Capacitors
Series General Purpose Series (4V~63V)
Specification 0201 ~ 1210 Size
Features Size Range 0201 to 1210
Capacity High capacity and small size achievable
Applications General Digital Circuit
Power Supply Bypass
Consumer Electronics
Telecommunication
Ordering Code Breakdown Series HGC
Size (inch/mm) 0201 (0603) to 1210 (3225)
Dielectric Material R5=X5R, R7=X7R, G0=C0G
Capacitance 0R3 (0.3pF) to 100F (107)
Tolerance A=0.05pF to S=-20%~+50%
Rated Voltage (Vdc) 4R0 (4V) to 631 (630V)
Termination Type N=Cu/Ni/Sn, C=Cu/Resin/Ni/Sn
Packaging T=Paper taping, B=Bulk, S=Embossed taping
Thickness (mm)/Code A=0.1mm to W=3.0mm
Reel Size J=7Inch, D=13Inch
Soldering Method R=Reflow Soldering, W=Wave Soldering
Termination Width (MB) 0.15mm to 2.50mm (Varies by size)
Temperature Coefficient / Characteristics Dielectric Reference Temp. Temp. Coefficient Operating Temp. Range
C0G 20C 30 ppm/ -55C ~ 125C
X7R 20C 15% -55C ~ 125C
X5R 20C 15% -55C ~ 85C
X7S 20C 22% -55C ~ 125C
External Dimensions Size (inch/mm) Length L (mm) Width W (mm) Thickness T (mm)/Code
0201 (0603) 0.600.03 0.300.03 0.300.03 (C)
0402 (1005) 1.000.05 0.500.05 0.500.05 (E)
0603 (1608) 1.600.20 0.800.20 0.800.20 (H)
0805 (2012) 2.000.20 1.250.20 0.700.10 (G) / 0.800.20 (H) / 1.250.20 (L)
1206 (3216) 3.200.20 1.600.20 0.700.10 (G) / 0.800.20 (H) / 1.000.10 (J) / 1.250.20 (L) / 1.600.20 (P)
1210 (3225) 3.200.30 2.500.30 1.250.20 (L) / 1.600.20 (P) / 2.000.20 (U) / 2.500.30 (V)
Packaging Standard Quantity Size Thickness (mm)/Symbol Paper Tape (7" reel) Plastic Tape (7" reel)
0201 (0603) 0.300.03 (C) 15,000 -
0402 (1005) 0.500.05 (E) 10,000 -
0603 (1608) 0.800.20 (H) 4000 -
0805 (2012) 0.700.10 (G) / 0.800.20 (H) 4000 2000/3000 (L)
1206 (3216) 0.700.10 (G) / 0.800.20 (H) 4000 3000 (J, L) / 2000 (P)
1210 (3225) 1.250.20 (L) / 1.600.20 (P) / 2.000.20 (U) / 2.500.30 (V) - 2000 (L, P, U) / 1000 (V)
Capacitance Range and Rated Voltage Dielectric Size Rated Voltage (VDC) Capacitance
C0G / C0H 0201 to 1210 16V to 630V (varies by size and capacitance) 0.3pF to 0.10F (varies by size and voltage)
X7R 0201 to 1210 6.3V to 50V (varies by size and capacitance) 100pF to 47F (varies by size and voltage)
X7S 0402 to 1210 6.3V to 100V (varies by size and capacitance) 1.0F to 100F (varies by size and voltage)
X5R 0201 to 1210 4V to 50V (varies by size and capacitance) 100pF to 220F (varies by size and voltage)
X6S 0402 to 1210 4V to 50V (varies by size and capacitance) 0.10F to 220F (varies by size and voltage)
Reliability Test Item Technical Requirements Test Method
Appearance No remarkable defects or abnormalities. Microscope (10)
Size Within specified size range. Vernier caliper
Capacitance Class I: Within specified tolerance. Class II: Within specified tolerance. Test temp: 253; Conditions vary by capacitance value.
Dissipation Factor (DF, tan) Class I: Varies by capacitance. Class II: Varies by size, voltage, and capacitance. Test temp: 253; Conditions vary by capacitance value.
Insulation Resistance (IR) Class I: Varies by capacitance. Class II: Varies by capacitance. Test temp: 253; Humidity: 75%
Dielectric Withstanding Voltage (DWV) No breakdown or damage. Class I: 300% rated voltage; Class II: 250% rated voltage. Duration: 1~5s.
Solderability 95% tinning rate, no visible damage. Lead-free: 2455, 20.5s. Leaded: 2355, 20.5s.
Termination Adhesion No visible damage. Force varies by size (2N to 10N). Time: 101s.
Resistance to Soldering Heat C/C, DF, IR within limits. Appearance: no visible damage. Solder temp: 2655, Duration: 101s. Recovery: 242h.
Resistance to Flexure of Substrate C/C 10%; Appearance: no visible damage. Flexure: 1mm. Holding time: 51s.
Moisture Resistance (Steady State) C/C: Class I 2% or 1pF; Class II 10%. DF 2x initial. IR within limits. Temp: 402, Humidity: 90%~95%RH, Duration: 500h. Recovery: 242h.
Temperature Cycle C/C: Class I 1% or 1pF; Class II 10%. 5 cycles: -55 to +125 (or other class limits). Recovery: 242h.
Durability C/C: Class I 2% or 1pF; Class II 20%. DF 2x initial. IR within limits. Applied Voltage: 1.5x rated voltage. Temp: 85 to 125. Duration: 1000h. Recovery: 242h.
Packaging Structure Paper Taping Dimensions Details for 0201, 0402, 0603, 0805, 1206 sizes. (Dimensions in mm)
Embossed Taping Dimensions Details for 0805~1812 sizes. (Dimensions in mm)
Reel Dimensions 7" and 13" reels available. (Dimensions in mm)
Top Tape Peeling Strength Paper Taping: 0.1N < strength < 0.7N. Embossed Taping: 0.1N < strength < 0.7N.
Storage Methods Guaranteed solderability period: 6 months. Temperature: 5~40. Relative Humidity: 20%~70%.
Precautions For Use MLCCs may fail in short/open circuit. Risk of fire, burn, or explosion under severe conditions. Follow specifications. Contact technical department for unclear points.
Soldering Profile Recommended temperature profiles for Reflow Soldering, Wave Soldering, and Hand Soldering. Minimize temperature differential (T).
Typical Characteristic Data |Z|-Frequency Characteristics, Temperature Characteristics, DC Bias Characteristics. For reference only.

2410121645_Chinocera-HGC0402R5475M100NTEJ_C7472957.pdf

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